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MAXIM[Maxim Integrated Products]
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| Part No. |
MAX4626EUK
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| OCR Text |
... (1 mil dia.) Epoxy with silica filler Buildsheet # 05-1201-0129 Class UL94-V0 1, Low-Voltage, Single-Supply SPDT Analog Switch T06 (0.6 micron TSMC CMOS) 186 Taiwan, USA Malaysia January, 2000
Classification of Moisture Sensitivity per ... |
| Description |
PLASTIC ENCAPSULATED DEVICES
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| File Size |
56.33K /
7 Page |
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it Online |
Download Datasheet
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MAXIM INTEGRATED PRODUCTS INC
MAXIM[Maxim Integrated Products]
MAXIM - Dallas Semiconductor
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| Part No. |
MAX4627EUK
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| OCR Text |
... (1 mil dia.) Epoxy with silica filler Buildsheet # 05-1201-0129 Class UL94-V0 1, Low-Voltage, Single-Supply SPDT Analog Switch T06 (0.6 micron TSMC CMOS) 186 Taiwan, USA Malaysia January, 2000
Classification of Moisture Sensitivity per ... |
| Description |
PLASTIC ENCAPSULATED DEVICES
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| File Size |
56.45K /
7 Page |
View
it Online |
Download Datasheet |
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MAXIM - Dallas Semiconductor
MAXIM[Maxim Integrated Products]
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| Part No. |
MAX4714EXT
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| OCR Text |
...1.0 mil dia.) Epoxy with silica filler Buildsheet # 05-1201-0224 Class UL94-V0
Level 1
IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G.... |
| Description |
PLASTIC ENCAPSULATED DEVICES
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| File Size |
76.94K /
7 Page |
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it Online |
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MAXIM - Dallas Semiconductor
MAXIM[Maxim Integrated Products]
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| Part No. |
MAX6713ZEXS
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| OCR Text |
...1.0 mil dia.) Epoxy with silica filler Buildsheet # 05-1601-0100 Class UL94-V0
Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1
IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backs... |
| Description |
PLASTIC ENCAPSULATED DEVICES
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| File Size |
54.74K /
8 Page |
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it Online |
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MAXIM[Maxim Integrated Products]
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| Part No. |
MAX6902EKA
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| OCR Text |
... (1 mil dia.) Epoxy with silica filler # 05-3301-0009 Class UL94-V0 SPI-Compatible Real-Time Clock in SOT23 TC05 (0.5 micron CMOS) 26,418 Taiwan, USA Malaysia July, 2001
I. Classification of Moisture Sensitivity per JEDEC standard JESD22... |
| Description |
PLASTIC ENCAPSULATED DEVICES
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| File Size |
132.44K /
8 Page |
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it Online |
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Maxim Integrated Products, Inc.
MAXIM[Maxim Integrated Products]
MAXIM - Dallas Semiconductor
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| Part No. |
MAX803TEXR
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| OCR Text |
... (1 mil dia.) Epoxy with silica filler # 05-1601-0082 Class UL94-V0
I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1
IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Meta... |
| Description |
PLASTIC ENCAPSULATED DEVICES 塑封器件
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| File Size |
58.25K /
8 Page |
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it Online |
Download Datasheet |
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MAXIM[Maxim Integrated Products]
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| Part No. |
MAX837EUS
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| OCR Text |
... (1 mil dia.) Epoxy with silica filler Buildsheet # 05-1601-0019 Class UL94-V0
Level 1
IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G.... |
| Description |
PLASTIC ENCAPSULATED DEVICES
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| File Size |
88.00K /
8 Page |
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it Online |
Download Datasheet |
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MAXIM[Maxim Integrated Products]
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| Part No. |
MAX8521ETP
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| OCR Text |
...2.0 mil dia.) Epoxy with silica filler # 05-9000-0102 Class UL94-V0
Level 1
IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G. Bondpad Di... |
| Description |
MAXIM INTEGRATED PRODUCTS
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| File Size |
94.42K /
8 Page |
View
it Online |
Download Datasheet |
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MAXIM[Maxim Integrated Products]
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| Part No. |
MAX8556ETE
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| OCR Text |
...2.0 mil dia.) Epoxy with silica filler # 05-9000-0801 Class UL94-V0
I. Classification of Moisture Sensitivity per JEDEC standard J-STD-020-A: Level 1
IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Meta... |
| Description |
PLASTIC ENCAPSULATED DEVICES
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| File Size |
160.76K /
8 Page |
View
it Online |
Download Datasheet |
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MAXIM[Maxim Integrated Products]
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| Part No. |
MAX8557ETE
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| OCR Text |
...2.0 mil dia.) Epoxy with silica filler # 05-9000-0801 Class UL94-V0
I. Classification of Moisture Sensitivity per JEDEC standard J-STD-020-A: Level 1
IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Meta... |
| Description |
PLASTIC ENCAPSULATED DEVICES
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| File Size |
160.86K /
8 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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