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Intel
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| Part No. |
SA-1111 27824302
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| OCR Text |
...-analog (D-to-A) converters 256 mini-ball grid array (mBGA)
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Order Number: 278243-002 May 2000
Description
The SA-1111 is an integrated circuit incorporating a Universal Serial Bus (USB) controller, two PS/2 ports ... |
| Description |
StrongARM Microprocessor Companion Chip
From old datasheet system
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| File Size |
50.18K /
6 Page |
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Cypress Semiconductor Corp.
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| Part No. |
CY7C1051DV33-10ZSXI
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| OCR Text |
... pin configurations [2] 48-ball mini fbga we v cc a 11 a 10 nc a 6 a 0 a 3 ce io 10 io 8 io 9 a 4 a 5 io 11 io 13 io 12 io 14 io 15 v ss a 9 a 8 oe v ss a 7 io 0 bhe nc a 17 a 2 a 1 ble v cc io 2 io 1 io 3 io 4 io 5 io 6 io 7 a 15 a 14 a 13... |
| Description |
8-Mbit (512K x 16) Static RAM
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| File Size |
490.42K /
11 Page |
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Intel, Corp.
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| Part No. |
N80C186XL-12 A80C188XL-25
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| OCR Text |
...ansfer consumes 2 bus cycles (a mini- mum of 8 clocks), one cycle to fetch data and the other to store data. timer/counter unit the 80c186xl...grid array pins facing up pins facing down 272431 6 note: xxxxxxxxc indicates the intel fpo number.... |
| Description |
IC SMD
16-BIT, 25 MHz, MICROPROCESSOR, CPGA68 CERAMIC, PGA-68
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| File Size |
506.47K /
48 Page |
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Cypress Semiconductor Corp.
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| Part No. |
CY7C1041DV33-12BVXE CY7C1041DV33-12ZSXE
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| OCR Text |
...ation is preliminary. 48-ball mini fbga we v cc a 11 a 10 nc a 6 a 0 a 3 ce i/o 2 i/o 0 i/o 1 a 4 a 5 i/o 3 i/o 5 i/o 4 i/o 6 i/o 7 v ss a 9 a 8 oe v ss a 7 i/o 8 bhe nc a 17 a 2 a 1 ble v cc i/o 9 i/o 10 i/o 11 i/o 12 i/o 13 i/o 14 i/o... |
| Description |
4-Mbit (256K x 16) Static RAM
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| File Size |
381.67K /
14 Page |
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Vishay Siliconix
VISHAY DALE
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| Part No. |
EB62C14SGX15 EB614R12SGX15 EB614R6SGX15 EB614R10SGX15 EB614R14SGX15 EB633R12SGX15 EB622R10SGX15 EB63D12SGX15 EB631R12SGX15 EB631R14SGX15 EB631R6SGX15 EB631R10SGX15 EB611R6SGX15 EB612R6SGX15 EB622R6SGX15 EB613R6SGX15 EB632R14SGX15 EB632R10SGX15 EB632R12SGX15 EB65D6SGX15 EB611R10SGX15 EB611R14SGX15 EB612R12SGX15 EB612R14SGX15 EB611R12SGX15 EB612R10SGX15 EB61C10SGX15 EB623R6SGX15 EB62D10SGX15 EB62D12SGX15 EB62D14SGX15 EB62D6SGX15 EB63D6SGX15 EB624R14SGX15 EB652R14SGX15 EB621R14SGX15 EB654R14SGX15 EB653R14SGX15 EB633R14SGX15 EB613R14SGX15 EB622R14SGX15 EB651R14SGX15 EB623R14SGX15 EB634R14SGX15 EB61C6SGX15 EB61C12SGX15 EB61C14SGX15 EB613R10SGX15 EB613R12SGX15 EB65D10SGX15 EB65D12SGX15 EB65D14SGX15 EB63D14SGX15 EB624R12SGX15 EB65K50SGXF EB65K50SGW EB61K49SGYF EB61K49SGFX EB613R14SGXFS EB621R14SGXFS EB612R14SGXFS EB613R14SGFXFS EB614R14SGXFS EB611R14SGFXFS EB62D49SGFW EB62D49SGX EB62D49SGFXF EB63C40SGFXF EB62C50SGFX EB63D35SGFW EB63D35SGY EB61D14SGX15 EB62K10SGX15 EB61K10SGX15 EB63K10SGX15 EB62K12SGX15 EB613R28SGFXS
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| OCR Text |
...ied at room temperature for 3 h mini mum, insulation resistance was greater than 5000 m durability: after 500 cycles of insertion and with...grid patterns: 0.125" c-c x 0.150" (3.17 mm x 3.81 mm), 0.125" c-c x 0.200" (3.17 mm x 5.08 mm) and ... |
| Description |
Edgeboard Connectors, Dual Readout, 0.125 (3.17 mm) C-C, Standard and Right Angle Terminals
100 CONTACT(S), FEMALE, STRAIGHT SINGLE PART CARD EDGE CONN, WIRE WRAP
98 CONTACT(S), FEMALE, STRAIGHT SINGLE PART CARD EDGE CONN, WIRE WRAP
28 CONTACT(S), FEMALE, RIGHT ANGLE SINGLE PART CARD EDGE CONN, SOLDER
98 CONTACT(S), FEMALE, STRAIGHT SINGLE PART CARD EDGE CONN, SOLDER
80 CONTACT(S), FEMALE, STRAIGHT SINGLE PART CARD EDGE CONN, SOLDER
100 CONTACT(S), FEMALE, STRAIGHT SINGLE PART CARD EDGE CONN, SOLDER
70 CONTACT(S), FEMALE, STRAIGHT SINGLE PART CARD EDGE CONN, SOLDER
56 CONTACT(S), FEMALE, RIGHT ANGLE SINGLE PART CARD EDGE CONN, SOLDER
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| File Size |
184.39K /
4 Page |
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http://
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| Part No. |
AN-9037
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| OCR Text |
...d and new paste printed with a mini stencil. localized hot air can then be applied to reflow the solder and make the joint. due to the thermal performance of this component, and the typical high performance pwb it will be mounted on,... |
| Description |
8x8 MLP DriverMOS Packaging
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| File Size |
749.51K /
7 Page |
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http://
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| Part No. |
AN-9040
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| OCR Text |
...d and new paste printed with a mini stencil. localized hot air can then be applied to reflow the solder and make the joint. due to the thermal performance of this component, and the typical high performance pwb it will be mounted on,... |
| Description |
Power33 Packaging
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| File Size |
299.73K /
7 Page |
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it Online |
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