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ZTLV431 W2E3B SMZ36 ICS621N 616LV1 OPB844A A8166J ICS621N
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    F1206B3R00FWSTR F1206B0R25FSTR F1206B0R50FWSTR F1206B0R25FWSTR F0805B1R25FWSTR F0603C0R25FWTR F0603C1R25FWTR F0805B0R25F

AVX Corporation
Part No. F1206B3R00FWSTR F1206B0R25FSTR F1206B0R50FWSTR F1206B0R25FWSTR F0805B1R25FWSTR F0603C0R25FWTR F0603C1R25FWTR F0805B0R25FWSTR F0805B0R50FWSTR F0805B1R00FWSTR F0805B3R00FWSTR F0402E0R50FSTR F0402E0R25FSTR F0402E0R75FSTR F0402E1R00FSTR F0603C0R75FWTR F0603C2R00FWTR F0603C3R00FWTR F0603C2R50FWTR
OCR Text ... line joining the terminations and in a line parallel to the substrate. rapid change of components mounted to a substrate. ...
Description Accu-Guard? II SMD Thin-Film Fuse

File Size 261.38K  /  17 Page

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    PPBCV2800 PFK6020 PB088SS PB088HF2 PGP106 PGP105 PGP64 PGP105AHF PGP108AHF PPBCV11000 PPBCV11200 PPBCV11600 PPB285 PPB28

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List of Unclassifed Manufac...
List of Unclassifed Man...
Part No. PPBCV2800 PFK6020 PB088SS PB088HF2 PGP106 PGP105 PGP64 PGP105AHF PGP108AHF PPBCV11000 PPBCV11200 PPBCV11600 PPB285 PPB288 PPB286 PGP78AHF PGP64AHF PGPV86 PB0106SS PB0128 PB0126 PB0106HF2 PB0124 PB0165 PB0168 PB0105 PB0105HF2 PB0108SS PB0126SS
OCR Text ... oinin g, si d e -t o - si d e joining provides a seal between the gland plate openings on adjacent 100-mm solid bases and is used in combination with either of the side-to-side frame joining kits. a nylon wire edge protector (see drawi...
Description PROLINE Extern al Componen ts PROLINE Top s and Bases

File Size 977.98K  /  10 Page

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    Revolution
Part No. AXE401
OCR Text ...ic components , please consider joining the friendly online picaxe community at w w w .picaxeforum.co.uk a ?wiki? of ho w to use the picaxe shield base with a wide range of shields is currently being dev eloped at the picaxe w ebsite . 1.1...
Description PICAXE shield base

File Size 4,075.97K  /  26 Page

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    T3401N33TOF

Eupec GmbH
Part No. T3401N33TOF
OCR Text ...indung by using low temperature joining technique ntv zwischen silizium und mo-tr?gerscheibe between silicon wafer and molybdenum elektroaktive passivierung durch a - c:h electroactive passivation by a - c:h elektrische eigenschaften / elec...
Description (T3401N31TOF - T3401N36TOF) Phase Control Thyristor

File Size 183.69K  /  9 Page

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Part No. NAH44-44N
OCR Text joining a wide range of cable to equipment pads. tongue is side formed to provide adequate clearance and terminal is designed f or one-wrench installation. fig. 1 fig. ?
Description COPPER ALLOY, RING TERMINAL

File Size 30.08K  /  1 Page

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    AN3321

STMicroelectronics
Part No. AN3321
OCR Text ...connector on the bottom layer. joining all reset signals in a single wire on the revision 2.0 of the board, the reset is distributed through the unidirectional device u12. by design, u12 blocks nsrst signals to go from jtag to system res...
Description How to enable remote reset from JTAG on

File Size 239.90K  /  8 Page

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    LIGITEK electronics co....
Part No. LGFLY-311E
OCR Text ...l shift of parts and decline in joining strength at times. e a reflow soldering should not be done more than two times. b 120 sec.max. preheat 180~200 ! c 1~5 ! c/sec above 220 ! c 60 sec.max. 1~5 ! c/sec recommended soldering c...
Description 1W Power Light LED

File Size 266.10K  /  13 Page

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    List of Unclassifed Man...
Part No. T6613-F
OCR Text ... for higher concentrations. by joining ge sensing & inspection technologies, telaire ? can now o ? er high-volume manufacturing capabilities, a global sales force, and additional engineering resources to support your sensing applicat...
Description Telaire 6613 CO2 Module

File Size 114.48K  /  4 Page

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    ODM8211P

ETC
Part No. ODM8211P
OCR Text ...ation offers the possibility of joining them to one package and transmitting them via the same channel. now these different kinds of information can be processed on computers and any other common hardware. furthermore the user can interact ...
Description MPEG 2 Decoder

File Size 28.03K  /  4 Page

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    CBTL01023GM

NXP Semiconductors
Part No. CBTL01023GM
OCR Text ...w soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadles...
Description 3.3 V, one differential channel, 2 : 1 multiplexer/demultiplexer switch for PCI Express Gen3

File Size 98.90K  /  14 Page

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