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  simm-72 Datasheet PDF File

For simm-72 Found Datasheets File :: 478    Search Time::1.235ms    
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    KMM5324000BSWG KMM5328000BSW KMM5324000BSW

SAMSUNG[Samsung semiconductor]
Part No. KMM5324000BSWG KMM5328000BSW KMM5324000BSW
OCR Text SIMM Using 4Mx16, 4K Refresh, 5V GENERAL DESCRIPTION The Samsung KMM5324000B is a 4Mx32bits Dynamic RAM high density memory module. The Sa...72-pin glass-epoxy substrate. A 0.1 or 0.22uF decoupling capacitor is mounted on the printed circuit...
Description 4M x 32 DRAM SIMM Using 4Mx16, 4K Refresh, 5V

File Size 348.88K  /  18 Page

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    KMM5322200C2WG KMM5322200C2W

SAMSUNG[Samsung semiconductor]
Part No. KMM5322200C2WG KMM5322200C2W
OCR Text SIMM (1MX16 Base) Revision 0.0 November 1997 -1- Rev. 0.0 (Nov. 1997) DRAM MODULE Revision History Version 0.0 (November 1997...72-pin glass-epoxy substrate. A 0.1 or 0.22uF decoupling capacitor is mounted on the printed circuit...
Description 2M x 32 DRAM SIMM using 1Mx16, 1K Refresh, 5V

File Size 272.03K  /  17 Page

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    KMM5364003CK KMM5364103CK

Samsung Semiconductor
Part No. KMM5364003CK KMM5364103CK
OCR Text SIMM (4Mx4 & 16M Quad CAS base) Revision 0.1 Nov. 1997 DRAM MODULE Revision History Version 0.1 (Nov. 1997) * Changed the mode of ...72-pin glassepoxy substrate. A 0.1 or 0.22uF decoupling capacitor is mounted on the printed circuit ...
Description (KMM5364103CK / KMM5364003CK) 4MBx36 DRAM Simm Using 4MBx4 And 16MB Quad Cas

File Size 274.17K  /  17 Page

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    KMM5364005BSW

Samsung Semiconductor
Part No. KMM5364005BSW
OCR Text SIMM Using 4Mx16 & Quad CAS 4Mx4, 4K Refresh, 5V GENERAL DESCRIPTION The Samsung KMM5364005B is a 4Mx36bits Dynamic RAM high density memor...72-pin glass-epoxy substrate. A 0.1 or 0.22uF decoupling capacitor is mounted on the printed circuit...
Description 4MB X 36 DRAM Simm Using 4MB X 16 & Quad Cas 4MB X 4

File Size 381.43K  /  19 Page

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    KMM5364005CK

Samsung Semiconductor
Part No. KMM5364005CK
OCR Text ...Mode with EDO Mode 4M x 36 DRAM SIMM using 4Mx4 and 16M Quad CAS, 4K/2K, Refresh, 5V GENERAL DESCRIPTION The Samsung KMM53640(1)05CK is a ...72-pin glass-epoxy substrate. A 0.1 or 0.22uF decoupling capacitor is mounted on the printed circuit...
Description (KMM5364105CK / KMM5364005CK) 4MBx36 DRAM Simm Using 4MBx4 And 16MB Quad Cas

File Size 264.70K  /  15 Page

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    KMM5364005CSW KMM5364005CSWG

SAMSUNG[Samsung semiconductor]
Part No. KMM5364005CSW KMM5364005CSWG
OCR Text SIMM (4Mx16 & Quad CAS 4Mx4 base) Revision 0.0 June 1999 DRAM MODULE Revision History Version 0.0 (June 1999) * The 4th. generatio...72-pin glass-epoxy substrate. A 0.1 or 0.22uF decoupling capacitor is mounted on the printed circuit...
Description 4M X 36 DRAM SIMM USING 4MX16 & QUAD CAS 4MX4, 4K REFRESH, 5V
4MB X 36 DRAM Simm Using 4MB X 16 & Quad Cas 4MB X 4

File Size 412.78K  /  21 Page

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    EDI7F2331MC100BNC EDI7F2331MC150BNC EDI7F2331MC90BNC EDI7F331MC EDI7F2331MC120BNC EDI7F2331MC80BNC

White Electronic Designs Corporation
Part No. EDI7F2331MC100BNC EDI7F2331MC150BNC EDI7F2331MC90BNC EDI7F331MC EDI7F2331MC120BNC EDI7F2331MC80BNC
OCR Text ...S EDI7F331MC-BNC: 1Mx32 80 PIN SIMM E0# A0-A19 G# 1Mx8 W0# 1Mx8 W1# 1Mx8 W2# 1Mx8 W3# FEATURES 1Mx32 and 2x1Mx32 Densities Based ...72 73 74 75 76 77 78 79 80 Pin Name DQ9 DQ8 DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0 NC VCC PD1 PD2 PD3 PD...
Description 1MX32 FLASH MODULE

File Size 242.31K  /  3 Page

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    EDI7F331MC90BNC EDI7F33IMC-BNC EDI7F233IMC100BNC EDI7F233IMC120BNC EDI7F233IMC150BNC EDI7F233LMC90BNC EDI7F33IMC150BNC E

Electronic Theatre Controls, Inc.
STMicroelectronics N.V.
White Electronic Designs Corporation
ETC[ETC]
List of Unclassifed Manufacturers
Part No. EDI7F331MC90BNC EDI7F33IMC-BNC EDI7F233IMC100BNC EDI7F233IMC120BNC EDI7F233IMC150BNC EDI7F233LMC90BNC EDI7F33IMC150BNC EDI7F33IMC EDI7F33IMC100BNC EDI7F33IMC120BNC EDI7F2331MC-BNC EDI7F233IMC
OCR Text ... EDI7F33IMC-BNC 1Megx32 80 pin SIMM Features * 1 Meg x 32 and 2 x 1 Meg x 32 Densities * Based on AMD - AM29F080 Flash Device * Fast Re...72 73 74 75 76 77 78 79 80 Pin Name DQ9 DQ8 DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0 NC VCC PD1 PD2 PD3 PD4 P...
Description 1Megx32 Flash Module(1Megx32闪速存储器模块) 1Megx32闪存模块Megx32闪速存储器模块
2x1Megx32 Flash Module(2x1Megx32闪速存储器模块) 2x1Megx32闪存模块x1Megx32闪速存储器模块
0.5MHz, Low Supply Voltage, Low Input Current BiMOS Operational Amplifiers; Temperature Range: -55°C to 125°C; Package: 8-PDIP

File Size 37.07K  /  3 Page

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    EDI7F331MV EDI7F331MV150BNC EDI7F331MV90BNC EDI7F331MV80BNC EDI7F2331MV100BNC EDI7F2331MV120BNC EDI7F2331MV150BNC EDI7F2

WEDC[White Electronic Designs Corporation]
Part No. EDI7F331MV EDI7F331MV150BNC EDI7F331MV90BNC EDI7F331MV80BNC EDI7F2331MV100BNC EDI7F2331MV120BNC EDI7F2331MV150BNC EDI7F2331MV80BNC EDI7F2331MV90BNC EDI7F331MV120BNC EDI7F331MV100BNC
OCR Text ...S EDI7F331MV-BNC: 1Mx32 80 PIN SIMM E0# A0-A19 G# 1Mx8 W0# 1Mx8 W1# 1Mx8 W2# 1Mx8 W3# DQ24-DQ31 DQ16-DQ23 DQ8-DQ15 DQ0-DQ7 FEATURES ...72 73 74 75 76 77 78 79 80 Pin Name DQ9 DQ8 DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0 NC VCC PD1 PD2 PD3 PD...
Description 1MX32 FLASH MODULE

File Size 230.23K  /  3 Page

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    HMD16M32M8GH HMD16M32M8GH-5 HMD16M32M8GH-6

Hanbit Electronics Co.,Ltd
Part No. HMD16M32M8GH HMD16M32M8GH-5 HMD16M32M8GH-6
OCR Text SIMM Design Part No. HMD16M32M8GH GENERAL DESCRIPTION The HMD16M32M8GH is a 16M x 32bit dynamic RAM high-density memory module. The module ...72-pin glass-epoxy substrate. A 0.1 or 0.22uF decoupling capacitor is mounted on the printed circuit...
Description 64MBYTE (16MX36) FP MODE 4K REF. 72PIN-SIMM DESIGN

File Size 65.07K  /  7 Page

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