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Molex Electronics Ltd.
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Part No. |
0850032995 85003-2995
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Description |
2.54mm (.100) Pitch DIN 41612 header, Style C/2, Right Angle, Through Hole, 0.25μm (10μ) Selective Gold (Au), 32 Circuits 2.54mm (.100") Pitch DIN 41612 header, Style C/2, Right Angle, Through Hole, 0.25渭m (10渭") Selective Gold (Au), 32 Circuits MOLEX Connector
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File Size |
65.01K /
3 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
87914-2216 0879142216
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Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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File Size |
3,779.50K /
48 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
87914-3616 0879143616
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Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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File Size |
3,779.41K /
48 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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