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solder-in Datasheet PDF File

For solder-in Found Datasheets File :: 95676 Search Time::2.046ms
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				NXP Semiconductors N.V. PHILIPS[Philips Semiconductors]
Part No.	74AHCT1G32 74AHCT1G32GW 74AHC1G32 74AHC1G32GW 74AHC1G32GW/T1
OCR Text	...ering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-ci...in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 2...
Description	IC-SM-CMOS LOGIC 2-input OR gate
File Size	80.51K / 12 Page	View it Online	Download Datasheet

				Philips Semiconductors
Part No.	74AHCT1G86 74AHCT1G86GW 74AHC1G86 74AHC1G86GW
OCR Text	...ering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-ci...in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 2...
Description	2-input EXCLUSIVE-OR gate
File Size	61.06K / 12 Page	View it Online	Download Datasheet

				Motorola, Inc. ON Semiconductor
Part No.	BAS40-04LT1 ON0119
OCR Text	...e correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages w...in device failure. Therefore, the following items should always be observed in order to minimize the...
Description	Dual Series Schottky Diode(高速开关应用，-0.50V正向电压，反向电0V的双肖特基势垒二极管) From old datasheet system SCHOTTKY BARRIER DIODES
File Size	73.00K / 4 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	BAS40-06LT1 BAS40-06LT1/D
OCR Text	...e correct size to insure proper solder connection 0.037 0.95 interface between the board and the package. With the correct pad geometry,...in device failure. Therefore, the following items should always be observed in order to minimize the...
Description	PSoC® Mixed-Signal Array SCHOTTKY BARRIER DIODE
File Size	74.38K / 4 Page	View it Online	Download Datasheet

				Motorola, Inc. Motorola Inc MOTOROLA[Motorola, Inc]
Part No.	BAS4004LT1
OCR Text	...e correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages w...in device failure. Therefore, the following items should always be observed in order to minimize the...
Description	CASE 318 08/ STYLE 12 SOT 23 (TO 236AB) CASE 318 08, STYLE 12 SOT 23 (TO 236AB)
File Size	73.08K / 4 Page	View it Online	Download Datasheet

				Motorola Inc MOTOROLA[Motorola, Inc]
Part No.	BAS4006LT1
OCR Text	...e correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages w...in device failure. Therefore, the following items should always be observed in order to minimize the...
Description	CASE 318-08/ STYLE 11 SOT-23 (TO-236AB) CASE 318-08, STYLE 11 SOT-23 (TO-236AB)
File Size	74.33K / 4 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. Motorola Inc MOTOROLA[Motorola, Inc]
Part No.	BAS40LT1 ON0121 BAS4
OCR Text	...e correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages w...in device failure. Therefore, the following items should always be observed in order to minimize the...
Description	CASE 318-08, STYLE 8 SOT-23 TO-236AB SILICON, SIGNAL DIODE, TO-236AB CASE 318-08/ STYLE 8 SOT-23 TO-236AB From old datasheet system
File Size	71.42K / 4 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. MOTOROLA[Motorola, Inc]
Part No.	BCP56T1 BCP56T1SERIES
OCR Text	... for Soldering Purposes Time in Solder Bath Symbol RJA TL Max 83.3 260 10 Unit C/W C Sec 1. Device mounted on a FR-4 glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.0625 in.; mounting pad for the collector lead = 0.93 sq. in....
Description	MEDIUM POWER NPN SILICON HIGH CURRENT TRANSISTOR SURFACE MOUNT 中功率NPN硅高当前的晶体管表面贴装
File Size	200.38K / 6 Page	View it Online	Download Datasheet

				Motorola Inc MOTOROLA[Motorola, Inc]
Part No.	BCP68T1
OCR Text	... for Soldering Purposes Time in Solder Bath Symbol RJA TL Max 83.3 260 10 Unit C/W C Sec 1. Device mounted on a FR-4 glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.0625 in.; mounting pad for the collector lead = 0.93 sq. in....
Description	MEDIUM POWER NPN SILICON HIGH CURRENT TRANSISTOR SURFACE MOUNT
File Size	149.51K / 6 Page	View it Online	Download Datasheet

				HYPERTRONICS CORP
Part No.	K2A110FFC3TAH K2A110FFD3TAH K2A095FFD3TAH K2A110EFD3TAH K2A110FMD2TBH
OCR Text	...40mm socket contact termination solder tail tin/lead (63/37) per mil-p-81728 contact spacing 2.00mm number of contacts 110 signal 22 ground...in inches [mm] 2mm connector 2mm connector mated pair performance specifications 3u / 6u form factor...
Description	110 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT 110 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER 95 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER 110 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
File Size	1,682.82K / 14 Page	View it Online	Download Datasheet

For solder-in Found Datasheets File :: 95676 Search Time::2.046ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |