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  LPLC-1811 Datasheet PDF File

For LPLC-1811 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    Wurth Elektronik GmbH &...
Part No. 4181172709XX
Description    WS-DITV,THT version raise Actuator without top tape sealed

File Size 99.86K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-8118-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    MAX11811TEVS

Maxim Integrated Products
Part No. MAX11811TEVS
Description Touch Evaluation System (TEVS)
Touch Evaluation System (TEVS)

File Size 5,147.20K  /  23 Page

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Amphenol Communications Solutions

Part No. 131-8118-11H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    Wurth Elektronik GmbH &...
Part No. 4181171709XX
Description    WS-DITV Flat Actuator without top tape sealed

File Size 55.76K  /  1 Page

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Amphenol Communications Solutions

Part No. 10131318-18111G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 18 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    MAXIM - Dallas Semiconductor
Part No. MAX11811TEVS
Description TacTouch™, Low-Power, Ultra-Small, Resistive Touch-Screen Controller with Haptic Driver

File Size 46.90K  /  1 Page

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Amphenol Communications Solutions

Part No. 68418-112HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
Tech specs    

Official Product Page

    LXMG1800LS LXMG1811-05-61S LXMG1811-05-62S LXMG1813-12-62S LXMG1813-12-61S

Microsemi Corporation
Part No. LXMG1800LS LXMG1811-05-61S LXMG1811-05-62S LXMG1813-12-62S LXMG1813-12-61S
Description Ambient Light Sensor Board Assembly

File Size 75.58K  /  4 Page

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Amphenol Communications Solutions

Part No. 77315-118-11LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

   
Part No. SSC2-P141112101 SSC2-P181112101
Description SINGLE MODE, SIMPLEX SC CONNECTOR

File Size 29.26K  /  1 Page

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Amphenol Communications Solutions

Part No. 77315-418-11LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    2-1318115-9 2-1318114-6 2-1318115-3 2-1318120-3 2-1318114-4 2-1318116-3 2-1318118-6 2-1318119-3 2-1318115-4 2-1318118-9

Tyco Electronics
Part No. 2-1318115-9 2-1318114-6 2-1318115-3 2-1318120-3 2-1318114-4 2-1318116-3 2-1318118-6 2-1318119-3 2-1318115-4 2-1318118-9 2-1318115-6 2-1318114-3 2-1318118-8 2-1318114-9 2-1318117-3 1-1318118-6 3-1318118-6 1-1318118-8 1-1318118-9 1318108-1 1-1318120-3 1-1318119-3 1318112-1
Description AMP Dynamic Series Connectors
D-2000 Series (Wire-to-Board, Wire-to-Panel and Wire-to-Wire)
   D-2000 Series (Wire-to-Board, Wire-to-Panel and Wire-to-Wire)

File Size 3,331.74K  /  18 Page

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Amphenol Communications Solutions

Part No. 131-4218-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    MAX518110 MAX5184BEEG

Maxim Integrated Products
Maxim Integrated Produc...
Part No. MAX518110 MAX5184BEEG
Description 10-Bit, 40MHz, Current/Voltage-Output DACs

File Size 216.64K  /  16 Page

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Amphenol Communications Solutions

Part No. 131-5618-11D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    IMP1233M IMP1817 IMP1233D IMP1810 IMP1811 IMP1812 IMP1815 IMP1816

IMP Inc
IMP[IMP Inc]
IMP[IMP, Inc]
Part No. IMP1233M IMP1817 IMP1233D IMP1810 IMP1811 IMP1812 IMP1815 IMP1816
Description Low Power 5V/3.0V P Reset

File Size 108.07K  /  6 Page

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Amphenol Communications Solutions

Part No. 131-7418-11D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0010181122 A30991203 10-18-1122 A-3099-1203

Molex Electronics Ltd.
Part No. 0010181122 A30991203 10-18-1122 A-3099-1203
Description 2.36mm (.093) Diameter Standard .093 Pin and Socket Header, 3 Rows, Shrouded, Unfilled Polyester, UL 94V-0, 12 Circuits, 12 Female Terminals
2.36mm (.093") Diameter Standard .093" Pin and Socket Header, 3 Rows, Shrouded, Unfilled Polyester, UL 94V-0, 12 Circuits, 12 Female Terminals
MOLEX Connector

File Size 106.10K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-3218-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

For LPLC-1811 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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