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Optek Technology
OPTEK[OPTEK Technologies]
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| Part No. |
OPB608V OPB608R OPB608 OPB608A OPB608B OPB608C
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| OCR Text |
...psulated in a visible filtering epoxy except the OPB608R. The phototransistor responds to radiation from the emitter only when a reflective object passes within its field of view. The phototransistor has enhanced low current roll off to imp... |
| Description |
Reflective Object Sensor
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| File Size |
310.75K /
9 Page |
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it Online |
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MAXIM[Maxim Integrated Products]
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| Part No. |
MAX3295AUT MAX3295 MAX3293 MAX3294
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| OCR Text |
... per JEDEC standard JESD22-112: Epoxy with silica filler # 05-9000-0352 Class UL94-V0 6-Lead SOT Copper Solder Plate Non-Conductive Epoxy Gold (1 mil dia.) 20Mbps, +3.3V, SOT23 RS-485/RS-422 Transmitters B8 (Standard 0.8 micron silicon gate... |
| Description |
PLASTIC ENCAPSULATED DEVICES
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| File Size |
98.51K /
8 Page |
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it Online |
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Quanzhou Jinmei Electro...
Philips
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| Part No. |
BLF346 BLF346_4 BLF346-2015
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| OCR Text |
...clad printed circuit board with epoxy fibre-glass dielectric (r = 4.5); thickness 1 inch. 16
1996 Oct 02
8
Philips Semiconductors
Product specification
VHF power MOS transistor
BLF346
handbook, full pagewidth
150
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| Description |
From old datasheet system
VHF power MOS transistor
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| File Size |
83.62K /
16 Page |
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it Online |
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MAXIM - Dallas Semiconductor
MAXIM[Maxim Integrated Products]
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| Part No. |
MAX1920 MAX1921EUT MAX1921
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| OCR Text |
...per Solder Plate Non-Conductive Epoxy Gold (1.3 mil dia.) Epoxy with silica filler # 05-3501-0021 Class UL94-V0
Level 1
IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Wi... |
| Description |
PLASTIC ENCAPSULATED DEVICES
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| File Size |
88.81K /
8 Page |
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it Online |
Download Datasheet |
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Price and Availability
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