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  1N4007-1300 Datasheet PDF File

For 1N4007-1300 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    EPC-1300-3.0-1

EPIGAP optoelectronic GmbH
Part No. EPC-1300-3.0-1
Description Photodiode-Chip

File Size 121.01K  /  2 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. XPN1300ANC
Description N-ch MOSFET, 100 V, 30 A, 0.0133 Ω@10V, TSON Advance(WF)
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    EPC-1300-3.0-2

EPIGAP optoelectronic GmbH
Part No. EPC-1300-3.0-2
Description Photodiode-Chip

File Size 122.22K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-109401300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    EPC-1300-1.0-2

EPIGAP optoelectronic GmbH
Part No. EPC-1300-1.0-2
Description Photodiode-Chip

File Size 122.56K  /  2 Page

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Amphenol Communications Solutions

Part No. 54121-407061300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    EPC-1300-1.0-1 EPC-1.00-1.0-1

EPIGAP optoelectronic GmbH
Part No. EPC-1300-1.0-1 EPC-1.00-1.0-1
Description Photodiode-Chip

File Size 119.99K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-107241300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    EPC-1300-1.0-0 EPC-13.0-1.0-0

EPIGAP optoelectronic GmbH
Part No. EPC-1300-1.0-0 EPC-13.0-1.0-0
Description Photodiode-Chip

File Size 120.43K  /  2 Page

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Amphenol Communications Solutions

Part No. 54121-112041300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ELC-1300-17

EPIGAP optoelectronic GmbH
Part No. ELC-1300-17
Description LED - Chip

File Size 84.60K  /  1 Page

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Amphenol Communications Solutions

Part No. 54121-112071300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 7 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    PDP-4R-1300 PDP-4R-50

Merrimac Industries, Inc.
Part No. PDP-4R-1300 PDP-4R-50
Description 100 MHz - 2000 MHz RF/MICROWAVE SPLITTER AND COMBINER, 3 dB INSERTION LOSS HERMATIC, 14 PIN
Analog IC 模拟IC
0 POWER DIVIDERS / COMBINERS

File Size 63.02K  /  1 Page

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Amphenol Communications Solutions

Part No. 54242-106301300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    CAS-1300

Level One
Part No. CAS-1300
Description Megapixel 1/3 CCD high-definition (HD) resolution 2.8 ~ 8.5 mm adjustable Vari-focal length for wide angle surveillance

File Size 207.94K  /  3 Page

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Amphenol Communications Solutions

Part No. 69913-002
Description 1x4 PCB Header, Low Profile Right Angle, 3.81mm (0.15inch) Solder tail, Off White
Tech specs    

Official Product Page

    EPC-1300-3.0-3

EPIGAP optoelectronic GmbH
Part No. EPC-1300-3.0-3
Description Photodiode-Chip

File Size 119.90K  /  2 Page

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Amphenol Communications Solutions

Part No. 67013-005LF
Description Berg Duflex Housing, single row, 5 Position.
Tech specs    

Official Product Page

    EPC-1300-3.0-4

EPIGAP optoelectronic GmbH
Part No. EPC-1300-3.0-4
Description Photodiode-Chip

File Size 122.13K  /  2 Page

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Amphenol Communications Solutions

Part No. 67013-007LF
Description Berg Duflex Housing, single row, 7 Position.
Tech specs    

Official Product Page

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