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  0438.500WR Datasheet PDF File

For 0438.500WR Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    Samsung Semiconductor Co., Ltd.
Part No. K4H560438E-ZLB30 K4H560838E-ZLB30
Description 64M X 4 DDR DRAM, 0.7 ns, PBGA60 ROHS COMPLIANT, FBGA-60
32M X 8 DDR DRAM, 0.7 ns, PBGA60 ROHS COMPLIANT, FBGA-60
File Size 385.02K  /  24 Page

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Amphenol Communications Solutions
Part No. 77317-404-38LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 38 Positions ,2.54mm (0.100in) Pitch,
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    150-S-004-2-Z02 33472-0408 33472-0431 33472-0434 33472-0440 33472-0442 33472-0401 33472-0402 33472-0403 33472-0451 33472

Molex Electronics Ltd.
Part No. 150-S-004-2-Z02 33472-0408 33472-0431 33472-0434 33472-0440 33472-0442 33472-0401 33472-0402 33472-0403 33472-0451 33472-0433 33472-0436 33472-0438 33472-0443 33472-0444 33472-0445 33472-0447 33472-0449 33472-0452 33472-0404 33472-0406 33472-0407 33472-0432 33472-0435 33472-0437 33472-0439 33472-0441 33472-0446 33472-0448 33472-0450
Description DIRECT CONNECT INTERFACE 4 WAY 1.5MM SEALED MALE
File Size 1,174.31K  /  10 Page

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Amphenol Communications Solutions
Part No. 68020-438HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 38 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    Cypress Semiconductor, Corp.
Part No. K4H1G0438A-UCB30 K4H1G0838A-UCB00
Description 256M X 4 DDR DRAM, 0.7 ns, PDSO66 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66
128M X 8 DDR DRAM, 0.75 ns, PDSO66
File Size 359.14K  /  24 Page

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Amphenol Communications Solutions
Part No. 77317-104-38LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 38 Positions ,2.54mm (0.100in) Pitch,
Tech specs 　 　

Official Product Page

    Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4H1G0838M-TC_LB3 K4H1G0438M K4H1G0438M-TC_LA2 K4H1G0438M-TC_LB0 K4H1G0438M-TC_LB3 K4H1G0838M-TC_LA2 K4H1G0838M-TC_LB0 K4H1G0438M-TC/LB0 K4H1G0838M-TC/LB0 K4H1G0438M-TC/LA2 K4H1G0438M-TC/LB3 K4H1G0838M-TC/LA2 K4H1G0838M-TC/LB3
Description 1Gb M-die DDR SDRAM Specification
File Size 203.73K  /  23 Page

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Amphenol Communications Solutions
Part No. 51940-438LF
Description PwrBlade®, Power Supply Connectors, 8P 44S 8P Vertical Receptacle.
Tech specs 　 　

Official Product Page

    K4H1G0838M-TC/LB0 K4H1G0838M-TC/LA2 K4H1G0838M-TC/LB3 K4H1G0438M-TC/LA2 K4H1G0438M-TC/LB0 K4H1G0438M-TC/LB3

SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H1G0838M-TC/LB0 K4H1G0838M-TC/LA2 K4H1G0838M-TC/LB3 K4H1G0438M-TC/LA2 K4H1G0438M-TC/LB0 K4H1G0438M-TC/LB3
Description DIODE ZENER DUAL COMMON-CATHODE 300mW 43Vz 5mA-Izt 0.0698 0.1uA-Ir 32 SOT-23 3K/REEL
1Gb M-die DDR SDRAM Specification
File Size 208.27K  /  23 Page

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Amphenol Communications Solutions
Part No. 68690-438HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 38 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    K4H560438E-NC/LA2 K4H560838E-NC/LA2 K4H560438E-NC/LB0 K4H560838E-NC/LB0 K4H560438E-NC/LB3 K4H560838E-NC/LB3 K4H560438E-N

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H560438E-NC/LA2 K4H560838E-NC/LA2 K4H560438E-NC/LB0 K4H560838E-NC/LB0 K4H560438E-NC/LB3 K4H560838E-NC/LB3 K4H560438E-NCA2 K4H560438E-NCB0 K4H560838E-NCA2 K4H560438E-NCB3 K4H560838E-NCB0 K4H560838E-NCB3 K4H560838E-NLB0 K4H560438E-NLB3 K4H560438E-NLB0 K4H560838E-NLB3 K4H560838E-NLA2
Description 256Mb E-die DDR SDRAM Specification 54pin sTSOP(II) 256Mb的电子芯片DDR SDRAM内存规格54pin sTSOP（二
DIODE ZENER SINGLE 300mW 43Vz 5mA-Izt 0.02 0.05uA-Ir 33 SOT-23 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格54pin sTSOP（二
Quad Wide Bandwidth High Output Drive Single Supply Op Amp 20-HTSSOP 0 to 70
Quad Wide Bandwidth High Output Drive Single Supply Op Amp 16-SOIC -40 to 125
10-Bit, 32 kSPS ADC Serial Out, uProcessor Periph./Standalone, 11 Ch. 20-SOIC
   256Mb E-die DDR SDRAM Specification 54pin sTSOP(II)
File Size 216.89K  /  24 Page

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Amphenol Communications Solutions
Part No. 87900-438HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    SAMSUNG[Samsung semiconductor]
Part No. K4H560838E-ZLB3 K4H560438E-ZC K4H560438E-ZC_LA2 K4H560438E-ZC_LB0 K4H560438E-ZC_LB3 K4H560438E-ZCA2 K4H560438E-ZCB0 K4H560438E-ZCB3 K4H560438E-ZLA2 K4H560438E-ZLB0 K4H560438E-ZLB3 K4H560838E-ZC_LA2 K4H560838E-ZC_LB0 K4H560838E-ZC_LB3 K4H560838E-ZCA2 K4H560838E-ZCB0 K4H560838E-ZCB3 K4H560838E-ZLA2 K4H560838E-ZLB0
Description 256Mb E-die DDR SDRAM Specification 60 FBGA with Pb-Free (RoHS compliant)
File Size 355.74K  /  23 Page

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Amphenol Communications Solutions
Part No. 10144517-043802LF
Description BergStak® Lite 0.80mm, Board-to-Board Connector, 40 Positions, Dual Row, Vertical Receptacle.
Tech specs 　 　

Official Product Page

    5019390503 501939-0500 501939-0436 501939-0503 501939-0537 501939-0534 501939-0339 501939-0439 501939-0536 501939-0539 5

Molex Electronics Ltd.
Part No. 5019390503 501939-0500 501939-0436 501939-0503 501939-0537 501939-0534 501939-0339 501939-0439 501939-0536 501939-0539 501939-0330 501939-0336 501939-0430 501939-0438 501939-0431 501939-0437 501939-0532 501939-0337 501939-0338 501939-0533 501939-0538
Description 1.0 WIRE TO BOARD CONN. 1-ROW RECPTACLE HOUSING POSITIVE LOCK
File Size 131.20K  /  2 Page

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Amphenol Communications Solutions
Part No. 10043857-202LF
Description 400 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs 　 　

Official Product Page

    K4H560838E-GC/LA2 K4H560838E-GC/LB0 K4H560838E-GC/LB3 K4H560438E-GC/LA2 K4H560438E-GC/LB0 K4H560438E-GC/LB3 K4H560438E-G

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
http://
Part No. K4H560838E-GC/LA2 K4H560838E-GC/LB0 K4H560838E-GC/LB3 K4H560438E-GC/LA2 K4H560438E-GC/LB0 K4H560438E-GC/LB3 K4H560438E-GLB0 K4H560438E-GLB3 K4H560438E-GCB3 K4H560438E-GCA2 K4H560838E-GCA2 K4H560438E-GCB0 K4H560838E-GCB0 K4H560838E-GLB0 K4H560838E-GLB3 K4H560838E-GLA2
Description DIODE ZENER TRIPLE ISOLATED 200mW 39.13Vz 5mA-Izt 0.02518 0.05uA-Ir 30 SOT-363 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER TRIPLE ISOLATED 200mW 36.28Vz 5mA-Izt 0.02522 0.05uA-Ir 30 SOT-363 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER TRIPLE ISOLATED 200mW 22.08Vz 5mA-Izt 0.02514 0.05uA-Ir 17 SOT-363 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER TRIPLE ISOLATED 200mW 12Vz 10mA-Izt 0.02532 0.1uA-Ir 9.1 SOT-363 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER SINGLE 300mW 22.1Vz 5mA-Izt 0.02514 0.05uA-Ir 17 SOT-23 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER TRIPLE ISOLATED 200mW 13.79Vz 10mA-Izt 0.02503 0.05uA-Ir 11 SOT-363 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER SINGLE 300mW 14Vz 10mA-Izt 0.02503 0.05uA-Ir 11 SOT-23 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER SINGLE 300mW 12.9Vz 10mA-Izt 0.02562 0.1uA-Ir 10 SOT-23 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER TRIPLE ISOLATED 200mW 11.1Vz 10mA-Izt 0.02523 0.1uA-Ir 8.4 SOT-363 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER TRIPLE ISOLATED 200mW 19.7Vz 10mA-Izt 0.0251 0.05uA-Ir 15 SOT-363 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER SINGLE 300mW 12Vz 10mA-Izt 0.02532 0.1uA-Ir 9.1 SOT-23 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER SINGLE 300mW 19.7Vz 10mA-Izt 0.0251 0.05uA-Ir 15 SOT-23 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER SINGLE 300mW 23.7Vz 5mA-Izt 0.02509 0.05uA-Ir 19 SOT-23 3K/REEL
DIODE ZENER TRIPLE ISOLATED 200mW 12.88Vz 10mA-Izt 0.02562 0.1uA-Ir 10 SOT-363 3K/REEL
256Mb E-die DDR SDRAM Specification 60Ball FBGA (x4/x8)
   256Mb E-die DDR SDRAM Specification 60Ball FBGA (x4/x8)
File Size 245.98K  /  24 Page

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Amphenol Communications Solutions
Part No. 10144518-043802LF
Description BergStak® Lite 0.80mm, Board-to-Board Connector, 40 Positions, Dual Row, Vertical Header.
Tech specs 　 　

Official Product Page

    SAMSUNG[Samsung semiconductor]
Part No. K4H560838E-GLB3 K4H560438E-GC K4H560438E-GC_LA2 K4H560438E-GC_LB0 K4H560438E-GC_LB3 K4H560438E-GCA2 K4H560438E-GCB0 K4H560438E-GCB3 K4H560438E-GLA2 K4H560438E-GLB0 K4H560438E-GLB3 K4H560838E-GC_LA2 K4H560838E-GC_LB0 K4H560838E-GC_LB3 K4H560838E-GCA2 K4H560838E-GCB0 K4H560838E-GCB3 K4H560838E-GLA2 K4H560838E-GLB0
Description 256Mb E-die DDR SDRAM Specification 60Ball FBGA (x4/x8)
File Size 241.25K  /  24 Page

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Amphenol Communications Solutions
Part No. 86840-438HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 5.84 mm (0.23in) Tail.
Tech specs 　 　

Official Product Page

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