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XC6121E216MR-G

XC6121E216MR-G DataSheet Torex Semiconductor Voltage Detector with Watchdog Function and ON/OFF Control (VDF=1.6V~5.0V)

Voltage Detector with Watchdog Function ON/OFF Control (VDF=1.6V~5.0V)

Torex Semiconductor

473.011 Kb

23 Pages

Maker Site:
http://www.torex.co.jp/

Torex Semiconductor

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---Full Text Search Engine--- Voltage Detector with Watchdog Function ON/OFF Control (VDF=1.6V~5.0V)

XC6121C550ER-G XC6121A716ER-G XC6121A716MR-G XC6121D716ER-G
XC6121D716MR-G XC6121F550ER-G XC6121F550MR-G XC6121A350ER-G
XC6121C616ER-G XC6121E216ER-G XC6121E216MR-G

XC6121/XC6122 XC6123/XC6124 Series
GENERAL DESCRIPTION
ETR0209-010a
Voltage Detector with Watchdog Function and ON/OFF Control (VDF=1.6V~5.0V)
The XC6121/XC6122/XC6123/XC6124 series are groups of high-precision, low current consumption voltage detectors with watchdog functions incorporating CMOS process technology. The series consist of a reference voltage source, delay circuit, comparator, and output driver. With the built-in delay circuit, the XC6121/XC6122/XC6123/XC6124 series' ICs do not require any external components to output signals with release delay time. The output type is VDFL low when detected. With the XC6121/XC6122/XC6123/XC6124 series' ICs, the EN/ENB pin can control ON and OFF of the watchdog functions. By setting the EN/ENB pin to low or high level, the watchdog function can be OFF while the voltage detector remains operation. Since the EN/ENB pin of the XC6122 and XC6124 series is internally pulled up to the VIN pin or pulled down to the VSS pin, the ICs can be used with the EN/ENB pin left open, when the watchdog functions is used. The detect voltages are internally fixed 1.6V ~ 5.0V in increments of 0.1V, using laser trimming technology. Six watchdog timeout period settings are available in a range from 50ms to 1.6s. Five release delay time settings are available in a range from 3.13ms to 400ms.
APPLICATIONS
Microprocessor watchdog monitoring and reset circuits Memory battery backup circuits System power-on reset circuits Power failure detection
FEATURES
Detect Voltage Range Hysteresis Width Operating Voltage Range Detect Voltage Temperature Characteristics : +100ppm/OC (TYP.) Output Configuration : N-channel open drain Watchdog Pin : Watchdog input If watchdog input maintains `H' or `L' within the watchdog timeout period, a reset signal is output from the RESETB pin. EN/ENB Pin : When the EN/ENB pin voltage is set to low or high level, the watchdog function is forced off. Release Delay Time : 400ms, 200ms, 100ms, 50ms, 3.13ms (TYP.) Watchdog Timeout Period : 1.6s, 800ms, 400ms, 200ms, 100ms, 50ms (TYP.) : SOT-25, USP-6C Package Environmentally Friendly : EU RoHS Compliant, Pb Free : 1.6V ~ 5.0V, +2% (0.1V increments) : VDFL x 5% (TYP.) : 1.0V ~ 6.0V
TYPICAL APPLICATION CIRCUIT TYPICAL PERFORMANCE CHARACTERISTICS
Supply Current vs. Input Voltage
(VDF=.
14.0 Ta=85 (A) Supply Current:I
SS
12.0 10.0 8.0 6.0 4.0 2.0 0 0 1 2 3 4 Input Voltage:V IN (V) 5 6 Ta=25 Ta=-40
1/23
XC6121/XC6122/XC6123/XC6124 Series
PIN CONFIGURATION
SOT-25 (TOP VIEW)
USP-6C (BOTTOM VIEW)
* The dissipation pad for the USP-6C package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the VSS (No. 5) pin.
PIN ASSIGNMENT
PIN NUMBER SOT-25 1 2 3 4 5 USP-6C 4 5 2 1 6 3 PIN NAME RESETB VSS EN/ENB WD VIN NC FUNCTION Reset Output Ground Watchdog ON/OFF Control Watchdog Power Input No Connection
2/23
XC6121/XC6122/XC6123/XC6124
Series
PRODUCT CLASSIFICATION
Selection Guide
RESET OUTPUT SERIES XC6121 XC6122 XC6123 XC6124 VDFL (RESETB) N-channel open drain N-channel open drain N-channel open drain N-channel open drain VDFH (RESET) Available: VDFL x 5% (TYP.) HYSTERESIS EN/ENB PIN FUNCTION (EN/ENB INPUT LOGIC*, PULL-UP OR DOWN RESISTOR)
EN with No Pull-Up Resistor
EN with Pull-Up Resistor
ENB with No Pull-Down Resistor
ENB with Pull-Down Resistor
* EN input logic: The watchdog function turns on when the EN pin becomes high level. * ENB input logic: The watchdog function turns on when the ENB pin becomes low level.
Ordering Information
XC6121-(*1): N-channel Open Drain Output (RESETB), EN Pin: No Pull-Up Resistor XC6122-(*1): N-channel Open Drain Output (RESETB), EN Pin: Pull-Up Resistor XC6123-(*1): N-channel Open Drain Output (RESETB), ENB Pin: No Pull-Down Resistor XC6124-(*1): N-channel Open Drain Output (RESETB), ENB Pin: Pull-Down Resistor DESIGNATOR DESCRIPTION SYMBOL A C  Release Delay Time D E F 2 3  Watchdog Timeout Period 4 5 6 7  Detect Voltage 16 ~ 50 MR - Packages Taping Type (*2) MR-G ER ER-G
ex.) XC6121D327MR or XC6121D627MR
(*1) (*2)
DESCRIPTION 3.13ms (TYP.) 50ms (TYP.) 100ms (TYP.) 200ms (TYP.) 400ms (TYP.) 50ms (TYP.) 100ms (TYP.) 200ms (TYP.) 400ms (TYP.) 1.6s (TYP.) 800ms (TYP.) Detect voltage ex.) 4.5V: 4, 5 SOT-25 SOT-25 USP-6C USP-6C
* Please set the release delay time shorter than or equal to the watchdog timeout period.
The "-G" suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. The device orientation is fixed in its embossed tape pocket. For reverse orientation, please contact your local Torex sales office or representative. (Standard orientation: R-, Reverse orientation: L-)
3/23
XC6121/XC6122/XC6123/XC6124 Series
BLOCK DIAGRAMS
XC6121 Series
N-ch Open Drain Output
XC6122 Series
N-ch Open Drain Output
4/23
XC6121/XC6122/XC6123/XC6124
Series
BLOCK DIAGRAMS (Continued)
XC6123 Series
N-ch Open Drain Output
XC6124 Series
N-ch Open Drain Output
5/23
XC6121/XC6122/XC6123/XC6124 Series
ABSOLUTE MAXIMUM RATINGS
Ta = 25OC PARAMETER Input Voltage Output Current Output Voltage Power Dissipation SOT-25 USP-6C SYMBOL VIN EN/ENB WD IOUT RESETB Pd Topr Tstg RATINGS VSS -0.3 ~ 7.0 VSS-0.3VIN+0.37.0 VSS -0.3 ~ 7.0 20 VSS -0.3 ~ 7.0 250 100 -40 ~ +85 -55 ~ +125 UNITS V V V mA V mW
O O
Operational Temperature Range Storage Temperature Range
C C
6/23
XC6121/XC6122/XC6123/XC6124
Series
ELECTRICAL CHARACTERISTICS
PARAMETER Detect Voltage Hysteresis Width Supply Current (*1) Operating Voltage Output Current Temperature Characteristics SYMBOL VDFL VHYS ISS VIN IRBOUT VDFL / MIN. TYP. VDFL(T) VDFL(T) EN=VSS,ENB=VIN x 0.98 VDFL VDFL x 0.02 x 0.05 VIN=VDFL(T)x0.9V 5 the WD Pin: VIN=VDFL(T)x1.1V 10 OPEN 12 VIN=6.0V 1.0 VIN=1.0V 0.15 0.5 VIN=2.0V (VDFL(T)> 2.0V) 2.0 2.5 N-ch. VDS = 0.5V VIN=3.0V (VDFL(T) >3.0V) 3.0 3.5 VIN=4.0V (VDFL(T) >4.0V) 3.5 4.0 -40OC < Topr < 85 OC Time until VIN is increased from 1.0V to 2.0V and attains to the release time level, and the Reset output pin releases. 2.00 37 75 150 300 2.00 37 75 150 300 37 75 150 300 600 1200 37 75 150 300 600 1200 +100 3.13 50 100 200 400 3.13 50 100 200 400 5.5 0.01 50 100 200 400 800 1600 50 100 200 400 800 1600 CONDITIONS MAX. VDFL(T) x 1.02 VDFL x 0.08 11 16 18 6.0 5.00 63 125 250 500 5.00 63 125 250 500 33 0.1 63 125 250 500 1000 2000 63 125 250 500 1000 2000 V V A V
Ta = 25 OC UNITS
CIRCUIT
   
mA

Topr VDFL 
ppm/ OC

Release Delay Time (VDFL<1.8V)
tDR
ms

Release Delay Time (VDFL>1.9V)
tDR
Time until VIN is increased from 1.0V to (VDFL x 1.1V) and attains to the release time level, and the Reset output pin releases. Time until VIN is decreased from 6.0V to 1.0V and attains to the detect voltage level, and the Reset output pin detects while the WD pin left open. VIN=6.0V, RESETB=6.0V
ms

Detect Delay Time VDFL Leak Current
tDF ILEAK
s A
 
Watchdog Timeout Period (VDFL<1.8V)
tWD
Time until VIN increases form 1.0V to 2.0V and the Reset output pin is released to go into the detection state. (WD=VSS)
ms

Watchdog Timeout Period (VDFL>1.9V)
tWD
Time until VIN increases from 1.0V to (VDFLx1.1V) and the Reset output pin is released to go into the detection state. (WD=VSS)
ms

7/23
XC6121/XC6122/XC6123/XC6124 Series
ELECTRICAL CHARACTERISTICS (Continued)
PARAMETER Watchdog Minimum Pulse Width SYMBOL TWDIN CONDITIONS VIN=6.0V, Apply pulse from 6.0V to 0V to the WD pin. VIN=VDFL x 1.1V ~ 6.0V VIN=VDFL x 1.1V ~ 6.0V VWD=6V, RWD=VWD/IWD VIN=VDFL x 1.1V ~ 6.0V VIN=VDFL x 1.1V ~ 6.0V VIN=6.0V, EN=0V, REN=VIN / IEN VIN=6.0V, ENB=6V, RENB=VIN / IENB MIN. 300 VIN x 0.7 0 300 1.3 0 1.0 TYP. 600 1.6 MAX. 6 VIN x 0.3 1000 VIN 0.35 2.4 ns V V k V V M
Ta = 25 OC UNITS
CIRCUIT
      
Watchdog VWDH High Level Voltage Watchdog VWDL Low Level Voltage Watchdog RWD Pull-down Resistance EN/ENB VENH/VENBH High Level Voltage EN/ENB VENL/VENBL Low Level Voltage EN Pull-up REN (*2) Resistance ENB Pull-down RENB Resistance (*3)
NOTE: *: In case where no EN/ENB pin's condition written in the test condition field, EN=VIN and ENB=VSS. **: VDFL(T)=Setting detect voltage value *1: The condition when the watchdog pin is ON. The EN/ENB pin is CMOS input. For the XC6122 (pull-up resistor) and XC6124 (pull-down resistor), supply current increases in the following values when the watchdog function is OFF. XC6122 Series VIN-VEHL/1.6MTYP XC6124 SeriesVEHBH/1.6MTYP *2: For the XC6122 series only. *3: For the XC6124 series only.
8/23
XC6121/XC6122/XC6123/XC6124
Series
OPERATIONAL EXPLANATION
The XC6121/6122/6123/6124 series compare, using the error amplifier, the voltage of the internal voltage reference source with the voltage divided by R1, R2 and R3 connected to the VIN pin. The resulting output signal from the error amplifier activates the watchdog logic, delay circuit and the output driver. When the VIN pin voltage gradually falls and finally reaches the detect voltage, the RESETB pin output goes from high to low in the case of the VDFL type ICs. <RESETB / RESET Pin Output Signal> * VDFL (RESETB) type - output signal: Low when detected. The RESETB pin output goes from high to low whenever the VIN pin voltage falls below the detect voltage. The RESETB pin remains low for the release delay time (tDR) after the VIN pin voltage reaches the release voltage. If neither rising nor falling signals are applied to the WD pin within the watchdog timeout period, the RESETB pin output remains low for the release delay time (tDR), and thereafter the RESET pin outputs high level signal. <Hysteresis> When the internal comparator output is high, the NMOS transistor connected in parallel to R3 is turned ON, activating the hysteresis circuit. The difference between the release and detect voltages represents the hysteresis width, as shown by the following calculations: VDFL (detect voltage) = (R1+R2+R3) x Vref / (R2+R3) VDR (release voltage) = (R1+R2) x Vref / (R2) VHYS (hysteresis width) =VDR-VDFL (V) VDR > VDFL * Please refer to the block diagrams for R1, R2, R3 and Vref. * Hysteresis width is selectable from VDFL x 0.05V (TYP.). <Watchdog (WD) Pin> The series use a watchdog timer to detect malfunction or "runaway" of the microprocessor. If neither rising nor falling signals are applied from the microprocessor within the watchdog timeout period, the RESETB pin output maintains the detection state for the release delay time (tDR), and thereafter the RESETB pin outputs low to high signal. The watchdog pin is pulled down to the VSS internally. When the watchdog pin is not connected, A reset signal comes out after the watchdog timeout period. Six watchdog timeout period settings (tWD) are available in 1.6s, 800ms, 400ms, 200ms, 100ms, and 50ms. <EN Pin> In case where the watchdog function is not used, When the EN pin input driven to low level, only the watchdog function is forced off while the detect voltage circuit remains operation. For using the watchdog function, the EN pin should be used in high level. Even after the input voltage and the EN pin voltage are driven back high, the RESETB pin output maintains the detection state for the release delay time (TDR). (Refer to the TIMING CHART 1-.) The watchdog function recovers immediately when the input voltage becomes higher than the release voltage and the EN pin voltage driven from low to high level. (Refer to the TIMING CHART 1-.) A diode, which is an input protection element, is connected between the EN pin and VIN pin. Therefore, if the EN pin is applied voltage that exceeds VIN, the current will flow to VIN through the diode. For avoiding any damage to the IC, please use this IC within the stated maximum ratings (VSS -0.3 ~ VIN +0.3) on the EN pin. <ENB Pin> In case where the watchdog function is not used, when the ENB pin input driven to high level, only the watchdog function is forced off while the detect voltage circuit remains operation. For using the watchdog function, the ENB pin should be used in low level. Even after the input voltage and the ENB pin voltage are driven back low, the RESETB pin output maintains the detection state for the release delay time (tDR). (Refer to the TIMING CHART 2-.) The watchdog function recovers immediately when the input voltage becomes higher than the release voltage and the ENB pin voltage driven from high to low level. (Refer to the TIMING CHART 2-.) A diode, which is an input protection element, is connected between the ENB pin and VIN pin. Therefore, if the ENB pin is applied voltage that exceeds VIN, the current will flow to VIN through the diode. For avoiding any damage to the IC, please use this IC within the stated maximum ratings (VSS -0.3 ~ VIN +0.3) on the ENB pin. <Release Delay Time> Release delay time (tDR) is the time that elapses from when the VIN pin reaches the release voltage, or when the watchdog timeout period expires with no rising signal applied to the WD pin, until the RESETB pin output is released from the detection state. Five release delay time (tDR) watchdog timeout period settings are available in 400ms, 200ms, 100ms, 50ms, and
3.13ms.
<Detect Delay Time> Detect Delay Time (tDF) is the time that elapses from when the VIN pin voltage falls to the detect voltage until the RESETB pin output goes into the detection state.
9/23
XC6121/XC6122/XC6123/XC6124 Series
TIMING CHARTS
1. XC6121/XC6122 Series (EN products) N-ch Open Drain Output (Rpull=100k)
Hysteresis Width
tDF (N-ch Open Drain Output, Rpull=100k)
10/23
XC6121/XC6122/XC6123/XC6124
Series
TIMING CHARTS (Continued)
2. XC6123/XC6124 Series (ENB products) N-ch Open Drain Output (Rpull=100k)
Hysteresis Width
tDF (N-ch Open Drain Output, Rpull=100k)
11/23
XC6121/XC6122/XC6123/XC6124 Series
NOTES ON USE
1. Please use this IC within the stated maximum ratings. Operation beyond these limits may cause degrading or permanent damage to the device. 2. When a resistor is connected between the VIN pin and the input, the VIN voltage drops while the IC is operating and a malfunction may occur as a result of the IC's through current. 3. In order to stabilize the IC's operations, please ensure that the VIN pin's input frequency's rise and fall times are more than 1  s/V. 4. Noise at the power supply may cause a malfunction of the watchdog operation or the voltage detector. In such case, please strength the line between VIN and the GND pin and connect about 0.22F of a capacitor between the VIN pin and the GND pin. 5. Protecting against a malfunction while the watchdog time out period, an ignoring time (no reaction time) occurs to the rise and fall times. Referring to the figure below, the ignoring time (no reaction time) lasts for 900s at maximum. 6. The EN pin of the XC6121 series is not internally pulled up. When using the watchdog function, please drive the EN pin in high level. The EN pin of the XC6122 series is internally pulled up. The watchdog function can be used even the EN pin left open. The ENB pin of the XC6123 series is not internally pulled down. When using the watchdog function, please drive the ENB pin in low level. The ENB pin of the XC6124 series is internally pulled up. The watchdog function can be used even the ENB pin left open.
12/23
XC6121/XC6122/XC6123/XC6124
Series
PIN LOGIC CONDITIONS
PIN NAME VIN L EN/ENB H L VIN<VDFL EN/ENB>1.30V EN/ENB<0.35V WD L LH HL LOGIC H CONDITIONS VIN>VDFL+VHYS PIN NAME LOGIC H CONDITIONS The state maintaining WD>VWDH for more than TWD The state maintaining WD<VWDL for more than TWD VWDLVWDH, 300nsTWDINTWD VWDHVWDL, 300nsTWDINTWD
NOTE: VDFL: Detect Voltage VHYS: Hysteresis Range VWDH: WD High Level Voltage VWDL: WD Low Level Voltage TWDIN: WD Pulse Width TWD: WD Timeout Period For the details of each parameter, please see the electrical characteristics.
FUNCTION CHART
VIN XC6121/XC6122 EN XC6123/XC6124 ENB WD H L OPEN LH H L L H L *1 RESETB (*2)
H
H
L
Repeating detect and release (HLH) H H L
NOTE: *1: Including all logics of the WD (WD=H, L, OPEN, HL, LH). *2: When the RESETB is High, the circuit is in the release state. When the RESETB is Low, the circuit is in the detection state. *3: VIN=L and EN/ENB=H can not be combined because the rated input voltage of the EN/ENB pin is Vss-0.3V to VIN+0.3V. *4: The RESETB pin becomes indefinite operation while 0.35V<EN/ENB<1.3V. *5: The EN pin of the XC6121 series is not internally pulled up. When using the watchdog function, please drive the
EN pin in high level. The EN pin of the XC6122 series is internally pulled up. The watchdog function can be used even the EN pin left open. The ENB pin of the XC6123 series is not internally pulled down. When using the watchdog function, please drive the ENB pin in low level. The ENB pin of the XC6124 series is internally pulled up. The watchdog function can be used even the ENB pin left open.
13/23
XC6121/XC6122/XC6123/XC6124 Series
TEST CIRCUITS
Circuit 
Circuit 
Circuit 
VDS=0.5V
14/23
XC6121/XC6122/XC6123/XC6124
Series
TEST CIRCUITS (Continued)
Circuit 
Circuit 
Circuit 
15/23
XC6121/XC6122/XC6123/XC6124 Series
TEST CIRCUITS (Continued)
Circuit 
Circuit 
Note: The above reference is about the EN logic operation.
Circuit 
Note: XC6122 series has EN pin, XC6124 Series has ENB pin.
16/23
XC6121/XC6122/XC6123/XC6124
Series
TYPICAL PERFORMANCE CHARACTERISTICS
1.Supply Current vs. Input Voltage
X(VDF=.
14.0 (A) (A) 12.0 10.0 8.0 6.0 4.0 2.0 0 0 1 2 3 4 Input Voltage:V IN (V) 5 6 Ta=-40 Ta=85 14.0
(VDF=.
Ta=85 12.0 10.0 8.0 6.0 4.0 2.0 0 0 1 2 3 4 Input Voltage:V IN (V) 5 6 Ta=25 Ta=-40
SS
Supply Current:I
(VDF=.
14.0 (A) 12.0 10.0 Ta=25 8.0 6.0 4.0 2.0 0 0 1 2 3 4 Input Voltage:V IN (V) 5 6 Ta=-40 Ta=85
2.Detect, Release Voltage vs. Ambient Temperature
Supply Current:I
SS
(VDF=.
(V)
DF ,VDR
Supply Current:I
SS
Ta=25
(VDF=.
DF ,VDR
V DR 1.65
(V)
1.70
2.90
Detect, Release Voltage: V
Detect, Release Voltage: V
2.80
V DR
1.60 V DF
2.70 V DF
1.55 -50 -25 0 25 50 75 Ambient Temperature: Ta () 100
2.60 -50 -25 0 25 50 75 Ambient Temperature: Ta () 100
17/23
XC6121/XC6122/XC6123/XC6124 Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
2.Detect, Release Voltage vs. Ambient Temperature (Continued)
(VDF=.
DF ,VDR
(V)
5.30
5.20
V DR
Detect, Release Voltage: V
5.10
5.00 V DF 4.90 -50 -25 0 25 50 75 Ambient Temperature: Ta () 100
3.Nch Driver Output Current vs. VDS
30 Ta=25
4.Driver Output Current vs. Input Voltage

6.0 VDS=0.5V (mA) 5.0 4.0 3.0 2.0 1.0 0.0 Ta=85 Ta=-40 Ta=25
(mA)
25 VIN =5.0V 20 15 10 5 0 0 1 VIN =2.0V VIN =1.0V 2 V DS (V) 3 4 5 6 VIN =3.0V VIN =4.0V
OUT
Output Current: I
Output Current: I
OUT
0
1
2 3 4 Input Voltage:V IN (V)
5
6
5.Release Delay Time vs. Ambient Temperature
300 TDR=100m
DR ms

3000
DR ms
250 200 150 100 50 0 -50 -25 0 25 50 75 Ambient Temperature: Ta () 100
TDR=1600m 2500 2000 1500 1000 500 0 -50 -25 0 25 50 75 Ambient Temperature: Ta () 100
Release Delay TimeT
18/23
Release Delay TimeT
XC6121/XC6122/XC6123/XC6124
Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
6.Watchdog Timeout Period vs. Ambient Temperature

300
3000

T WD=1600m
WD Timeout PeriodTTWDms WD Timeout Piriod WD (ms)
WD Timeout PeriodT WDms WD Timeout Piriod T WD (ms)
TWD=100m 250 200 150 100 50 0 -50 -25 0 25 50 75 Ambient Temperature: Ta () 100
2500 2000 1500 1000 500 0 -50 -25 0 25 50 75 Ambient Temperature: Ta () 100
7.Release Delay Time vs. Input Voltage
4.0 3.8 3.6 3.4 3.2 3.0 2.8 2.6 0 1 2 3 4 5 Input Voltage:V IN (V) 6 7
8. Watchdog Timeout Period vs. Input Voltage

120 WD Timeout Period T WD (ms) WD Timeout Period T WDms 115 110 105 100 95 90 0 1

Ta=25 T WD=100m
Release Delay TimeT
DR ms
Ta=25 T DR=3.13m
2 3 4 5 Input Voltage:V IN (V)
6
7
9. Watchdog Low Level Threshould vs. Ambient Temperature
10.Watchdog High Level Threshould vs. Ambient Temperature

6.0
WDL(V )
6.0
WDH (V)

5.0 4.0 3.0 VIN=6.0V 2.0 1.0 VIN=1.76V 0.0 -50 -25 0 25 50 75 Ambient Temperature: Ta () 100 VIN=3.0V
5.0 VIN=6.0V 4.0 3.0 2.0 1.0 VIN=1.76V 0.0 -50 -25 0 25 50 75 Ambient Temperature: Ta () 100 VIN=3.0V
WDLowLevelThresholdV
WD Highlevel ThresholdV
19/23
XC6121/XC6122/XC6123/XC6124 Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
11.Watchdog Pull-Down Resistance vs. Ambient Temperature
)
1100 1000 900 800 700 600 500 400 300 -50

WDpull-down ResistanceR
WD
-25 0 25 50 75 Ambient Temperature: Ta ()
100
12.EN Pull-Up Resistance vs. Ambient Temperature
1
M)
13.ENB Pull-Down Resistance vs. Ambient Temperature
M)
ENB
3.0 2.4 1.8 1.2 0.6 0.0 -50 -25 0 25 50 75 Ambient Temperature: Ta () 100
3.0 2.4 1.8 1.2 0.6 0.0 -50 -25 0 25 50 75 Ambient Temperature: Ta () 100
EN
14.EN Ligh Level Voltage vs. Ambient Temperature
15.EN High Level Voltage vs. Ambient Temperature
1
1.10
E NL (V)
ENBpull-down Resistance R
EN pull-up ResistanceR
1.10
ENH (V)

1.00 0.90 0.80 0.70 0.60 VIN=1.76V 0.50 -50 -25 0 25 50 75 Ambient Temperature: Ta () 100 VIN=6.0V VIN=3.0V
1.00 0.90 0.80 VIN=3.0V 0.70 VIN=1.76V 0.60 0.50 -50 -25 0 25 50 75 Ambient Temperature: Ta () 100
EN LowLevel ThresholdV
EN Highlevel ThresholdV
VIN=6.0V
20/23
XC6121/XC6122/XC6123/XC6124
Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
16.ENB Low Level Voltage vs. Ambient Temperature 17.ENB High Level Voltage vs. Ambient Temperature

ENBL (V)
ENBH (V)
1.10 1.00 0.90 0.80 0.70 0.60 VIN=1.76V 0.50 -50 -25 0 25 50 75 Ambient Temperature: Ta () 100 VIN=6.0V VIN=3.0V
1.10 1.00 0.90 0.80

ENBHighlevel ThresholdV
ENB LowLevel ThresholdV
VIN=6.0V
VIN=3.0V 0.70 VIN=1.76V 0.60 0.50 -50 -25 0 25 50 75 Ambient Temperature: Ta () 100
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XC6121/XC6122/XC6123/XC6124 Series
 PACKAGING INFORMATION
SOT-25
Unit :mm
USP-6C
Unit :mm
USP-6C Reference Pattern Layout
USP-6C Reference Metal Mask Design
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XC6121/XC6122/XC6123/XC6124
Series
1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD.
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