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  die-43 Datasheet PDF File

For die-43 Found Datasheets File :: 9389    Search Time::7.156ms    
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    MASW2000

MACOM[Tyco Electronics]
Part No. MASW2000
OCR Text ...@ 60 uA Typ to -8 V @500 uA Max Die Size 0.056" x 0.056" x 0.010" 1.40mm x 1.40mm x 0.25mm) Schematic ** All specifications apply with 50 impedance connected to all RF ports, 0 and 0 and -5 Vdc control voltages. *** Loss changes 0.00...
Description GaAs SPDT Switch DC - 3 GHz

File Size 108.98K  /  2 Page

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    MPX2200 MPX2200A MPX2200AP MPX2200AS MPX2200D MPX2200DP MPX2200GP MPX2200GS MPX2200GVP MPX2200GVS MPX2201DP MPX2201GP MP

Motorola Mobility Holdings, Inc.
Motorola, Inc.
MOTOROLA[Motorola Inc]
MOTOROLA[Motorola, Inc]
Part No. MPX2200 MPX2200A MPX2200AP MPX2200AS MPX2200D MPX2200DP MPX2200GP MPX2200GS MPX2200GVP MPX2200GVS MPX2201DP MPX2201GP MPX2201
OCR Text ...re Differential SILICONE GEL DIE COAT WIRE BOND WIRE BOND LEAD FRAME DIFFERENTIAL/GAUGE ELEMENT P2 DIE BOND LEAD FRAME ...43 L -T- J SEATING PLANE POSITIVE PRESSURE (P1) G F 4 PL D 0.136 (0.005) M TA...
Description 0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL) 000千帕29 PSI)的全尺寸为40 mV跨度(典型)
0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL) 000千帕9 PSI)的全尺寸为40 mV跨度(典型)
(MPX2200 / MPX2201) 0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL)

File Size 169.29K  /  8 Page

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    MPX2700A MPX2700AP MPX2700ASX

MOTOROLA INC
Motorola, Inc.
MOTOROLA[Motorola, Inc]
Part No. MPX2700A MPX2700AP MPX2700ASX
OCR Text ...of Differential Pressure Sensor Die in Its Basic Package (Not to Scale) Figure 4 shows the cross section of the Motorola MPX pressure sen...43 L -T- J SEATING PLANE G F 4 PL D 0.136 (0.005) M TA M STYLE 1: PIN 1...
Description ABSOLUTE, PEIZORESISTIVE PRESSURE SENSOR, 0-101.52Psi, 1%, 0-40mV, ROUND, THROUGH HOLE MOUNT
X-ducer SILICON PRESSURE SENSORS

File Size 164.50K  /  6 Page

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    MPX2700 MPX2700D MPX2700DP MPX2700GP MPX2700GS MPX2700GSX MPX2700GVP MPX2700GVS MPX2700GVSX

Motorola Mobility Holdings, Inc.
Motorola, Inc.
MOTOROLA[Motorola, Inc]
Part No. MPX2700 MPX2700D MPX2700DP MPX2700GP MPX2700GS MPX2700GSX MPX2700GVP MPX2700GVS MPX2700GVSX
OCR Text ... P1 > P2 MAX TYP SILICONE DIE COAT SPAN RANGE (TYP) WIRE BOND DIE P1 STAINLESS STEEL METAL COVER PSI kPa 20 140 40 280 ...43 L -T- J SEATING PLANE POSITIVE PRESSURE (P1) G F 4 PL D 0.136 (0.005) M TA...
Description 0 to 700 kPa (0 to 100 psi) 40 mV FULL SCALE SPAN (TYPICAL) GAGE, PEIZORESISTIVE PRESSURE SENSOR, 0-101.52Psi, 0.5%, 0-40mV, ROUND, THROUGH HOLE MOUNT

File Size 187.83K  /  10 Page

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    MPX4200 MPX4200A MPX4200AP MPX4200AS MPX4200ASX

MOTOROLA[Motorola, Inc]
Part No. MPX4200 MPX4200A MPX4200AP MPX4200AS MPX4200ASX
OCR Text ...ata MPX4200 SERIES SILICONE DIE COAT WIRE BOND STAINLESS STEEL METAL COVER P1 EPOXY CASE DIE MPX4200A OUPUT (PIN 1) 50 pF 51 k ...43 2.29 2.66 L -T- G F D 6 PL 0.136 (0.005) M J S TA M DIM A B C D F G J L M N R ...
Description INTEGRATED PRESSURE SENSOR 20 to 200 kPa (2.9 to 29 psi) 0.3 to 4.9 V OUTPUT

File Size 140.29K  /  8 Page

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    MPX4250D MPX4250DP MPX4250GS MPX4250GSX

Motorola Mobility Holdings, Inc.
MOTOROLA[Motorola, Inc]
Part No. MPX4250D MPX4250DP MPX4250GS MPX4250GSX
OCR Text ...PX4250D SERIES FLUORO SILICONE DIE COAT DIE WIRE BOND P1 STAINLESS STEEL METAL COVER MPX4250D OUPUT (PIN 1) 50 pF 51 k A/D LEAD FRAME ...43 2.29 2.66 L -T- G F D 6 PL 0.136 (0.005) M J S TA M DIM A B C D F G J L M N R ...
Description OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR 0 to 250 kPa (0 to 36.3 psi) 0.2 to 4.91 Volts Output 经营概况集成压力传感250 kPa36.3 PSI)的0.2.91伏特输出
OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR 0 to 250 kPa (0 to 36.3 psi) 0.2 to 4.91 Volts Output GAGE, PEIZORESISTIVE PRESSURE SENSOR, 0-36.25Psi, 1.4%, 0.20-4.90V, ROUND, THROUGH HOLE MOUNT

File Size 145.33K  /  8 Page

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    MPX4250 MPX4250A MPX4250AP MPX4250AS MPX4250ASX

Motorola Mobility Holdings, Inc.
MOTOROLA[Motorola, Inc]
Part No. MPX4250 MPX4250A MPX4250AP MPX4250AS MPX4250ASX
OCR Text ...ata MPX4250 SERIES SILICONE DIE COAT WIRE BOND STAINLESS STEEL METAL COVER P1 EPOXY CASE DIE MPX4250A OUPUT (PIN 1) 50 pF 51 k ...43 2.29 2.66 L -T- G F D 6 PL 0.136 (0.005) M J S TA M DIM A B C D F G J L M N R ...
Description INTEGRATED PRESSURE SENSOR 20 to 250 kPa (2.9 to 36.3 psi) 0.2 to 4.9 V OUTPUT ABSOLUTE, PEIZORESISTIVE PRESSURE SENSOR, 2.9-36.25Psi, 1.5%, 4.62-4.76V, ROUND, THROUGH HOLE MOUNT

File Size 142.92K  /  8 Page

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    MPX5050 MPX5050D MPX5050DP MPX5050GP MPX5050GS MPX5050GSX MPX5050GVP MPX5050GVS MPX5050GVSX

Motorola, Inc.
MOTOROLA[Motorola, Inc]
Part No. MPX5050 MPX5050D MPX5050DP MPX5050GP MPX5050GS MPX5050GSX MPX5050GVP MPX5050GVS MPX5050GVSX
OCR Text ...fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the...43 2.29 2.66 L -T- G F D 6 PL 0.136 (0.005) M J S TA M DIM A B C D F G J L M N R ...
Description OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR 0 to 50 kPa (0 to 7.25 psi) 0.2 to 4.7 Volts Output

File Size 186.91K  /  10 Page

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    MPX7100 MPX7100A MPX7100AP MPX7100AS MPX7100ASX MPX7100D MPX7100DP MPX7100GP MPX7100GS MPX7100GSX MPX7100GVP MPX7100GVS

Motorola, Inc.
MOTOROLA[Motorola, Inc]
Part No. MPX7100 MPX7100A MPX7100AP MPX7100AS MPX7100ASX MPX7100D MPX7100DP MPX7100GP MPX7100GS MPX7100GSX MPX7100GVP MPX7100GVS MPX7100GVSX
OCR Text ...re Differential SILICONE GEL DIE COAT WIRE BOND WIRE BOND LEAD FRAME DIFFERENTIAL/GAUGE ELEMENT P2 DIE BOND LEAD FRAME ...43 L -T- J SEATING PLANE POSITIVE PRESSURE (P1) G F 4 PL D 0.136 (0.005) M TA...
Description 0 to 100 kPa (0 to 14.5 psi) 40 mV FULL SCALE SPAN (TYPICAL)

File Size 190.50K  /  10 Page

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    MPXT2010 MPXT2010G7U

MOTOROLA[Motorola, Inc]
Part No. MPXT2010 MPXT2010G7U
OCR Text ...use a single monolithic silicon die with the strain gauge and thin-film resistor network integrated on each chip. The sensor is laser trimme...43 3.68 J S A S STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. CASE 473A-01 ISSUE A Motor...
Description COMPENSATED PRESSURE SENSOR

File Size 89.39K  /  4 Page

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For die-43 Found Datasheets File :: 9389    Search Time::7.156ms    
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