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Cypress Semiconductor, Corp.
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| Part No. |
CY7C1423BV18-200BZI CY7C1423BV18-300BZI CY7C1429BV18-278BZI CY7C1429BV18-250BZI CY7C1429BV18-278BZC CY7C1429BV18-250BZC CY7C1429BV18-300BZI CY7C1422BV18-200BZXI CY7C1422BV18-167BZXC CY7C1422BV18-200BZXC CY7C1423BV18-200BZC CY7C1423BV18-278BZI CY7C1423BV18-250BZI CY7C1424BV18-278BZI CY7C1424BV18-278BZXC CY7C1423BV18-200BZXC CY7C1422BV18-250BZXI CY7C1424BV18-250BZXC
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| Description |
36-Mbit DDR-II SIO SRAM 2-Word Burst Architecture 2M X 18 DDR SRAM, 0.45 ns, PBGA165
36-Mbit DDR-II SIO SRAM 2-Word Burst Architecture 4M X 9 DDR SRAM, 0.45 ns, PBGA165
36-Mbit DDR-II SIO SRAM 2-Word Burst Architecture 4M X 8 DDR SRAM, 0.45 ns, PBGA165
36-Mbit DDR-II SIO SRAM 2-Word Burst Architecture 4M X 8 DDR SRAM, 0.5 ns, PBGA165
36-Mbit DDR-II SIO SRAM 2-Word Burst Architecture 1M X 36 DDR SRAM, 0.45 ns, PBGA165
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| File Size |
433.13K /
30 Page |
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it Online |
Download Datasheet
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Texas Instruments |
| Part No. |
14-24-NL-LOGIC-EVM
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| Description |
Generic 14 through 24 pin non-leaded package evaluation module
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61082-142402LF
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| Description |
BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 140 Positions.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68031-424HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 24 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-114241450LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-411142400LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-424-08LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 08 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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MOLEX INC
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| Part No. |
2M01SG 15561M11NG 15311M41SG 15411M41SG 15362E31NG 15362E01NG 14245E01SG 15412M11NG 15412M21NG 14444M31SG 14365M31SG 14241E01SG 14241K21SG 14241M21SG
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| Description |
2 CONTACT(S), ALUMINUM, FEMALE, CIRCULAR CONNECTOR, SOLDER
5 CONTACT(S), ALUMINUM, FEMALE, CIRCULAR CONNECTOR, SOLDER
3 CONTACT(S), ALUMINUM, MALE, CIRCULAR CONNECTOR, SOLDER
4 CONTACT(S), ALUMINUM, MALE, CIRCULAR CONNECTOR, SOLDER
4 CONTACT(S), ALUMINUM, FEMALE, CIRCULAR CONNECTOR, SOLDER
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| File Size |
98.53K /
2 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77311-424-20LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-424-30LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-424-02
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 02 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10142407-303KLF
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| Description |
Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface Mount, 3 Position<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
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| Tech specs |
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Official Product Page
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