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SGS Thomson Microelectronics
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Part No. |
AN1294
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OCR Text |
...a great need for surface mount (smd) packages but, up until now, the available bipolar technology did not allow it. the main advantages of t...mounting on heatsink and pdiss. > 15w figure 3: powerso-10rf straight and formed lead versions deliv... |
Description |
POWERSO-10RF: THE FIRST TRUE RF POWER SMD PACKAGE
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File Size |
177.82K /
12 Page |
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it Online |
Download Datasheet
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SGS Thomson Microelectronics
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Part No. |
AN1233
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OCR Text |
...product: flange, flangeless and smd (figure 3). indeed all three package types have their own mounting techniques and characteristics: figure 3: package styles 3.1 flange package (e.g. m243 package). heatsink flatness on the mounting area m... |
Description |
LDMOS PACKAGES
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File Size |
86.81K /
4 Page |
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it Online |
Download Datasheet
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Price and Availability
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