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Agilent Technologies
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Part No. |
HSMN-C110 HSMN-C150 HSMN-C170 HSMN-C190 HSMN-C191
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OCR Text |
...om c
Package Dimensions
LED DIE CATHODE MARK
LED DIE
CATHODE MARK
1.0 (0.039)
1.25 (0.049)
2.6 (0.102 )
0.62 (0.024) 2...100 A) Led Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temp... |
Description |
(HSMx-C110/170/190/191/150) SMT Chip LED
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File Size |
262.82K /
8 Page |
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it Online |
Download Datasheet
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New Jersey Semi-Conductor P...
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Part No. |
MTP2N80
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OCR Text |
...ource pin and the center of the die) internal source inductance (measured from the source pin, q 25" from the package to the source bond pad) ld \8 5 (typ) 12.5 (typ) " nh internal package inductance (to-220) internal drain inductance (meas... |
Description |
Power Field Effect Transistor
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File Size |
94.17K /
2 Page |
View
it Online |
Download Datasheet
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Price and Availability
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