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  0314-2 Datasheet PDF File

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    Melexis Microelectronic
Part No. MLX90314AB
Description Programmable IR Sensor Interface

File Size 818.54K  /  28 Page

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Amphenol Communications Solutions

Part No. 68031-415HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 15 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Panasonic Battery Group
Part No. UF703141FU
Description Lithium Ion

File Size 505.47K  /  1 Page

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Amphenol Communications Solutions

Part No. 68031-424HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 24 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
Tech specs    

Official Product Page

    0436500314

Molex Electronics Ltd.
Part No. 0436500314
Description
File Size 152.52K  /  3 Page

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Amphenol Communications Solutions

Part No. 68031-433HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
Tech specs    

Official Product Page

    0743003143 74300-3143

Molex Electronics Ltd.
Part No. 0743003143 74300-3143
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, with Guide, 144 Circuits, Mounted Height 13.00mm (.512"), Press-Fit P
2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, with Guide, 144 Circuits, Mounted Height 13.00mm (.512), Press-Fit Pin Length 3.00mm (.118)

File Size 201.57K  /  4 Page

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Amphenol Communications Solutions

Part No. 68031-420HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
Tech specs    

Official Product Page

    0850031483 85003-1483

Molex Electronics Ltd.
Part No. 0850031483 85003-1483
Description 2.54mm (.100") Pitch DIN 41612 Header, Style C, Right Angle, Through Hole, 0.6渭m24渭") Selective Gold (Au), 96 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Style C, Right Angle, Through Hole, 0.6μm24μ) Selective Gold (Au), 96 Circuits, Lead free

File Size 78.15K  /  3 Page

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Amphenol Communications Solutions

Part No. 91900-31441LF
Description Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Conan Vertical Header, Surface Mount, 41 Positions, 1.00mm (0.039in) Pitch
Tech specs    

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    0743003145 74300-3145

Molex Electronics Ltd.
Part No. 0743003145 74300-3145
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, with Guide, 144 Circuits, Mounted Height 15.00mm (.591"), Press-Fit Pi
2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, with Guide, 144 Circuits, Mounted Height 15.00mm (.591), Press-Fit Pin

File Size 136.17K  /  3 Page

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Amphenol Communications Solutions

Part No. 86503-148HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 48 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    31403-3100 0314033100

Molex Electronics Ltd.
Part No. 31403-3100 0314033100
Description 2.54mm (.100) MX64 Sealed Single Row Crimp Housing

File Size 709.77K  /  6 Page

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Amphenol Communications Solutions

Part No. 10127403-14H1400LF
Description PwrBlade® ULTRA Connector System, Power Connectors, Receptacle, 10HP+12S Vertical Through Hole
Tech specs    

Official Product Page

    31402-6110 0314026110

Molex Electronics Ltd.
Part No. 31402-6110 0314026110
Description 2.54mm (.100) MX64 Sealed Single Row Crimp Housing, GET Terminal, Black, 6Circuits, Mating Part: Keying A, Lock CPA

File Size 846.90K  /  7 Page

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Amphenol Communications Solutions

Part No. 130-3142-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, APP.
Tech specs    

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    0314026100 31402-6100

Molex Electronics Ltd.
Part No. 0314026100 31402-6100
Description 2.54mm (.100) MX64 Sealed Single Row Crimp Housing, GET Terminal, Black, 6Circuits, Mating Part: Keying A, Lock None

File Size 846.91K  /  7 Page

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Amphenol Communications Solutions

Part No. 10121036-S03-145LF
Description Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 6 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    26-60-3140 0026603140

Molex Electronics Ltd.
Part No. 26-60-3140 0026603140
Description 3.96mm (.156) Pitch KK Solid Header, Right Angle, without Peg, 14 Circuits, Tin (Sn) Plating

File Size 245.34K  /  10 Page

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Amphenol Communications Solutions

Part No. 55510-314LF
Description <span style=\\background-color: #FFFF00\\><b>PREFERRED P/N SERIES FOR NEW PROJECT: 10131937</b></span><br><br>Minitek® 2.00mm, Board to Board Connector, PCB Mounted Receptacle , Vertical , Surface Mount, Double row, 14 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

For 0314-2 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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