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  5116 Datasheet PDF File

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    MSM511664C

OKI electronic componets
Part No. MSM511664C
Description 65536-Word X 16-Bit DYNAMIC RAM : FAST PAGE MODE TYPE (BYTE WRITE)

File Size 305.76K  /  16 Page

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Rochester Electronics LLC

Part No. 87C51-16/BUA
Description 87C51 - Microcontroller; 8-Bit with EPROM Memory
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0643251162

Molex Electronics Ltd.
Part No. 0643251162
Description 2.80mm (.110), CMC Wire Seal Receptacle, Red

File Size 132.12K  /  2 Page

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Rochester Electronics LLC

Part No. MR87C51-16/B
Description 87C51 - 8-Bit CHMOS Microcontroller
Tech specs    

Official Product Page

    CD511225 CD511625

POWEREX[Powerex Power Semiconductors]
Part No. CD511225 CD511625
Description Dual Diode POW-R-BLOK?/a> Modules 250 Amperes/1200-1600 Volts
Dual Diode POW-R-BLOK⑩ Modules 250 Amperes/1200-1600 Volts
Dual Diode POW-R-BLOK Modules 250 Amperes/1200-1600 Volts

File Size 70.41K  /  4 Page

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Rochester Electronics LLC

Part No. MD87C51-16/B
Description 87C51 - 8-Bit CHMOS Microcontroller
Tech specs    

Official Product Page

   
Part No. HM511664LJ-10
Description x16 Fast Page Mode DRAM

File Size 1,179.95K  /  30 Page

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Amphenol Communications Solutions

Part No. 95615-116LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Header- Through Mount - Double row - 16 Positions - 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    Toshiba
Part No. TC5116400J
Description 4194304 word x 4 Bit Dynamic Ram

File Size 1,096.64K  /  25 Page

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Amphenol Communications Solutions

Part No. 69155-116LF
Description Quickie Slimline Header, Wire to Board connector, Through Hole, Right Angle, Double Row, 16 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    Samsung Electronics Inc
Part No. K4H511638D
Description IC,SDRAM,DDR,4X8MX16,CMOS,TSSOP,66PIN,PLASTIC

File Size 53.66K  /  12 Page

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Amphenol Communications Solutions

Part No. 69155-116
Description Quickie Slimline Header, Through Hole, Double Row, 16 Positions, 2.54 mm (0.1 in.), Right Angle Header 0.76 um (30 u\\.) GXT™ Mating Plating
Tech specs    

Official Product Page

    TC511664BZ TC511664B

Toshiba Semiconductor
Part No. TC511664BZ TC511664B
Description 65536 word x 16 bit DRAM
65,536 WORD x 16 BIT DYNAMIC RAM

File Size 1,581.20K  /  34 Page

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Amphenol Communications Solutions

Part No. 87185-116HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    90635-1161 0906351161

Molex Electronics Ltd.
Part No. 90635-1161 0906351161
Description 1.27mm (.050) Pitch QF-50, Single Beam, Vertical MIL/DIN Version, 0.10μm (4u) Gold (Au), 16 Circuits

File Size 219.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 79425-116HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 16 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    HM5116100S-5

Hitachi Semiconductor
Part No. HM5116100S-5
Description 16,777,216-word x 1-bit Dynamic RAM

File Size 309.50K  /  24 Page

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Amphenol Communications Solutions

Part No. 131-5116-21D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0511641405

Molex Electronics Ltd.
Part No. 0511641405
Description 2.50mm (.098) Wire-to-Board Retainer, 14 circuits

File Size 89.65K  /  2 Page

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Amphenol Communications Solutions

Part No. 88951-161PLF
Description 4 Row Signal Header,24 position Straight, Solder-to-Board, Wide body
Tech specs    

Official Product Page

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