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  90136-2218 Datasheet PDF File

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    MICROSEMI CORP
Part No. 2N2218AL
Description 800 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-5

File Size 29.98K  /  2 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TB62218AFTG
Description Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    2N2218-2N2219 2N2221 2N2221-2N2222 2N2219 2N2222 2N2218

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ST Microelectronics
STMICROELECTRONICS[STMicroelectronics]
意法半导
Part No. 2N2218-2N2219 2N2221 2N2221-2N2222 2N2219 2N2222 2N2218
Description HIGH-SPEED SWITCHES

File Size 70.57K  /  5 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TB62218AFNG
Description Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
Tech specs    

Official Product Page

    Motorola
Part No. MQ2218 MQ2218A MQ2219A
Description (MQ2218 / MQ2219) DUAL AMPLIFIER TRANSISTOR NPN SILICON

File Size 236.54K  /  5 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TB62218FG
Description Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
Tech specs    

Official Product Page

    BOCA[Boca Semiconductor Corporation]
Part No. 2N2219A 2N2218A
Description NPN SILICON PLANAR SWITCHING TRANSISTORS

File Size 54.98K  /  3 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TB62218AFG
Description Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
Tech specs    

Official Product Page

    90136-1115 0901361115

Molex Electronics Ltd.
Part No. 90136-1115 0901361115
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 15 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 15 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.33K  /  4 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TB62218FTG
Description Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
Tech specs    

Official Product Page

    90136-1130 0901361130

Molex Electronics Ltd.
Part No. 90136-1130 0901361130
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 30 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 30 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.24K  /  4 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TB62218FNG
Description Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
Tech specs    

Official Product Page

    90136-1118 0901361118

Molex Electronics Ltd.
Part No. 90136-1118 0901361118
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 18 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 18 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-1110 0901361110

Molex Electronics Ltd.
Part No. 90136-1110 0901361110
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 10 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 10 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    90136-1209 0901361209

Molex Electronics Ltd.
Part No. 90136-1209 0901361209
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 9 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 9 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    90136-1203 0901361203

Molex Electronics Ltd.
Part No. 90136-1203 0901361203
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 77313-422-18LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 18 Positions
Tech specs    

Official Product Page

For 90136-2218 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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