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  74442-0114 Datasheet PDF File

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    3M Company
Part No. 20116-82 20108-84 20106-82 20114-82 20110-84 20110-82 20110-85 20116-84 20106-84 20117-85 20114-84
Description
File Size 32.50K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    T8302F 0011-40-2230 001140-2230

Molex Electronics Ltd.
Part No. T8302F 0011-40-2230 001140-2230
Description Terminator Die
File Size 19.43K  /  1 Page

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Amphenol Communications Solutions
Part No. 10114828-10114LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
Tech specs 　 　

Official Product Page

    T8302B 1140-2006 0011-40-2006 001140-2006

Molex Electronics Ltd.
Part No. T8302B 1140-2006 0011-40-2006 001140-2006
Description Terminator Die
File Size 21.32K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs 　 　

Official Product Page

    T8377B 001140-2195 11-40-2195 0011-40-2195

Molex Electronics Ltd.
Part No. T8377B 001140-2195 11-40-2195 0011-40-2195
Description Terminator Die
File Size 19.42K  /  1 Page

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Amphenol Communications Solutions
Part No. 10114830-10114LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
Tech specs 　 　

Official Product Page

    836814 0011-40-4752 001140-4752

Molex Electronics Ltd.
Part No. 836814 0011-40-4752 001140-4752
Description Anvil
File Size 11.50K  /  1 Page

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Amphenol Communications Solutions
Part No. 10114508-D0J-20DLF
Description XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
Tech specs 　 　

Official Product Page

    11-40-2009 T8307A 1140-2009 0011-40-2009 001140-2009

Molex Electronics Ltd.
Part No. 11-40-2009 T8307A 1140-2009 0011-40-2009 001140-2009
Description Terminator Die
File Size 19.42K  /  1 Page

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Amphenol Communications Solutions
Part No. 10114828-10102LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
Tech specs 　 　

Official Product Page

    11-40-2002 T8300B 1140-2002 0011-40-2002 001140-2002

Molex Electronics Ltd.
Part No. 11-40-2002 T8300B 1140-2002 0011-40-2002 001140-2002
Description Terminator Die
File Size 22.13K  /  3 Page

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Amphenol Communications Solutions
Part No. 10114868-L0J-10DLF
Description XCede® High Speed Backplane Connectors, 3 wall left header.
Tech specs 　 　

Official Product Page

    11-40-2083 T8300J 1140-2083 0011-40-2083 001140-2083

Molex Electronics Ltd.
Part No. 11-40-2083 T8300J 1140-2083 0011-40-2083 001140-2083
Description Terminator Die
File Size 19.89K  /  1 Page

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Amphenol Communications Solutions
Part No. 10114508-00J-20DLF
Description XCede® High Speed Backplane Connectors, 2 wall header.
Tech specs 　 　

Official Product Page

    11-40-2143 1140-2143 0011-40-2143 001140-2143 T8358G

Molex Electronics Ltd.
Part No. 11-40-2143 1140-2143 0011-40-2143 001140-2143 T8358G
Description Terminator Die
File Size 19.75K  /  1 Page

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Amphenol Communications Solutions
Part No. 10114492-008LF
Description HPCE R/A REC 32P24S
Tech specs 　 　

Official Product Page

    3414.0112.XX 3414.0123.XX 3414.0120.XX 3414.0113.XX 3414.0114.XX 3414.0115.XX 3414.0119.XX 3414.0121.XX 3414.0124.XX USF

Schurter Inc.
Part No. 3414.0112.XX 3414.0123.XX 3414.0120.XX 3414.0113.XX 3414.0114.XX 3414.0115.XX 3414.0119.XX 3414.0121.XX 3414.0124.XX USF
Description Surface Mount Fuse, 1.05 x 0.55 mm, Super-Quick-Acting FF, 32 VDC
File Size 420.66K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114868-10J-10DLF
Description XCede® High Speed Backplane Connectors, 4 wall header.
Tech specs 　 　

Official Product Page

For 74442-0114 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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