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Philips
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| Part No. |
BGY2016
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| OCR Text |
...t and free from burrs and loose particles. The heatsink should be rigid and not prone to bowing under thermal cycling conditions. The thickness of a solid heatsink should be not less than 5 mm to ensure a rigid assembly. A thin, even layer ... |
| Description |
UHF amplifier module
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| File Size |
63.47K /
12 Page |
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it Online |
Download Datasheet
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Philips
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| Part No. |
PCA167XSERIES PCA1673U/10/F2 PCA1675U/F2
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| OCR Text |
...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; f... |
| Description |
32 kHz watch circuits using a silver-oxide or a 3 V lithium battery
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| File Size |
56.23K /
12 Page |
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it Online |
Download Datasheet |
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VISAY[Vishay Siliconix]
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| Part No. |
84063
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| OCR Text |
...h up to 70% by weight of quartz particles. Antimony trioxide and brominated epoxy resin (no TBA) are added as flame retardents. Antimony and bromine amount to about 1.6 and 1.0% respectively. In use: In use, it is the content of hazardous s... |
| Description |
From old datasheet system
The Constituents of Semiconductor Components
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| File Size |
545.84K /
5 Page |
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it Online |
Download Datasheet |
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Price and Availability
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