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For lift Found Datasheets File :: 509    Search Time::1.531ms    
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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA07M1317M_06 RA07M1317M RA07M1317M-101 RA07M1317M06
OCR Text ... the transistor chips which can lift off the bond wires). Thermal Design of the Heat Sink: At Pout=6.5W, VDD=7.2V and Pin=20mW each stage transistor operating conditions are: IDD @ T=45% VDD Pout Rth(ch-case) Pin Stage (C/W) (A) (W) (W) ...
Description RoHS Compliance , 135-175MHz 6.5W 7.2V, 2 Stage Amp. For PORTABLE RADIO

File Size 91.99K  /  8 Page

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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric Corporation
Mitsubishi Electric, Corp.
Part No. RA07M2127M-E01 RA07M2127M RA07M2127M-01
OCR Text ... the transistor chips which can lift off the bond wires). Thermal Design of the Heat Sink: At Pout=7W, V DD=7.2V and Pin=20mW each stage transistor operating conditions are: Stage 1st 2nd Pin (W) 0.02 2 Pout (W) 2 7 Rth(ch-case) (C/W) 4.5 2...
Description MITSUBISHI RF MOSFET MODULE 三菱射频MOSFET模块

File Size 60.78K  /  9 Page

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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA07M3340M_06 RA07M3340M RA07M3340M-101 RA07M3340M06
OCR Text ... the transistor chips which can lift off the bond wires). Thermal Design of the Heat Sink: At Pout=7W, VDD=7.2V and Pin=50mW each stage transistor operating conditions are: IDD @ T=40% VDD Pout Rth(ch-case) Pin Stage (W) (W) (V) (C/W) (A) s...
Description RoHS Compliance , 330-400MHz 7W 7.2V, 2Stage Amp. For PORTABLE RADIO

File Size 99.73K  /  8 Page

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    Mitsubishi Electric Sem...
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA07M4047M_06 RA07M4047M RA07M4047M-101 RA07M4047M06
OCR Text ... the transistor chips which can lift off the bond wires). Thermal Design of the Heat Sink: At Pout=7W, VDD=7.2V and Pin=50mW each stage transistor operating conditions are: IDD @ T=40% VDD Pout Rth(ch-case) Pin Stage (W) (W) (V) (C/W) (A) s...
Description RoHS Compliance , 400-470MHz 7W 7.2V, 2 Stage Amp. For PORTABLE RADIO

File Size 100.17K  /  8 Page

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    Mitsubishi Electric Sem...
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA07M4452M_06 RA07M4452M RA07M4452M-101 RA07M4452M06
OCR Text ... the transistor chips which can lift off the bond wires). Thermal Design of the Heat Sink: At Pout=7W, VDD=7.2V and Pin=50mW each stage transistor operating conditions are: IDD @ T=40% VDD Pout Rth(ch-case) Pin Stage (W) (W) (V) (C/W) (A) s...
Description RoHS Compliance , 440-520MHz 7W 7.2V, 2 Stage Amp. For PORTABLE RADIO

File Size 91.11K  /  8 Page

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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA07N4047M_06 RA07N4047M RA07N4047M-101 RA07N4047M06
OCR Text ... the transistor chips which can lift off the bond wires). Thermal Design of the Heat Sink: At Pout=7W, VDD=9.6V and Pin=20mW each stage transistor operating conditions are: IDD @ T=43% VDD Pout Rth(ch-case) Pin Stage (W) (W) (V) (C/W) (A) s...
Description RoHS Compliance , 400-470MHz 7.5W 9.6V, 2 Stage Amp. For PORTABLE RADIO

File Size 91.26K  /  8 Page

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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA07N4452M_06 RA07N4452M RA07N4452M06
OCR Text ... the transistor chips which can lift off the bond wires). Thermal Design of the Heat Sink: At Pout=7W, VDD=9.6V and Pin=20mW each stage transistor operating conditions are: IDD @ T=43% VDD Pout Rth(ch-case) Pin Stage (W) (W) (V) (C/W) (A) s...
Description RoHS Compliance , 440-520MHz 7.5W 9.6V, 2 Stage Amp. For PORTABLE RADIO

File Size 91.13K  /  8 Page

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    Mitsubishi Electric Sem...
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA08H1317M_06 RA08H1317M RA08H1317M-101 RA08H1317M06
OCR Text ... the transistor chips which can lift off the bond wires). Thermal Design of the Heat Sink: At Pout=8W, VDD=12.5V and Pin=20mW each stage transistor operating conditions are: IDD @ T=40% VDD Pout Rth(ch-case) Pin Stage (W) (W) (V) (C/W) (A) ...
Description RoHS Compliance , 135-175MHz 8W 12.5V, 2 stage Amp. For PORTABLE RADIO

File Size 94.44K  /  8 Page

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    Mitsubishi Electric Sem...
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA08N1317M_06 RA08N1317M RA08N1317M-101 RA08N1317M06
OCR Text ... the transistor chips which can lift off the bond wires). Thermal Design of the Heat Sink: At Pout=8W, VDD=9.6V and Pin=20mW each stage transistor operating conditions are: IDD @ T=50% VDD Pout Rth(ch-case) Pin Stage (W) (W) (V) (C/W) (A) s...
Description RoHS Compliance , 135-175MHz 8W 9.6V, 2 Stage Amp. For PORTABLE RADIO

File Size 92.10K  /  8 Page

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    Mitsubishi Electric Semicon...
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA13H1317M_06 RA13H1317M RA13H1317M-101 RA13H1317M06
OCR Text ... the transistor chips which can lift off the bond wires). Thermal Design of the Heat Sink: At Pout=13W, VDD=12.5V, and Pin=50mW, each stage transistor operating conditions are: IDD @ T=40% VDD Pout Rth(ch-case) Pin Stage (C/W) (A) (W) (W...
Description RoHS Compliance , 135-175MHz 13W 12.5V, 2 Stage Amp. For MOBILE RADIO

File Size 103.73K  /  8 Page

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For lift Found Datasheets File :: 509    Search Time::1.531ms    
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