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ground-wire Datasheet PDF File

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				Intersema Sensoric SA
Part No.	MS7970-A0.2 MS7970-A0.5
OCR Text	...t Out+ : Positive output GND1 : Ground GND2 : Ground GND1 1 GND2 The European RoHS directive 2002/95/EC (Restriction of the use of ce...wire-bond the sensor. The quality of the wire-bonding is equipment and process dependant. For this r...
Description	PRESSURE SENSOR DIE (0-70 BAR)
File Size	215.26K / 5 Page	View it Online	Download Datasheet

				Intersema Sensoric SA
Part No.	MS7907-A0.2 MS7907-A0.5 MS7907-D
OCR Text	...utOut+ : Positive output GND1 : Ground GND2 : Ground GND1 1 GND2 The European RoHS directive 2002/95/EC (Restriction of the use of ce...wire-bond the sensor. The quality of the wire-bonding is equipment and process dependant. For this r...
Description	PRESSURE SENSOR DIE (0-7 BAR)
File Size	227.28K / 5 Page	View it Online	Download Datasheet

				Microchip Technology
Part No.	MCP9804-E/MC
OCR Text	...ed, v dd = 2.7v to 5.5v, gnd = ground and t a = -40c to +125c. parameters sym min typ max unit conditions temperature sensor accuracy -40...wire smbus/i 2 c interface serial port frequency f scl 0100 0 400 khz ( note 2 , note 4 ) low clock...
Description	±0.25°C Typical Accuracy Digital Temperature Sensor
File Size	890.98K / 52 Page	View it Online	Download Datasheet

				Intersema Sensoric SA
Part No.	MS7905-A0.2 MS7905-A0.5 MS7905-D MS7905-S
OCR Text	...t Out+ : Positive output GND1 : Ground GND2 : Ground GND1 1 GND2 The European RoHS directive 2002/95/EC (Restriction of the use of ce...wire-bond the sensor. The quality of the wire-bonding is equipment and process dependant. For this r...
Description	PRESSURE SENSOR DIE (0-5 BAR)
File Size	215.61K / 5 Page	View it Online	Download Datasheet

				Intersema Sensoric SA
Part No.	MS7904-A0.2 MS7904-A0.5 MS7904-S MS7904-D
OCR Text	...t Out+ : Positive output GND1 : Ground GND2 : Ground GND1 1 GND2 The European RoHS directive 2002/95/EC (Restriction of the use of ce...wire-bond the sensor. The quality of the wire-bonding is equipment and process dependant. For this r...
Description	PRESSURE SENSOR DIE (0-4 BAR)
File Size	215.57K / 5 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers ETC[ETC] Electronic Theatre Controls, Inc.
Part No.	HLY-3051
OCR Text	...ed. The case provides the gauge ground. Connect a ground wire to the screw at the bottom rear of the case. When the DIM terminal has 12 volts, it will dim the display for night viewing. The SND terminal is the voltage sensing input. To read...
Description	Series II HLY-3051 VOLTMETER Introduction Series II HLY-3051 VOLTMETER Introduction
File Size	45.85K / 4 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC28100 HMC281
OCR Text	...SS IS 0.100 (0.004) BACKSIDE IS GROUND BOND PADS ARE 0.100 (0.004) SQUARE BACKSIDE METALLIZATION: GOLD BOND PAD METALLIZATION: GOLD For p...wire length. Typical die-to-substrate spacing is 0.076 mm (3 mils). Gold ribbon of 0.076 mm x 0.013 ...
Description	GaAs MMIC MEDIUM POWER AMPLIFIER, 17 - 40 GHz
File Size	143.68K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC26100
OCR Text	... AMPLIFIERS - CHIP Backside is Ground Outline Drawing (See Die Handling, Mounting, Bonding Note) Vdd RF IN RF OUT ALL DIMENSION...wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). An RF bypass cap...
Description	GaAs MMIC MEDIUM POWER DISTRIBUTED AMPLIFIER, 20 - 40 GHz
File Size	183.74K / 6 Page	View it Online	Download Datasheet

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