|
|
 |
TDK, Corp.
|
Part No. |
OTR122SLN OTR122SCN OTR122SCP OTR122SLP OTR121SLP OTR125SCP
|
Description |
MCU 20LD 20 MHZ 2K EPROM with HV I/O, 0C to 70C, 20-CERDIP, TUBE 28LD SOIC, 4 MHz, -40C to 85C, 28-SOIC 300mil, T/R 28LD SSOP, 20 MHz, -40C to 85C, 28-SSOP 208mil, T/R MCU 20LD 20 MHZ 2K EPROM with HV I/O, -40C to 85C, 20-SSOP 208mil, TUBE 28LD SSOP, 4 MHz, 0C to 70C, 28-SSOP 208mil, T/R MCU CMOS 14LD 1K EPRM, 0C to 70C, 14-SOIC 150mil, TUBE
|
File Size |
104.12K /
1 Page |
View
it Online |
Download Datasheet
|
|
|
 |
|
Part No. |
80131000 80132000 80141000 80142000
|
Description |
1.5A Dual MOSFET Drvr, -40C to 85C, 8-DFN, T/R 1.5A Dual MOSFET Drvr, -40C to 85C, 8-SOIC 150mil, T/R 1.5A DUAL MOSFET DRIVER, -40C to 85C, 8-MSOP, TUBE 1.5A Dual MOSFET Drvr, -55C to 125C, 8-CERDIP 300mil, TUBE
|
File Size |
70.22K /
1 Page |
View
it Online |
Download Datasheet
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
87911-5411 0879115411
|
Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 54 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 54 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 54 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
File Size |
360.88K /
6 Page |
View
it Online |
Download Datasheet
|
|

Price and Availability
|