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  55755-1119 Datasheet PDF File

For 55755-1119 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    1511194006

Molex Electronics Ltd.
Part No. 1511194006
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin Plating

File Size 51.54K  /  2 Page

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Rochester Electronics LLC

Part No. 74AC11191DW
Description 74AC11191 - Binary Counter
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    1511195012

Molex Electronics Ltd.
Part No. 1511195012
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 55755-201
Description 240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array
Tech specs    

Official Product Page

    1511194010

Molex Electronics Ltd.
Part No. 1511194010
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 55755-201LF
Description 240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs    

Official Product Page

    1511194012

Molex Electronics Ltd.
Part No. 1511194012
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 55755-191LF
Description 240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs    

Official Product Page

    1511193018

Molex Electronics Ltd.
Part No. 1511193018
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin Plating

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 55755-001
Description 240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array
Tech specs    

Official Product Page

    1511193016

Molex Electronics Ltd.
Part No. 1511193016
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 55755-101
Description 240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array
Tech specs    

Official Product Page

    1511193014

Molex Electronics Ltd.
Part No. 1511193014
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 55755-191
Description 240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array
Tech specs    

Official Product Page

    1511193008

Molex Electronics Ltd.
Part No. 1511193008
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin Plating

File Size 51.53K  /  2 Page

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Amphenol Communications Solutions

Part No. 55755-001LF
Description 240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs    

Official Product Page

    1511194004

Molex Electronics Ltd.
Part No. 1511194004
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 55755-101LF
Description 240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs    

Official Product Page

    JRC
Part No. NJG1119PB4
Description Dual LNA

File Size 724.95K  /  24 Page

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Amphenol Communications Solutions

Part No. 77311-194-04LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 04 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

For 55755-1119 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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