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Rochester Electronics LLC |
| Part No. |
BLA0912-250
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| Description |
BLA0912-250 - N-Channel LDMOS Avionics LDMOS Transistor
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
5962-8775801VSA
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| Description |
Octal Bus Transceivers With 3-State Outputs 20-CFP -55 to 125
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877581216 87758-1216
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.71K /
4 Page |
 View
it Online |
Download Datasheet
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Texas Instruments |
| Part No. |
5962-87758012A
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| Description |
Octal Bus Transceivers With 3-State Outputs 20-LCCC -55 to 125
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
5962-8775801RA
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| Description |
Octal Bus Transceivers With 3-State Outputs 20-CDIP -55 to 125
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
5962-8775801SA
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| Description |
Octal Bus Transceivers With 3-State Outputs 20-CFP -55 to 125
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54242-411322250LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 32 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54121-112222500LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 22 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877581050 87758-1050
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
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| File Size |
135.93K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54122-112122500LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 12 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877584617 87758-4617
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| Description |
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.70K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10128483-122500ULF
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| Description |
ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System, 2-pair, 25 column, 22.5mm Plug Height.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127225-122502ULF
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| Description |
ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System, Hermaphroditic, Vertical, Press-Fit, 2 Pair, 19 Column, 152 Position, 22.50mm Stack Height, 2.00mm (0.079in) Column Pitch
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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