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  silicone-ceramic Datasheet PDF File

For silicone-ceramic Found Datasheets File :: 543    Search Time::1.187ms    
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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA07H3340M_06 RA07H3340M RA07H3340M-101 RA07H3340M06
OCR Text ... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o...
Description RoHS Compliance ,330-400MHz 7W 12.5V, 2 Stage Amp. For PORTABLE RADIO

File Size 92.03K  /  8 Page

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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA07M0608M-101 RA07M0608M
OCR Text ... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o...
Description RoHS Compliance ,66-88MHz 7W 7.2V, 2 Stage Amp. For PORTABLE RADIO

File Size 95.38K  /  8 Page

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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA07M1317M_06 RA07M1317M RA07M1317M-101 RA07M1317M06
OCR Text ... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o...
Description RoHS Compliance , 135-175MHz 6.5W 7.2V, 2 Stage Amp. For PORTABLE RADIO

File Size 91.99K  /  8 Page

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    RA07N3340M-101 RA07N3340M06 RA07N3340M

Mitsubishi Electric Sem...
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA07N3340M-101 RA07N3340M06 RA07N3340M
OCR Text ... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o...
Description RoHS Compliance , 330-400MHz 7.5W 9.6V 2 Stage Amp. For PORTABLE RADIO

File Size 91.55K  /  8 Page

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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA07M3340M_06 RA07M3340M RA07M3340M-101 RA07M3340M06
OCR Text ... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o...
Description RoHS Compliance , 330-400MHz 7W 7.2V, 2Stage Amp. For PORTABLE RADIO

File Size 99.73K  /  8 Page

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    Mitsubishi Electric Sem...
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA07M4047M_06 RA07M4047M RA07M4047M-101 RA07M4047M06
OCR Text ... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o...
Description RoHS Compliance , 400-470MHz 7W 7.2V, 2 Stage Amp. For PORTABLE RADIO

File Size 100.17K  /  8 Page

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    Mitsubishi Electric Sem...
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA07M4452M_06 RA07M4452M RA07M4452M-101 RA07M4452M06
OCR Text ... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o...
Description RoHS Compliance , 440-520MHz 7W 7.2V, 2 Stage Amp. For PORTABLE RADIO

File Size 91.11K  /  8 Page

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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA07N4047M_06 RA07N4047M RA07N4047M-101 RA07N4047M06
OCR Text ... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o...
Description RoHS Compliance , 400-470MHz 7.5W 9.6V, 2 Stage Amp. For PORTABLE RADIO

File Size 91.26K  /  8 Page

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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA07N4452M_06 RA07N4452M RA07N4452M06
OCR Text ... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o...
Description RoHS Compliance , 440-520MHz 7.5W 9.6V, 2 Stage Amp. For PORTABLE RADIO

File Size 91.13K  /  8 Page

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Download Datasheet

    Mitsubishi Electric Sem...
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA08H1317M_06 RA08H1317M RA08H1317M-101 RA08H1317M06
OCR Text ... a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wi...ceramic substrate in the module to crack by bending forces, either immediately when driving screws o...
Description RoHS Compliance , 135-175MHz 8W 12.5V, 2 stage Amp. For PORTABLE RADIO

File Size 94.44K  /  8 Page

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For silicone-ceramic Found Datasheets File :: 543    Search Time::1.187ms    
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