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stress Datasheet PDF File

For stress Found Datasheets File :: 103062 Search Time::2.282ms
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				Mill-Max Mfg. Corp.
Part No.	315-11-108-41-003000
OCR Text	...: 980c/865c (liquidus/solidus) stress relaxation?: 96% of stress remains after 1,000 hours @ 100 c; 70% of stress remains after 1,000 hours @ 200 c *international annealed copper standard, i.e. as a % of pure copper. ?since becu loses its ...
Description	Interconnect Socket Low Profile Solder Tail Socket
File Size	117.57K / 3 Page	View it Online	Download Datasheet

				Mill-Max Mfg. Corp.
Part No.	315-11-108-41-001000
OCR Text	...: 980c/865c (liquidus/solidus) stress relaxation?: 96% of stress remains after 1,000 hours @ 100 c; 70% of stress remains after 1,000 hours @ 200 c *international annealed copper standard, i.e. as a % of pure copper. ?since becu loses its ...
Description	Interconnect Socket Low Profile Solder Tail Socket
File Size	117.38K / 3 Page	View it Online	Download Datasheet

				Motorola, Inc MOTOROLA[Motorola Inc] ONSEMI[ON Semiconductor]
Part No.	BAS70LT1 ON0123
OCR Text	...n order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of t...
Description	CASE 318 08, STYLE 8 SOT 23 (TO 236AB) From old datasheet system 70VOLTS SCHOTTKY BARRIER DIODES CASE 318 08 STYLE 8 SOT 23 (TO 236AB)
File Size	70.22K / 4 Page	View it Online	Download Datasheet

				Mill-Max Mfg. Corp.
Part No.	315-11-107-41-003000
OCR Text	...: 980c/865c (liquidus/solidus) stress relaxation?: 96% of stress remains after 1,000 hours @ 100 c; 70% of stress remains after 1,000 hours @ 200 c *international annealed copper standard, i.e. as a % of pure copper. ?since becu loses its ...
Description	Interconnect Socket Low Profile Solder Tail Socket
File Size	117.66K / 3 Page	View it Online	Download Datasheet

				Mill-Max Mfg. Corp.
Part No.	315-11-107-41-001000
OCR Text	...: 980c/865c (liquidus/solidus) stress relaxation?: 96% of stress remains after 1,000 hours @ 100 c; 70% of stress remains after 1,000 hours @ 200 c *international annealed copper standard, i.e. as a % of pure copper. ?since becu loses its ...
Description	Interconnect Socket Low Profile Solder Tail Socket
File Size	117.47K / 3 Page	View it Online	Download Datasheet

				Mill-Max Mfg. Corp.
Part No.	315-11-106-41-003000
OCR Text	...: 980c/865c (liquidus/solidus) stress relaxation?: 96% of stress remains after 1,000 hours @ 100 c; 70% of stress remains after 1,000 hours @ 200 c *international annealed copper standard, i.e. as a % of pure copper. ?since becu loses its ...
Description	Interconnect Socket Low Profile Solder Tail Socket
File Size	117.57K / 3 Page	View it Online	Download Datasheet

				Mill-Max Mfg. Corp.
Part No.	315-11-105-41-001000
OCR Text	...: 980c/865c (liquidus/solidus) stress relaxation?: 96% of stress remains after 1,000 hours @ 100 c; 70% of stress remains after 1,000 hours @ 200 c *international annealed copper standard, i.e. as a % of pure copper. ?since becu loses its ...
Description	Interconnect Socket Low Profile Solder Tail Socket
File Size	117.38K / 3 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors]
Part No.	BAS70L
OCR Text	...th an integrated guard ring for stress protection. Encapsulated in a SOD882 leadless ultra small plastic package. handbook, halfpage APPLICATIONS * Ultra high-speed switching * Voltage clamping * Protection circuits * Mobile communica...
Description	Schottky barrier diode
File Size	49.96K / 8 Page	View it Online	Download Datasheet

				Mill-Max Mfg. Corp.
Part No.	315-11-104-41-003000
OCR Text	...: 980c/865c (liquidus/solidus) stress relaxation?: 96% of stress remains after 1,000 hours @ 100 c; 70% of stress remains after 1,000 hours @ 200 c *international annealed copper standard, i.e. as a % of pure copper. ?since becu loses its ...
Description	Interconnect Socket Low Profile Solder Tail Socket
File Size	117.57K / 3 Page	View it Online	Download Datasheet

				Mill-Max Mfg. Corp.
Part No.	315-11-104-41-001000
OCR Text	...: 980c/865c (liquidus/solidus) stress relaxation?: 96% of stress remains after 1,000 hours @ 100 c; 70% of stress remains after 1,000 hours @ 200 c *international annealed copper standard, i.e. as a % of pure copper. ?since becu loses its ...
Description	Interconnect Socket Low Profile Solder Tail Socket
File Size	117.39K / 3 Page	View it Online	Download Datasheet

For stress Found Datasheets File :: 103062 Search Time::2.282ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |