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For filler Found Datasheets File :: 415    Search Time::2.937ms    
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    MAX1887EEE

Maxim Integrated Products
Part No. MAX1887EEE
OCR Text ...1.3 mil dia.) Epoxy with silica filler 05-3801-0006 Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1 IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metall...
Description 120 SAN GABRIEL DR. SUNNYVALE, CA 94086

File Size 46.28K  /  8 Page

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    MAX3971AUGP

Maxim Integrated Products
Part No. MAX3971AUGP
OCR Text ...1.0 mil dia.) Epoxy with silica filler Buildsheet # 05-4001-0008 Class UL94-V0 Level 1 IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G....
Description PLASTIC ENCAPSULATED DEVICES

File Size 57.25K  /  7 Page

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    MAX1644EAE

Maxim Integrated Products
Part No. MAX1644EAE
OCR Text ...2.0 mil dia.) Epoxy with silica filler Buildsheet # 05-1101-0105 Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1 IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Ba...
Description PLASTIC ENCAPSULATED DEVICES

File Size 134.25K  /  8 Page

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    MAX6101EUR

MAXIM - Dallas Semiconductor
Maxim Integrated Products
Part No. MAX6101EUR
OCR Text ...1.0 mil dia.) Epoxy with silica filler # 05-0901-0179 Class UL94-V0 B12 (Standard 1.2 micron silicon gate CMOS) 117 California or Oregon, USA Malaysia or Thailand March, 2001 Level 1 IV. Die Information A. Dimensions: B. Passivation: ...
Description PLASTIC ENCAPSULATED DEVICES

File Size 87.50K  /  8 Page

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    MAXIM - Dallas Semiconductor
MAXIM[Maxim Integrated Products]
Part No. MAX1555EZK
OCR Text ...1.0 mil dia.) Epoxy with silica filler Buildsheet # 05-9000-0523 Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1 IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Ba...
Description PLASTIC ENCAPSULATED DEVICES

File Size 90.83K  /  8 Page

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    MAX6605MXK

Maxim Integrated Products
Part No. MAX6605MXK
OCR Text ... (1 mil dia.) Epoxy with silica filler Buildsheet # 05-2901-0003 Class UL94-V0 Level 1 IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G....
Description RELIABILITY REPORT FOR PLASTIC ENCAPSULATED DEVICES

File Size 86.09K  /  8 Page

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    MAX2530 MAX2531 MAX2531EGI MAX2539 MAX2351 MAX2358 MAX2538

Maxim Integrated Products, Inc.
MAXIM[Maxim Integrated Products]
MAXIM - Dallas Semiconductor
Part No. MAX2530 MAX2531 MAX2531EGI MAX2539 MAX2351 MAX2358 MAX2538
OCR Text ...1.3 mil dia.) Epoxy with silica filler # 05-9000-0247 Class UL94-V0 Level 1 IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G. Bondpad Di...
Description PLASTIC ENCAPSULATED DEVICES

File Size 102.95K  /  8 Page

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    ATM-0007 ATM-0018 ATM-0020 ATM-0031 ATM-0052 ATM-0055 ATM-0059 ATM-0068 ATM-0073 ATM-0087 ATM-0089 ATM-0093 ATM-0112 ATM

List of Unclassifed Manufacturers
ETC
Part No. ATM-0007 ATM-0018 ATM-0020 ATM-0031 ATM-0052 ATM-0055 ATM-0059 ATM-0068 ATM-0073 ATM-0087 ATM-0089 ATM-0093 ATM-0112 ATM-0116
OCR Text ...C Typical Uncured Properties filler Type Viscosity @ 25C Thixotropic Index Work Life @ 25C Est. Storage Life @ -40C Cure Process Data Weight Loss on Cure Recommended Cure Condition Snap Cure Profile Physiochemical Properties - Post Cure ...
Description ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE

File Size 328.26K  /  3 Page

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    MIC5400YWM MIC540005 MIC540011 MIC5400 MIC5400BWM

Micrel Semiconductor
http://
Part No. MIC5400YWM MIC540005 MIC540011 MIC5400 MIC5400BWM
OCR Text ...Revision Bit 3 0 [Fixed Pattern filler Bits] 1 0 1 0 1 0 1 0 1 0 1 0 1 0 Table 2. Status Word Format January 2005 7 MIC5400 MIC5400 Applications Information Output Current Drive The MIC5400 includes several ways to program LED o...
Description Dual, 8-Output, 14-Bit LED Video Display Driver

File Size 618.45K  /  10 Page

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    Maxim Integrated Produc...
MAXIM[Maxim Integrated Products]
Part No. MAX1287EKA
OCR Text ...mil dia. ball Epoxy with silica filler #05-2101-0032 Class UL94-V0 Level 1 IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G. Bondpad Dim...
Description PLASTIC ENCAPSULATED DEVICES

File Size 89.76K  /  8 Page

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For filler Found Datasheets File :: 415    Search Time::2.937ms    
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