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Amphenol Communications Solutions |
| Part No. |
10142344-214KLF
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| Description |
Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Horizontal, Header, Surface Mount, 14 Position<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
A-70567-0344 15-80-1121 0015801121
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.35K /
7 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10142634-309KLF
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| Description |
Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Horizontal, Header, Surface Mount, 9 Position<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800207 15-80-0207 A-70567-0212
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
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| File Size |
1,218.31K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10142634-307KLF
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| Description |
Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Horizontal, Header, Surface Mount, 7 Position<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70567-0008 A-70567-0008 0015800201 15-80-0201
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
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| File Size |
1,218.42K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10142634-216KLF
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| Description |
Minitek MicroSpace™ 1.50mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Horizontal, Header, Surface Mount, 16 Position,Staggered,side Latch<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70567-0009 0015800221
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating
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| File Size |
1,218.41K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10142344-313KLF
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| Description |
Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Horizontal, Header, Surface Mount, 13 Position<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
A-70567-0341 15-80-1061 0015801061
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.39K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
91601-423LF
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| Description |
Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical , Surface Mount, Dual Entry ,Single row , 23 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-101-42LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 42 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800209 15-80-0209 A-70567-0280
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
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| File Size |
1,218.34K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
86840-142HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 42 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 5.84 mm (0.23in) Tail.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800205 15-80-0205 70567-0144
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
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| File Size |
1,218.25K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
70430-142LF
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| Description |
Metral® Power Connectors, Backplane Power Connectors, 5 Row Power Header,Vertical Press-Fit, Wide body.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800685 70567-0168 A-70567-0168 15-80-0685
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective P
MOLEX Connector
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| File Size |
1,218.47K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
86130142323385E1LF
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| Description |
8613 M LF CNR
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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