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HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC405
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| OCR Text |
... die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 deg. C and a ... |
| Description |
InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 10.0 GHz
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| File Size |
210.47K /
6 Page |
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it Online |
Download Datasheet
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HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC448
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| OCR Text |
... die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 deg. C and a ... |
| Description |
GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 19 - 25 GHz OUTPUT
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| File Size |
222.03K /
6 Page |
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it Online |
Download Datasheet |
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HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC449
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| OCR Text |
... die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 deg. C and a ... |
| Description |
GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 27 - 33 GHz OUTPUT
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| File Size |
221.78K /
6 Page |
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it Online |
Download Datasheet |
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HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC606
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| OCR Text |
... die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 deg. C and a ... |
| Description |
GaAs InGaP HBT MMIC ULTRA LOW PHASE NOISE, DISTRIBUTED AMPLIFIER, 2 - 18 GHz
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| File Size |
385.85K /
6 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MAAA2000G
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| OCR Text |
...ie-mounted using Au/Sn eutectic preforms or a thermally conductive epoxy. The package surface should be clean and flat before attachment. Eutectic Die Attach: A. An 80/20 Au/Sn preform is recommended with a work surface temperature of appro... |
| Description |
GaAs MMIC Voltage Variable Absorptive Attenuator DC - 12 GHz
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| File Size |
61.20K /
3 Page |
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it Online |
Download Datasheet |
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MA-Com
MACOM[Tyco Electronics]
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| Part No. |
MASW6010G
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| OCR Text |
... die-mounted with AuSn eutectic preforms or with thermally conductive epoxy. The package surface should be clean and flat before attachment. Eutectic Die Attach: A. A 80/20 gold/tin preform is recommended with a work surface temperature of ... |
| Description |
DC-6 GHz GaAs SPDT switch
GaAs SPDT Switch DC-6 GHz
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| File Size |
90.35K /
2 Page |
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it Online |
Download Datasheet |
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MA-Com
MACOM[Tyco Electronics]
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| Part No. |
MASW8000
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| OCR Text |
... die-mounted with AuSn eutectic preforms or with thermally conductive epoxy. The package surface should be clean and flat before attachment. Eutectic Die Attach: A. A 80/20 gold/tin preform is recommended with a work surface temperature of ... |
| Description |
DC-8 GHz GaAs SPDT switch
GaAs SPDT Switch DC - 8 GHz
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| File Size |
84.44K /
2 Page |
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it Online |
Download Datasheet |
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ONSEMI[ON Semiconductor]
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| Part No. |
MR2510 MR2502 MR2504 MR2500-D
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| OCR Text |
...int 183C Solder is available as preforms or paste. The paste contains both the metal and flux and can be dispensed rapidly. The solder preform requires the application of a flux to assure good wetting of the solder. The type of flux used de... |
| Description |
25A 1000V Silicon Rectifier
Medium-Current Silicon Rectifiers
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| File Size |
91.78K /
8 Page |
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it Online |
Download Datasheet |
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ONSEMI[ON Semiconductor]
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| Part No. |
TRA2532 TRA2532-D
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| OCR Text |
...int 183C Solder is available as preforms or paste. The paste contains both the metal and flux and can be dispensed rapidly. The solder preform requires the application of a flux to assure good wetting of the solder. The type of flux used de... |
| Description |
Overvoltage Transient Suppressor
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| File Size |
61.83K /
8 Page |
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it Online |
Download Datasheet |
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ONSEMI[ON Semiconductor]
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| Part No. |
TRA3225 TRA3225-D TRA3225/D
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| OCR Text |
...int 183C Solder is available as preforms or paste. The paste contains both the metal and flux and can be dispensed rapidly. The solder preform requires the application of a flux to assure good wetting of the solder. The type of flux used de... |
| Description |
Medium-Current Silicon Rectifier 中等电流硅整
Medium - Current Silicon Rectifier
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| File Size |
71.20K /
8 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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