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wedge Datasheet PDF File

For wedge Found Datasheets File :: 1098 Search Time::9.984ms
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				M/A-COM Technology Solu...
Part No.	MASW6020G-15
OCR Text	... wire bonding a. ball or wedge with 1.0 mil diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150c and a ball bonding force of 40 to 50 grams or wedge bonding force o1 18 to 22 grams ...
Description	GaAs SPST Switch DC - 6.0 GHz
File Size	509.14K / 5 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC520
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding force of ...
Description	GaAs MMIC I/Q MIXER 6 - 10 GHz
File Size	282.91K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC521
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding force of ...
Description	GaAs MMIC I/Q MIXER 8.5 - 13.5 GHz
File Size	280.40K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC522
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding force of ...
Description	GaAs MMIC I/Q MIXER 11 - 16 GHz
File Size	277.61K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC523
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding force of ...
Description	GaAs MMIC I/Q MIXER 15 - 23.6 GHz
File Size	299.96K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC524
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding force of ...
Description	GaAs MMIC I/Q MIXER 22 - 32 GHz
File Size	275.56K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC525
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding force of ...
Description	GaAs MMIC I/Q MIXER 4.0 - 8.5 GHz
File Size	285.04K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC526
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding force of ...
Description	GaAs MMIC I/Q MIXER 6 - 10 GHz
File Size	272.71K / 6 Page	View it Online	Download Datasheet

For wedge Found Datasheets File :: 1098 Search Time::9.984ms
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