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  die-43 Datasheet PDF File

For die-43 Found Datasheets File :: 7677    Search Time::1.812ms    
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    IRL5602S IRF530S IRL5602STRR IRL5602STRL

IRF[International Rectifier]
Part No. IRL5602S IRF530S IRL5602STRR IRL5602STRL
OCR Text ...ackage capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any...43 (.450) NOTES: 1 DIMENSIONS AFTER SOLDER DIP. 2 DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 198...
Description -20V Single P-Channel HEXFET Power MOSFET in a D2-Pak package

File Size 169.26K  /  8 Page

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    K4S280832E-TC75 K4S280832E-TL75 K4S281632E-TC60 K4S281632E-TC75 K4S281632E-TL60 K4S281632E-TL75 K4S281632F-TC60 K4S28163

Samsung Electronic
Samsung semiconductor
Part No. K4S280832E-TC75 K4S280832E-TL75 K4S281632E-TC60 K4S281632E-TC75 K4S281632E-TL60 K4S281632E-TL75 K4S281632F-TC60 K4S281632F-TC75 K4S281632F-TL60 K4S281632F-TL75 K4S280432E-TC75 K4S280432E-TL75
OCR Text die (x4, x8, x16) CMOS SDRAM 128Mb E-die SDRAM Specification Revision 1.2 May. 2003 * Samsung Electronics reserves the right to ...43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 x4 VSS N.C VSSQ N.C DQ3 VDDQ N.C N.C VSSQ N.C DQ...
Description 128Mb F-die SDRAM Specification
128Mb E-die SDRAM Specification

File Size 142.11K  /  14 Page

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    K4S280832F-TC75 K4S280832F-TL75 K4S281632F-TC60 K4S281632F-TC75 K4S281632F-TL60 K4S281632F-TL75 TL431CDT K4S280432F-TCL7

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S280832F-TC75 K4S280832F-TL75 K4S281632F-TC60 K4S281632F-TC75 K4S281632F-TL60 K4S281632F-TL75 TL431CDT K4S280432F-TCL75 K4S280832F-TCL75 K4S280432F-TC75 K4S281632F-TCL60 K4S281632F-TCL75 K4S280432F-TL75
OCR Text die (x4, x8, x16) Preliminary CMOS SDRAM 128Mb F-die SDRAM Specification Revision 0.2 November. 2003 * Samsung Electronics reser...43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 Preliminary CMOS SDRAM x4 VSS N.C VSSQ N.C DQ...
Description 128Mb F-die SDRAM Specification 128Mb的的F - SDRAM内存芯片规格

File Size 143.50K  /  14 Page

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    K4S510832B-TC75 K4S510832B-TCL75 K4S510432B-TC K4S510432B-TC75 K4S510432B-TCL75 K4S511632B-TC75 K4S511632B-TCL75

Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4S510832B-TC75 K4S510832B-TCL75 K4S510432B-TC K4S510432B-TC75 K4S510432B-TCL75 K4S511632B-TC75 K4S511632B-TCL75
OCR Text die (x4, x8, x16) CMOS SDRAM 512Mb B-die SDRAM Specification Revision 1.1 February 2004 * Samsung Electronics reserves the right...43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 CMOS SDRAM x4 VSS N.C VSSQ N.C DQ3 VDDQ N.C N...
Description 512Mb B-die SDRAM Specification

File Size 147.30K  /  15 Page

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    K4S560832E-NCL75 K4S561632E-NCL60 K4S561632E-NCL75 K4S560432E-NC K4S560432E-NCL75 K4S561632E-NC75

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S560832E-NCL75 K4S561632E-NCL60 K4S561632E-NCL75 K4S560432E-NC K4S560432E-NCL75 K4S561632E-NC75
OCR Text die (x4, x8, x16) CMOS SDRAM 256Mb E-die SDRAM Specification 54pin sTSOP-II Revision 1.0 August. 2003 * Samsung Electronics rese...43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 PIN FUNCTION DESCRIPTION Pin CLK CS Name System ...
Description 16M x 16 SDRAM, LVTTL, 133MHz
256Mb E-die SDRAM Specification 54pin sTSOP-II

File Size 205.22K  /  14 Page

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    K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60 K4S561632E-TL75 K4S560432E-TL

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60 K4S561632E-TL75 K4S560432E-TL75 K4S560432E-TC75 K4S560432E-TC
OCR Text die (x4, x8, x16) CMOS SDRAM 256Mb E-die SDRAM Specification Revision 1.3 September. 2003 * Samsung Electronics reserves the rig...43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 CMOS SDRAM x4 VSS N.C VSSQ N.C DQ3 VDDQ N.C N...
Description 256Mb E-die SDRAM Specification 54pin sTSOP-II

File Size 196.59K  /  14 Page

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    RC224ATL RC224ATLV

Conexant Systems, Inc
ETC
Part No. RC224ATL RC224ATLV
OCR Text ... R6781-14 R6781-21 R6781-22 DSP Die Number L2501 L2501 L2503 L2503 L2531 L2531 I/O & VCC 5V 5V 5V 5V 3V 3V VAA/Codec 5V 5V 5V 5V 5V 5V...43) N/A: New 3.3 V Digital I/O N/A: New 3.3 V Digital I/O RC224ATL R6781-12 100 PQFP RC2...
Description EmbeddedModem Family

File Size 542.30K  /  104 Page

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    TZA3015HW

PHILIPS[Philips Semiconductors]
Part No. TZA3015HW
OCR Text ...s; body 14 x 14 x 1 mm; exposed die pad VERSION SOT638-1 2003 Dec 16 3 Philips Semiconductors Preliminary specification 30 Mb...43 TZA3015HW RREF LOS SCL(DR2) SDA(DR1) CS(DR0) UI 14 21 24 23 22 13 25 VDD I2C-BUS C...
Description 30 Mbit/s to 3.2 Gbit/s A-rate 4-bit fibre optic transceiver

File Size 317.22K  /  67 Page

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    ZL10312 ZL10312QCF ZL10312QCG ZL10312QCG1 ZL10312UBH

ZARLINK[Zarlink Semiconductor Inc]
Part No. ZL10312 ZL10312QCF ZL10312QCG ZL10312QCG1 ZL10312UBH
OCR Text ...n LQFP 64 Pin LQFP 64 Pin LQFP* Die supplied in Trays, Bake & Drypack Tape & Reel Trays, Bake & Drypack wafer form** *Pb Free Matte Tin ...43 44 45 46 47 48 Name Gnd CVdd Addr[1] Addr[2] Addr[3] Addr[4] Vdd Gnd AGC Test IRQ CVdd Gnd MOSTRT...
Description Satellite Demodulator

File Size 232.16K  /  15 Page

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For die-43 Found Datasheets File :: 7677    Search Time::1.812ms    
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