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    天津新技术产业园区管理委员会
Part No. IS61DDB41M36-250M3 IS61DDB21M36-250M3 IS61DDB21M36-275M3
OCR Text ... for 72mb, 7a for 144mb, 5b for 288mb. bw 0 controls writes to dq0?dq8; bw 1 controls writes to dq9?dq17 integrated silicon solution, inc. ? 1-800-379-4774 3 rev. f 05/08/09 i ? 36 mb (1m x 36 & 2m x 18) ddr-ii (burst of 2) cio synch...
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    天津新技术产业园区管理委员会
Part No. IS61QDB21M36-250M3 IS61QDB41M36-250M3
OCR Text ...64mb, 10a for 144mb, and 2a for 288mb. x18 fbga pinout (top view) 1234567891011 acq v ss /sa* sa w bw 1 k nc r sa v ss /sa* cq bnc q9 d9 sa nc k bw 0 sa nc nc q8 cnc nc d10 v ss sa sa sa v ss nc q7 d8 dnc d11 q10 v ss v ss v ss v ss v ss n...
Description
File Size 653.15K  /  27 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K7R320982C K7R323682C-FC20 K7R323682C-FC25 K7R323682C-FCI20 K7R323682C-FCI30 K7R323682C-FC30 K7R323682C-FCI25 K7R323682C-FEC30 K7R323682C-FEC20 K7R323682C-FEC25 K7R323682C-FC250
OCR Text ...72mb, 10a for 144mb and 2a for 288mb. 2. bw 0 controls write to d0:d8, bw 1 controls write to d9:d17, bw 2 controls write to d18:d26 and bw 3 controls write to d27:d35. 1 2 3 4 5 6 7 8 9 10 11 a cq nc/sa* nc/sa* w bw 2 k bw...
Description 1Mx36 & 2Mx18 & 4Mx9 QDR II b2 SRAM

File Size 462.59K  /  20 Page

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    Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4C89183AF K4C89083AF-GIFB K4C89083AF-AIFB K4C89093AF-ACFB K4C89093AF-GIFB K4C89093AF-AIFB K4C89083AF-ACFB K4C89083AF-GCF6 K4C89083AF-GIF6 K4C89083AF-AIF6 K4C89083AF-ACF6 K4C89093AF-ACF5 K4C89183AF-ACFB K4C89183AF-AIFB K4C89183AF-GCFB K4C89183AF-ACF6 K4C89163AF-ACFB K4C89163AF-GIFB K4C89163AF-AIFB K4C89183AF-GIF5 K4C89083AF-AIF5 K4C89163AF-AIF6 K4C89183AF-AIF6 K4C89163AF-AIF5 K4C89093AF-AIF6 K4C89093AF-GIF5 K4C89183AF-AIF5 K4C89093AF-GCF5 K4C89183AF-ACF5 K4C89183AF-GIF6 K4C89183AF-GIFB K4C89083AF-GIF5 K4C89093AF-AIF5 K4C89163AF-ACF5 K4C89093AF-ACF6 K4C89163AF-GIF5 K4C89163AF-GIF6 K4C89163AF-GCF6
OCR Text 288mb x18 network-dram2 specification version 0.7 k4c89183af - 2 - rev. 0.7 jan. 2005 revision history version 0.0 (oct. 2002) - first release version 0.01 (nov. 2002) - changed die revision from d-die to f-die - corrected typo...
Description 288mb x18 Network-DRAM2 Specification 288mb x18网络DRAM2规范
Aluminum Electrolytic Radial Lead High Ripple, Long Life Capacitor; Capacitance: 100uF; Voltage: 250V; Case Size: 16x31.5 mm; Packaging: Bulk
Aluminum Electrolytic Radial Lead High Ripple, Long Life Capacitor; Capacitance: 33uF; Voltage: 250V; Case Size: 12.5x20 mm; Packaging: Bulk
JT 55C 55#22M PIN PLUG
JT 8C 8#16 PIN PLUG
Thyristor / Diode Module; Repetitive Reverse Voltage Max, Vrrm:2200V; Current, It av:430A; Gate Trigger Voltage Max, Vgt:3V; Gate Trigger Current Max, Igt:200mA; Package/Case:LD43; di/dt:200A/ s RoHS Compliant: Yes
JT 55C 55#22 SKT PLUG

File Size 1,477.34K  /  55 Page

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    IS61DDPB22M36 IS61DDPB22M36-375M3 IS61DDPB22M36-375M3L IS61DDPB22M36-400M3 IS61DDPB22M36-400M3L IS61DDPB24M18-375M3 IS61

Integrated Silicon Solution, Inc
Part No. IS61DDPB22M36 IS61DDPB22M36-375M3 IS61DDPB22M36-375M3L IS61DDPB22M36-400M3 IS61DDPB22M36-400M3L IS61DDPB24M18-375M3 IS61DDPB24M18-375M3L IS61DDPB24M18-400M3 IS61DDPB24M18-400M3L
OCR Text ...densities: 7A for 144Mb, 5B for 288mb. * BW0 controls writes to DQ0-DQ8; BW1 controls writes to DQ9-DQ17 2 Integrated Silicon Solution, Inc. Rev. 00A 03/31/08 D 72 Mb (2M x 36 & 4M x 18) D DDR-IIP (Burst of 2) CIO Synchronous S...
Description 72 Mb (2M x 36 & 4M x 18) DDR-IIP (Burst of 2) CIO Synchronous SRAMs

File Size 584.40K  /  24 Page

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    EBR51UC8ABKD-8C EBR51UC8ABKD-AD EBR51UC8ABKD-AE EBR51UC8ABKD-AEP EBR51UC8ABKD

Elpida Memory
Part No. EBR51UC8ABKD-8C EBR51UC8ABKD-AD EBR51UC8ABKD-AE EBR51UC8ABKD-AEP EBR51UC8ABKD
OCR Text ...C8ABKD consists of 16 pieces of 288mb Direct Rambus DRAM (Direct RDRAM) devices. These are extremely high-speed CMOS DRAMs organized as 16M words by 18 bits. The use of Rambus Signaling Level (RSL) technology permits the use of conventional...
Description 512MB 32-bit Direct Rambus DRAM RIMM垄芒 Module
512MB 32-bit Direct Rambus DRAM RIMM Module
512MB 32-bit Direct Rambus DRAM RIMM?/a> Module

File Size 113.71K  /  13 Page

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    EBR25UC8ABKD-8C EBR25UC8ABKD-AD EBR25UC8ABKD-AE EBR25UC8ABKD-AEP

Elpida Memory
Part No. EBR25UC8ABKD-8C EBR25UC8ABKD-AD EBR25UC8ABKD-AE EBR25UC8ABKD-AEP
OCR Text ...UC8ABKD consists of 8 pieces of 288mb Direct Rambus DRAM (Direct RDRAM) devices. These are extremely high-speed CMOS DRAMs organized as 16M words by 18 bits. The use of Rambus Signaling Level (RSL) technology permits the use of conventional...
Description 256MB 32-bit Direct Rambus DRAM RIMM?/a> Module
256MB 32-bit Direct Rambus DRAM RIMM Module
256MB 32-bit Direct Rambus DRAM RIMM垄芒 Module

File Size 112.67K  /  13 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K7R321884M K7R323684M K7R323684M-FC16 K7R321884M-FC16
OCR Text ...2mb, 10a for 144mb and 2a fo r 288mb. 2. bw 0 controls write to d0:d8, bw 1 controls write to d9:d17, bw 2 controls write to d18:d26 and bw 3 controls write to d27:d35. 1 2 3 4 5 6 7 8 9 10 11 a cq v ss /sa* nc/sa* w...
Description 1Mx36 & 2Mx18 QDRTM II b4 SRAM

File Size 197.54K  /  18 Page

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    K7J323682C K7J321882C

Samsung semiconductor
Part No. K7J323682C K7J321882C
OCR Text ... 72mb, 10a for 144mb and 2a for 288mb. 2. bw 0 controls write to d0:d8, bw 1 controls write to d9:d17, bw 2 controls write to d18:d26 and bw 3 controls write to d27:d35. 1 2 3 4 5 6 7 8 9 10 11 a cq nc / sa* nc / sa* r/w bw ...
Description 1Mx36 & 2Mx18 DDR II SIO b2 SRAM

File Size 410.17K  /  18 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4R571669D
OCR Text ... datasheets) - based on the 256/288mb a-die rdram ? version 1.4 direct rdram ? k4r571669d/k4r881869d page 1 version 1.4 july 2002 overview the rdram ? device is a gene ral purpose high-perfor- mance memory device suitable for use in a...
Description 256/288mbit RDRAM(D-die)

File Size 313.24K  /  20 Page

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