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  74059-1011 Datasheet PDF File

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    PS11011

Mitsubishi Electric Semiconductor
POWEREX[Powerex Power Semiconductors]
Part No. PS11011
Description Application Specific Intelligent Power Module FLAT-BASE TYPE INSULATED PACKAGE
FLAT-BASE TYPE INSULATED TYPE
File Size 405.78K  /  6 Page

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Amphenol Communications Solutions
Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    EIC1011-4

Excelics Semiconductor, Inc.
Part No. EIC1011-4
Description 10.70-11.70GHz 4-Watt Internally-Matched Power FET
File Size 153.16K  /  4 Page

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Amphenol Communications Solutions
Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    EIC1011-8

Excelics Semiconductor, Inc.
Part No. EIC1011-8
Description 10.70-11.70GHz 8-Watt Internally Matched Power FET
File Size 114.37K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114829-10110LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
Tech specs 　 　

Official Product Page

    LRN1011-50

LinkCom Manufacturing Co., Ltd.
Part No. LRN1011-50
Description Single Port, Through Hole, Tab Down RJ45 Connectors
File Size 19.89K  /  1 Page

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Amphenol Communications Solutions
Part No. 10114831-10113LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    LAN1011-80

LinkCom Manufacturing Co., Ltd.
Part No. LAN1011-80
Description 10/100BASE-Tx Magnetics Module
File Size 44.84K  /  1 Page

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Amphenol Communications Solutions
Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    Fuji
Part No. 2SK1011 2SK1011-01
Description N-Channel Mos-fet
File Size 164.34K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs 　 　

Official Product Page

    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-4L
Description MICROWAVE POWER GaAs FET
File Size 145.86K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114828-10115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs 　 　

Official Product Page

    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-5L
Description MICROWAVE POWER GaAs FET
File Size 133.39K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114830-10111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs 　 　

Official Product Page

    VLSI
Part No. VS1011E
Description MPEG AUDIO CODEC
File Size 484.12K  /  49 Page

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Amphenol Communications Solutions
Part No. 10114829-10115LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
Tech specs 　 　

Official Product Page

    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-8L
Description MICROWAVE POWER GaAs FET
File Size 132.08K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

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