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  0438.500WR Datasheet PDF File

For 0438.500WR Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    SAMSUNG[Samsung semiconductor]
Part No. K4H560838E-NLB3 K4H560438E-NC K4H560438E-NC_LA2 K4H560438E-NC_LB0 K4H560438E-NC_LB3 K4H560438E-NCA2 K4H560438E-NCB0 K4H560438E-NCB3 K4H560438E-NLA2 K4H560438E-NLB0 K4H560438E-NLB3 K4H560838E-NC_LA2 K4H560838E-NC_LB0 K4H560838E-NC_LB3 K4H560838E-NCA2 K4H560838E-NCB0 K4H560838E-NCB3 K4H560838E-NLA2 K4H560838E-NLB0
Description 256Mb E-die DDR SDRAM Specification 54pin sTSOP(II)

File Size 212.16K  /  24 Page

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Amphenol Communications Solutions

Part No. 77317-404-38LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 38 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SAMSUNG[Samsung semiconductor]
Part No. K4H560838E-VLB3 K4H560438E-VC K4H560438E-VC_LA2 K4H560438E-VC_LB0 K4H560438E-VC_LB3 K4H560438E-VCA2 K4H560438E-VCB0 K4H560438E-VCB3 K4H560438E-VLA2 K4H560438E-VLB0 K4H560438E-VLB3 K4H560838E-VC_LA2 K4H560838E-VC_LB0 K4H560838E-VC_LB3 K4H560838E-VCA2 K4H560838E-VCB0 K4H560838E-VCB3 K4H560838E-VLA2 K4H560838E-VLB0
Description 256Mb E-die DDR SDRAM Specification 54 sTSOP-II with Pb-Free (RoHS compliant)

File Size 294.46K  /  23 Page

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Amphenol Communications Solutions

Part No. 68020-438HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 38 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H280438F-TC/LA0 K4H280838F-TC/LA2 K4H280838F-TC/LB3 K4H280438F-TC/LA2 K4H280838F-TC/LB0 K4H280438F-TC/LB0
Description 128Mb F-die DDR SDRAM Specification 128Mb的的F - DDR SDRAM内存芯片规格
RESISTOR, 2M OHM, 0.063W, 1%

File Size 208.51K  /  23 Page

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Amphenol Communications Solutions

Part No. 77317-104-38LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 38 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

    K4H560838D-NC_LA0 K4H560838D-NC_LA2 K4H560838D-NC_LB0 K4H560838D-NC_LB3 K4H560438D-NC_LB3 K4H560438D-NC K4H560438D-NC_LA

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4H560838D-NC_LA0 K4H560838D-NC_LA2 K4H560838D-NC_LB0 K4H560838D-NC_LB3 K4H560438D-NC_LB3 K4H560438D-NC K4H560438D-NC_LA0 K4H560438D-NC_LA2 K4H560438D-NC_LB0 K4H560438D-NC/LA0 K4H560438D-NC/LA2 K4H560438D-NC/LB0 K4H560438D-NC/LB3 K4H560838D-NC/LA0 K4H560838D-NC/LA2 K4H560838D-NC/LB0 K4H560838D-NC/LB3
Description 256MB STSOPII

File Size 89.94K  /  18 Page

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Amphenol Communications Solutions

Part No. 51940-438LF
Description PwrBlade®, Power Supply Connectors, 8P 44S 8P Vertical Receptacle.
Tech specs    

Official Product Page

    K4H560438D-NC/LA0 K4H560838D-NC/LA0 K4H560438D-NC/LA2 K4H560838D-NC/LA2 K4H560438D-NC/LB0 K4H560838D-NC/LB0 K4H560438D-N

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H560438D-NC/LA0 K4H560838D-NC/LA0 K4H560438D-NC/LA2 K4H560838D-NC/LA2 K4H560438D-NC/LB0 K4H560838D-NC/LB0 K4H560438D-NC/LB3 K4H560838D-NC/LB3
Description 256Mb sTSOPII 256Mb的sTSOPII
DIODE ZENER SINGLE 300mW 10Vz 20mA-Izt 0.02513 0.1uA-Ir 8 SOT-23 3K/REEL
DIODE ZENER SINGLE 200mW 9.1Vz 20mA-Izt 0.02592 0.1uA-Ir 7 SOD-323 3K/REEL
DIODE ZENER TRIPLE ISOLATED 200mW 9.95Vz 20mA-Izt 0.02513 0.1uA-Ir 8 SOT-363 3K/REEL

File Size 93.90K  /  18 Page

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Amphenol Communications Solutions

Part No. 68690-438HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 38 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    K4H560838E K4H560838E-TC_LB3 K4H560438E-TC_LA2 K4H560438E-TC_LAA K4H560438E-TC_LB0 K4H560438E-TC_LB3 K4H560838E-TC_LA2 K

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4H560838E K4H560838E-TC_LB3 K4H560438E-TC_LA2 K4H560438E-TC_LAA K4H560438E-TC_LB0 K4H560438E-TC_LB3 K4H560838E-TC_LA2 K4H560838E-TC_LAA K4H560838E-TC_LB0 K4H560838E-TC/LA2 K4H560838E-TC/LAA K4H560838E-TC/LB0 K4H560838E-TC/LB3
Description DDR SDRAM 256Mb E-die (x4, x8)

File Size 211.78K  /  24 Page

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Amphenol Communications Solutions

Part No. 87900-438HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    SAMSUNG[Samsung semiconductor]
Part No. K4H1G0838M-ULB3 K4H1G0438M-LA2 K4H1G0438M-LB0 K4H1G0438M-LB3 K4H1G0438M-UC K4H1G0438M-UC_LA2 K4H1G0438M-UC_LB0 K4H1G0438M-UC_LB3 K4H1G0438M-UC0 K4H1G0438M-UC2 K4H1G0438M-UC3 K4H1G0438M-UCA2 K4H1G0438M-UCB0 K4H1G0438M-UCB3 K4H1G0438M-ULA2 K4H1G0438M-ULB0 K4H1G0438M-ULB3 K4H1G0838M-LA2 K4H1G0838M-LB0 K4H1G0838M-LB3 K4H1G0838M-UC_LA2 K4H1G0838M-UC_LB0 K4H1G0838M-UC_LB3 K4H1G0838M-UC0 K4H1G0838M-UC2 K4H1G0838M-UC3 K4H1G0838M-UCA2 K4H1G0838M-UCB0 K4H1G0838M-UCB3 K4H1G0838M-ULA2 K4H1G0838M-ULB0
Description 1Gb M-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant)

File Size 203.93K  /  23 Page

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Amphenol Communications Solutions

Part No. 10144517-043802LF
Description BergStak® Lite 0.80mm, Board-to-Board Connector, 40 Positions, Dual Row, Vertical Receptacle.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4H560438E-ULAA K4H560838E-ULAA K4H560438E-UCAA K4H560838E-UCAA K4H560438E-ULB0 K4H560438E-ULA2 K4H560438E-ULB3 K4H560438E-UC/LAA K4H560838E-ULB3 K4H560438E-UCB3 K4H560438E-UCB0 K4H560838E-UCB3 K4H560438E-UC/LA2 K4H560438E-UC/LB0 K4H560438E-UC/LB3 K4H560438E-UCA2 K4H560838E-UC/LB0 K4H560838E-UC/LA2 K4H560838E-UC/LB3 K4H560838E-UCB0 K4H560838E-UC/LAA K4H560838E-UCA2 K4H560838E-ULA2
Description 256Mb E-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant) 256Mb的电子芯片与DDR SDRAM的规格铅66 TSOP-II免费(符合RoHS

File Size 298.78K  /  23 Page

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Amphenol Communications Solutions

Part No. 10043857-202LF
Description 400 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs    

Official Product Page

    SAMSUNG[Samsung semiconductor]
Part No. K4H560838E-ULB3 K4H560438E-UC K4H560438E-UC_LA2 K4H560438E-UC_LAA K4H560438E-UC_LB0 K4H560438E-UC_LB3 K4H560438E-UCA2 K4H560438E-UCAA K4H560438E-UCB0 K4H560438E-UCB3 K4H560438E-ULA2 K4H560438E-ULAA K4H560438E-ULB0 K4H560438E-ULB3 K4H560838E-UC_LA2 K4H560838E-UC_LAA K4H560838E-UC_LB0 K4H560838E-UC_LB3 K4H560838E-UCA2 K4H560838E-UCAA K4H560838E-UCB0 K4H560838E-UCB3 K4H560838E-ULA2 K4H560838E-ULAA K4H560838E-ULB0
Description 256Mb E-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant)

File Size 294.24K  /  23 Page

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Amphenol Communications Solutions

Part No. 10144518-043802LF
Description BergStak® Lite 0.80mm, Board-to-Board Connector, 40 Positions, Dual Row, Vertical Header.
Tech specs    

Official Product Page

    SAMSUNG[Samsung semiconductor]
Part No. K4H280838F-ULB3 K4H280438F-UC K4H280438F-UCA0 K4H280438F-UCA2 K4H280438F-UCB0 K4H280438F-ULA0 K4H280438F-ULA2 K4H280438F-ULB0 K4H280838F-UCA2 K4H280838F-UCB0 K4H280838F-UCB3 K4H280838F-ULA2 K4H280838F-ULB0
Description 128Mb F-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant)

File Size 295.20K  /  23 Page

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Amphenol Communications Solutions

Part No. 86840-438HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 5.84 mm (0.23in) Tail.
Tech specs    

Official Product Page

For 0438.500WR Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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