| |
|
 |
Micross Components
|
| Part No. |
HMC240A
|
| OCR Text |
... schedule. wire bonding ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. t hermosonic wirebonding with a nominal stage temperature of 150 deg. c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to... |
| Description |
Telecom Infrastructure
|
| File Size |
881.46K /
9 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
M/A-COM Technology Solu...
|
| Part No. |
MASW4060G-15
|
| OCR Text |
... wire bonding a. ball or wedge with 1.0 mil diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is r... |
| Description |
GaAs SP4T Switch DC - 4.0 GHz
|
| File Size |
504.72K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Micross Components
|
| Part No. |
HMC322
|
| OCR Text |
... schedule. wire bonding ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150 deg. c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 ... |
| Description |
Telecom Infrastructure
|
| File Size |
828.97K /
9 Page |
View
it Online |
Download Datasheet |
| |
|
|
Micross Components
|
| Part No. |
HMC392
|
| OCR Text |
... schedule. wire bonding ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150 c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams... |
| Description |
Point-to-Point Radios
|
| File Size |
841.92K /
9 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
