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Texas Instruments |
| Part No. |
HPA00782DRLR
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| Description |
Low-Capacitance 4-Channel +/-15-kV ESD Protection Array for High-Speed Data Interfaces 6-SOT-5X3 -40 to 85
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| Tech specs |
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Get Free Sample |
Official Product Page
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Coilcraft Inc |
| Part No. |
RFB0807-821L
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| Description |
General Purpose Inductor, 820uH, 10%, 1 Element, Ferrite-Core, ROHS COMPLIANT
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| Tech specs |
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Official Product Page
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Coilcraft Inc |
| Part No. |
RFB0807-822L
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| Description |
General Purpose Inductor, 8200uH, 10%, 1 Element, Ferrite-Core, ROHS COMPLIANT
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| Tech specs |
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Official Product Page
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Coilcraft Inc |
| Part No. |
RFB0807-820L
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| Description |
General Purpose Inductor, 82uH, 10%, 1 Element, Ferrite-Core, ROHS COMPLIANT
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10078239-10003LF
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| Description |
DDR3 Memory Module Sockets, Storage and Server System, Very low profile (VLP) Through Hole, 240 Position Memory Socket.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
14-44-2106 70475-0950 A-70475-0950
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| Description |
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 0.38μm (15μ) Gold (Au), 6 Circuits
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 0.38μm (15μ) Gold (Au), 6 Circuits
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| File Size |
151.16K /
3 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10078239-10002LF
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| Description |
DDR3 Memory Module Sockets, Storage and Server System, Very low profile (VLP) Through Hole, 240 Position Memory Socket.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
14-44-2107 70475-0951 A-70475-0951
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| Description |
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 0.38μm (15μ) Gold (Au), 7 Circuits
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 0.38μm (15μ) Gold (Au), 7 Circuits
|
| File Size |
151.17K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10078239-11101LF
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| Description |
DDR3 Memory Module Sockets, Storage and Server System, Very low profile (VLP) Through Hole, 240 Position Memory Socket.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
14-44-2110 A-70475-0954
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| Description |
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 0.38μm (15μ) Gold (Au), 10 Circuits
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 0.38μm (15μ) Gold (Au), 10 Circuits
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| File Size |
151.17K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10078239-11123LF
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| Description |
DDR3 UDIMM, Storage and Server Connector, Very Low Profile, Vertical, Through Hole, 240 Position, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
14-44-2113 A-70475-0957
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| Description |
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 0.38μm (15μ) Gold (Au), 13 Circuits
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 0.38μm (15μ) Gold (Au), 13 Circuits
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| File Size |
151.13K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10078239-11104LF
|
| Description |
DDR3 Memory Module Sockets, Storage and Server System, Very low profile (VLP) Through Hole, 240 Position Memory Socket.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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