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  HPDL-1414 Datasheet PDF File

For HPDL-1414 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    EIC1414-4 EIC1414-4NH

Excelics Semiconductor, Inc.
Part No. EIC1414-4 EIC1414-4NH
Description 14.00-14.50GHz 4-Watt Internally-Matched Power FET

File Size 173.05K  /  4 Page

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Amphenol Communications Solutions

Part No. CE1414000110111
Description Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole/Surface mount, 4 power pins, 140 signal pins, Vertical
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Toshiba Corporation
Part No. TIM1414-4LA
Description MICROWAVE POWER GaAs FET

File Size 84.76K  /  2 Page

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Amphenol Communications Solutions

Part No. SE1414023111111
Description Slim Cool Edge 0.65mm, Surface mount, 4 power pins, 140 signal pins, Vertical
Tech specs    

Official Product Page

    TIM1414-2-252

Toshiba Semiconductor
Part No. TIM1414-2-252
Description HIGH POWER P1dB=33.0 dBm at 13.75 GHz to 14.5 GHz

File Size 145.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 91601-414ALF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical , Surface Mount, Dual Entry ,Single row , 14 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    Toshiba
Part No. TIM1414-7-253
Description Microwave Power GaAs FET

File Size 211.11K  /  1 Page

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Amphenol Communications Solutions

Part No. 76341-414LF
Description Dubox® 2.54mm, Board to Board Connector, PCB mounted Receptacle, Vertical, Through Hole, Top Entry, Single row , 14 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    TIM1414-4-252

Toshiba Semiconductor
Part No. TIM1414-4-252
Description MICROWAVE POWER GaAs FET

File Size 145.87K  /  4 Page

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Amphenol Communications Solutions

Part No. 76314-140LF
Description Dubox® 2.54mm, Board to Board Connector, 80 Positions,Double Row,Vertical,2.54mm pitch,Card Connector.
Tech specs    

Official Product Page

    TIM1414-15L

Toshiba Semiconductor
Part No. TIM1414-15L
Description MICROWAVE POWER GaAs FET

File Size 496.50K  /  4 Page

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Amphenol Communications Solutions

Part No. 10069525-141402LF
Description Bergstak® 0.80mm Pitch, Board to Board, Vertical, Plug Assembly, 140 Positions, Dual Row.
Tech specs    

Official Product Page

    TIM1414-30L

Toshiba Semiconductor
Part No. TIM1414-30L
Description MICROWAVE POWER GaAs FET

File Size 45.53K  /  2 Page

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Amphenol Communications Solutions

Part No. 61082-141402LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 140 Positions.
Tech specs    

Official Product Page

    TIM1414-8-252

Toshiba Semiconductor
Part No. TIM1414-8-252
Description HIGH POWER P1dB=39.0 dBm at 13.75 GHz to 14.5 GHz

File Size 120.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 91601-414LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical , Surface Mount, Dual Entry ,Single row , 14 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    Toshiba
Part No. TIM1414-15-253
Description Microwave Power GaAs FET

File Size 211.92K  /  1 Page

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Amphenol Communications Solutions

Part No. 78511-414HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 14 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    XE1414 XE1414C-ITR XE1414C

ETC[ETC]
Part No. XE1414 XE1414C-ITR XE1414C
Description Worldwide 14.4 KBPS Modem Module for Embedded Applications

File Size 76.38K  /  18 Page

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Amphenol Communications Solutions

Part No. 68001-414HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 14 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For HPDL-1414 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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Part: HPDL-1414
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Pack: DIP
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