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Yageo, Corp.
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| Part No. |
225420743752 225424743752 225424743754 225424743756 225478743752 225420743756 225424743758 225420743758 225478743754 225420743754
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| Description |
CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X5R, 0.15 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 10 V, X5R, 0.15 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 10 V, X5R, 0.22 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 10 V, X5R, 0.33 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, X5R, 0.15 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X5R, 0.33 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 10 V, X5R, 0.47 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X5R, 0.47 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, X5R, 0.22 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X5R, 0.22 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT
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| File Size |
386.07K /
18 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68604-436HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10044366-104LF
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| Description |
Mechanical Guidance Modules, Backplane Connectors, 10.8mm Guide Pin.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10044314-101LF
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| Description |
Mechanical Guidance Modules, Backplane Connectors, 7.2mm Guide Blade .
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68004-434HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68604-430HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68604-432HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 32 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68004-431HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
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| Tech specs |
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Official Product Page
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|
 |
Amphenol Communications Solutions |
| Part No. |
68004-430HLF
|
| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
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| Tech specs |
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Official Product Page
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|
 |
Amphenol Communications Solutions |
| Part No. |
10044366-103LF
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| Description |
Mechanical Guidance Modules, Backplane Connectors, 10.8mm Guide Pin.
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| Tech specs |
|
|
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Official Product Page
|
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|
 |
Amphenol Communications Solutions |
| Part No. |
68604-431HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 31 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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