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For pre-bent Found Datasheets File :: 694    Search Time::1.266ms    
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    TDA1557Q TDA1557

NXP Semiconductors N.V.
Philips Semiconductors
Part No. TDA1557Q TDA1557
OCR Text ... printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to t...
Description 2 x 22 W BTL stereo car radio power amplifier with speaker protection

File Size 87.75K  /  10 Page

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    HIROSE ELECTRIC Co., Ltd.
Hirose Electric USA, INC.
HIROSE[Hirose Electric]
Part No. DF4-9PA-2R28 DF4-02P-2R26 DF4-02PA-2R26 DF4-03P-2R26 DF4-03PA-2R26 DF4-04DP-2C DF4-04P-2R26 DF4-04PA-2R26 DF4-05P-2R26 DF4-05PA-2R26 DF4-06DP-2C DF4-06P-2R26 DF4-06PA-2R26 DF4-07P-2R26 DF4-07PA-2R26 DF4-08DP-2C DF4-08P-2R26 DF4-08PA-2R26 DF4-09P-2R26 DF4-09PA-2R26 DF4-10DP-2C DF4-10P-2C DF4-10P-2R26 DF4-10P-2R28 DF4-10PA-2R26 DF4-10PA-2R28 DF4-11P-2C DF4-11P-2R26 DF4-11P-2R28 DF4-11PA-2R26 DF4-11PA-2R28 DF4-12DP-2C DF4-12P-2C DF4-12P-2R26 DF4-12P-2R28 DF4-12PA-2R26 DF4-12PA-2R28 DF4-13P-2C DF4-13P-2R26 DF4-13P-2R28 DF4-13PA-2R26 DF4-13PA-2R28 DF4-14DP-2C DF4-14P-2C DF4-14P-2R26 DF4-14P-2R28 DF4-14PA-2R26 DF4-14PA-2R28 DF4-15P-2C DF4-15P-2R26 DF4-15P-2R28 DF4-15PA-2R26 DF4-15PA-2R28 DF4-16DP-2C DF4-18DP-2C DF4-20DP-2C DF4-22DP-2C DF4-24DP-2C DF4-26DP-2C DF4-28DP-2C DF4-2P-2C DF4-2P-2R28 DF4-2PA-2R28 DF4-30DP-2C DF4-32DP-2C DF4-3P-2C DF4-3P-2R28 DF4-3PA-2R28 DF4-4P-2C DF4-4P-2R28 DF4-4PA-2R28 DF4-5P-2C DF4-5P-2R28 DF4-5PA-2R28 DF4-6P-2C DF4-6P-2R28 DF4-6PA-2R28 DF4-7P-2C DF4-7P-2R28 DF4-7PA-2R28 DF4-8P-2C DF4-8P-2R28 DF4-8PA-2R28 DF4-9P-2C DF4-9P-2R28
OCR Text ...mping ) Height 4mm 3. Board Pre-fixed Mechanism The insertion state to the board is a light crimping, which enables the pre-fixed proce...bent up/down. Unit:mm Part Number DF4-04DP-2C (**) DF4-06DP-2C (**) DF4-08DP-2C (**) DF4-10DP-2C...
Description Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT06; No. of Contacts:8; Connector Shell Size:16; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Body Style:Straight 2毫米间距连接器直接安装在董事
CORD 18AWG 3COND SJT GRAY 2毫米间距连接器直接安装在董事
2mm Pitch Connector Directly Mounted on Board 2毫米间距连接器直接安装在董事
Circular Connector; MIL SPEC:MIL-C-5015 E/F/R; Body Material:Aluminum Alloy; Series:SG3106; Number of Contacts:19; Connector Shell Size:24; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Body Style:Straight 2毫米间距连接器直接安装在董事
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT06; No. of Contacts:6; Connector Shell Size:10; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Body Style:Straight
Circular Connector; No. of Contacts:26; Series:; Body Material:Aluminum; Connector Shell Size:16; Circular Contact Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:16-26
SIGN, SAFETY HELMETS MUST BE WORN, SAV; RoHS Compliant: NA
SIGN, HAND PROTECT MUST BE WORN, RP; RoHS Compliant: NA
RES 6.81K-OHM 0.1% 0.125W 25PPM THIN-FILM SMD-0805 TR-7-PA ROHS

File Size 232.31K  /  7 Page

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    APEX[Apex Microtechnology]
Part No. EK16
OCR Text ...sation and current limiting are pre-wired. Components not usually readily available in engineering labs are provided. External connection to...bent with pliers to secure it to the circuit board. 4. Examine the large heat sink. Notice that ther...
Description EVALUATION KIT FOR PA92/PA93 PIN-OUT

File Size 234.34K  /  4 Page

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    Hittite Microwave Corpo...
HITTITE[Hittite Microwave Corporation]
Part No. HMC300LM1
OCR Text ...up from room temperature to the pre-heat temperature to avoid damage due to thermal shock. Allow enough time between reaching pre-heat temperature and reflow for the solvent in the paste to evaporate and the flux to completely activate. Ref...
Description SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 25.5 - 33.5 GHz

File Size 273.50K  /  8 Page

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    Micrel Semiconductor,Inc.
MICREL[Micrel Semiconductor]
Part No. LM2575YWM LM2575 LM2575-12BN LM2575-12BT LM2575-12BU LM2575-12BWM LM2575-12WT LM2575-12WU LM2575-12YWM LM2575-3.3BN LM2575-3.3BT LM2575-3.3BU LM2575-3.3BWM LM2575-3.3WT LM2575-3.3WU LM2575-3.3YWM LM2575-5.0BN LM2575-5.0BT LM2575-5.0BU LM2575-5.0BWM LM2575-5.0WT LM2575-5.0WU LM2575-5.0YWM LM2575BN LM2575BT LM2575BU LM2575BWM LM2575WT LM2575WU
OCR Text ...down (buck) regulator Efficient pre-regulator for linear regulators On-card switching regulators Positive to negative converter (inverting B...bent or staggered leads option. Pin Configurations 5-LEAD TO-220 (T) GND 5- ON/OFF 4- FEEDBACK ...
Description    52kHz Simple 1A Buck Regulator

File Size 101.37K  /  9 Page

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    SHARP[Sharp Electrionic Components]
Part No. LZ2426J
OCR Text ...3 34 OV4 62 OOFD 72 64 54 59 49 PRE SCAN (4) OB (2) OUTPUT (512) 1 618, 1 24 60 84.5 (1st, 3rd FIELD) HD OV1 OV2 OV3 OV4 OTG 25.07 s (24...bent. - If a bent package is forced into place between a hard plate or the like, the package may be ...
Description Dual-power-supply (5 V/12 V) Operation 1/4-type B/W CCD Area Sensor with 320 k Pixels

File Size 102.41K  /  12 Page

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    ROHM[Rohm]
Part No. MCH022A4R7DK MCH02 MCH022A010CK MCH022A020CK MCH022A030CK MCH022A040CK MCH022A050CK MCH022A060DK MCH022A070DK MCH022A0R5CK MCH022A4R7CK
OCR Text ...re completely under the solder. Pre-heating at 150+/-10C for 1 to 2min Initial measurements prior to test shall be performed after the therm...bent till 1mm by 1.0mm/s. As per 4.17 of JIS C 5101-1. The specimens shall be soldered on the specif...
Description Multi-layer ceramic chip capacitors

File Size 66.36K  /  7 Page

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    ROHM[Rohm]
Part No. MCH438FN476ZP MCH43 MCH432FN476JP MCH432FN476KP MCH432FN476MP MCH432FN476ZP MCH433FN476JP MCH433FN476KP MCH433FN476MP MCH433FN476ZP MCH434FN476JP MCH434FN476KP MCH434FN476MP MCH434FN476ZP MCH435FN476JP MCH435FN476KP MCH435FN476MP MCH435FN476ZP MCH438FN476JP MCH438FN476KP MCH438FN476MP
OCR Text ...re completely under the solder. Pre-heating at 150+/-10C for 1 to 2min Initial measurements prior to test shall be performed after the therm...bent till 1mm by 1.0mm/s. As per 4.17 of JIS C 5101-1. The specimens shall be soldered on the specif...
Description Multi-layer ceramic chip capacitors

File Size 132.42K  /  11 Page

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    MCH558FN107ZP MCH55 MCH552FN107KP MCH552FN107MP MCH552FN107ZP MCH553FN107KP MCH553FN107ZP MCH554FN107KP MCH554FN107MP MC

ROHM[Rohm]
Part No. MCH558FN107ZP MCH55 MCH552FN107KP MCH552FN107MP MCH552FN107ZP MCH553FN107KP MCH553FN107ZP MCH554FN107KP MCH554FN107MP MCH554FN107ZP MCH555FN107KP MCH555FN107MP MCH555FN107ZP MCH558FN107KP MCH558FN107MP MCH553FN107MP
OCR Text ...re completely under the solder. Pre-heating at 150+/-10C for 1 to 2min Initial measurements prior to test shall be performed after the therm...bent till 1mm by 1.0mm/s. As per 4.17 of JIS C 5101-1. The specimens shall be soldered on the specif...
Description Multi-layer ceramic chip capacitors

File Size 162.89K  /  10 Page

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    ROHM[Rohm]
Part No. MNA028CN105MK MNA02
OCR Text ...re completely under the solder. Pre-heating at 150+/-10C for 1 to 2min Initial measurements prior to test shall be performed after the therm...bent till 1mm by 1.0mm/s. As per 4.17 of JIS C 5101-1. The specimens shall be soldered on the specif...
Description (1005 (0402) x 2 size, chip capacitor networks)

File Size 75.48K  /  7 Page

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For pre-bent Found Datasheets File :: 694    Search Time::1.266ms    
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