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EUDYNA[Eudyna Devices Inc]
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| Part No. |
F0100406B
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| OCR Text |
...sults for die-bonding with AuSn preforms. The heating and ultrasonic wire-bonding at the temperature of 150C by a ball-bonding machine effective. Quality Assurance For the F01 series products, there is only one technically inevitable drawba... |
| Description |
3.3V 1.25Gbit/s NRZ Receiver Transimpedance Amplifier
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| File Size |
95.21K /
10 Page |
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it Online |
Download Datasheet
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EUDYNA[Eudyna Devices Inc]
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| Part No. |
F0100504B
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| OCR Text |
...sults for die-bonding with AuSn preforms. The heating and ultrasonic wire-bonding at the temperature of 150C by a ball-bonding machine effective. Quality Assurance For the F01 series products, there is only one technically inevitable drawba... |
| Description |
3.3V/5V 2.5Gb/s NRZ Receiver Transimpedance Amplifier
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| File Size |
182.36K /
13 Page |
View
it Online |
Download Datasheet |
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EUDYNA[Eudyna Devices Inc]
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| Part No. |
F0100505B
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| OCR Text |
...sults for die-bonding with AuSn preforms. The heating and ultrasonic wire-bonding at the temperature of 150 C by a ball-bonding machine is effective. Quality Assurance For the F01 series products, there is only one technically inevitable d... |
| Description |
3.3 V /5V 2.5 Gb/s NRZ Receiver Transimpedance Amplifier
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| File Size |
560.54K /
12 Page |
View
it Online |
Download Datasheet |
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HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC341
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| OCR Text |
... die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat.
Eutectic Die Attach:
A 80/20 gold tin preform is recommended with a work surface temperature of 255 deg. C an... |
| Description |
GaAs MMIC LOW NOISE AMPLIFIER/ 24 - 30 GHz
GaAs MMIC LOW NOISE AMPLIFIER, 24 - 30 GHz
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| File Size |
181.84K /
6 Page |
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it Online |
Download Datasheet |
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HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC342 -HMC342
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| OCR Text |
... die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat.
Eutectic Die Attach:
A 80/20 gold tin preform is recommended with a work surface temperature of 255 deg. C an... |
| Description |
GaAs MMIC LOW NOISE AMPLIFIER/ 13 - 25 GHz
GaAs MMIC LOW NOISE AMPLIFIER, 13 - 25 GHz
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| File Size |
185.16K /
6 Page |
View
it Online |
Download Datasheet |
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美国讯泰微波有限公司上海代表
HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC344
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| OCR Text |
... die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 deg. C and a ... |
| Description |
GaAs MMIC SP4T NON-REFLECTIVE SWITCH, DC - 8.0 GHz
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| File Size |
163.87K /
6 Page |
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it Online |
Download Datasheet |
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Hittite Microwave Corpo...
HITTITE[Hittite Microwave Corporation]
美国讯泰微波有限公司上海代表
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| Part No. |
HMC362
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| OCR Text |
... die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 C and a tool ... |
| Description |
GaAs HBT MMIC DIVIDE-BY-4, DC - 11.0 GHz
600,000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN
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| File Size |
184.38K /
6 Page |
View
it Online |
Download Datasheet |
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