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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TB62218AFTG
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| Description |
Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
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| Tech specs |
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Official Product Page
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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TB62218AFNG
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| Description |
Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
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| Tech specs |
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Official Product Page
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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TB62218FG
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| Description |
Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
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| Tech specs |
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Official Product Page
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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TB62218AFG
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| Description |
Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
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| Tech specs |
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|
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Official Product Page
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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TB62218FTG
|
| Description |
Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
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| Tech specs |
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|
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Official Product Page
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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TB62218FNG
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| Description |
Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69190-136HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0901362330 90136-2330
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| Description |
2.54mm (.100) Pitch C-Grid III?Header, Single Row, Right Angle, Shrouded, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
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| File Size |
254.50K /
5 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
78290-136HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90136-2303 0901362303
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 3 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 3 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
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| File Size |
254.43K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68690-136HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90136-2308 0901362308
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
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| File Size |
254.33K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77313-422-18LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 18 Positions
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| Tech specs |
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Official Product Page
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Price and Availability
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