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Part No. |
HYS64T256022EDL-25F-B HYS64T256022EDL-2.5-B
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OCR Text |
...dl?3.7?b, indicat ing rev. ?b? dies are used for ddr2 sdram components. for all qimonda ddr2 module and component nomenclature see chapter 6 of this data sheet. compliance code 2) 2) the compliance code is printed on the module label ... |
Description |
200-Pin Dual Die Small-Outline-DDR2-SDRAM Modules
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File Size |
1,072.48K /
40 Page |
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Part No. |
HYS64T256020EDL-25F-C HYS64T256020EDL-2.5-C
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OCR Text |
...dl?3.7?c, indicat ing rev. ?c? dies are used for ddr2 sdram components. for a ll qimonda ddr2 module and component nomenclature see chapter 6 of this data sheet. compliance code 2) 2) the compliance code is printed on the module label a... |
Description |
200-Pin SO-DIMM DDR2 SDRAM Modules
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File Size |
1,234.25K /
51 Page |
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it Online |
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Thomas & Betts
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Part No. |
3-TB
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OCR Text |
...compression tools with matching dies, forms the connector and conductor into a solid, homogeneous mass to provide an optimum electrical bond between connector and conductor. The dies are designed to produce a circumferential, hex-shaped com... |
Description |
CABLE ACCESSORIES WATERPIPE GROUND CLAMP
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File Size |
1,467.91K /
36 Page |
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it Online |
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OSRAM
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Part No. |
F0118G
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OCR Text |
...n amount of more than 3% failed dies will be marked manually with pen. The marked area from backside will be transfered to frontside and will be also marked manually with pen. The visual inspection of chip frontside is performed by a stereo... |
Description |
GaAs Infrared Emitting Diode
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File Size |
65.53K /
6 Page |
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it Online |
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