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20D10 UGB8FT ZR28501 PIC16C F1005 00104 C471M358 14D361K
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  98786-1011 Datasheet PDF File

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    EIM1011-4

Excelics Semiconductor, Inc.
Part No. EIM1011-4
Description 10.7-11.7GHz Multi-Stage Power Amplifier
File Size 153.76K  /  4 Page

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Rochester Electronics LLC
Part No. BLA1011-300
Description BLA1011-300 - 300W LDMOS Avionics Power Transistor
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    LRN1011-50

LinkCom Manufacturing Co., Ltd.
Part No. LRN1011-50
Description Single Port, Through Hole, Tab Down RJ45 Connectors
File Size 19.89K  /  1 Page

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Amphenol Communications Solutions
Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    LAN1011-80

LinkCom Manufacturing Co., Ltd.
Part No. LAN1011-80
Description 10/100BASE-Tx Magnetics Module
File Size 44.84K  /  1 Page

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Amphenol Communications Solutions
Part No. 10118085-101-10LF
Description Unshrouded Right Angle Header, Surface Mount With Peg, Double row , 10 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    Fuji
Part No. 2SK1011 2SK1011-01
Description N-Channel Mos-fet
File Size 164.34K  /  4 Page

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Amphenol Communications Solutions
Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-8L
Description MICROWAVE POWER GaAs FET
File Size 132.08K  /  4 Page

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Amphenol Communications Solutions
Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    PS11011

Mitsubishi Electric Semiconductor
POWEREX[Powerex Power Semiconductors]
Part No. PS11011
Description Application Specific Intelligent Power Module FLAT-BASE TYPE INSULATED PACKAGE
FLAT-BASE TYPE INSULATED TYPE
File Size 405.78K  /  6 Page

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Amphenol Communications Solutions
Part No. 10114831-10112LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 12 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-5L
Description MICROWAVE POWER GaAs FET
File Size 133.39K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114829-10113LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 13 Positions
Tech specs 　 　

Official Product Page

    3021011-06

Qualtek Electronics Corporation
Part No. 3021011-06
Description USB 4P(A)/M - BLUNT CUT
File Size 374.32K  /  1 Page

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Amphenol Communications Solutions
Part No. 10114828-10113LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 13 Positions
Tech specs 　 　

Official Product Page

    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-4L
Description MICROWAVE POWER GaAs FET
File Size 145.86K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114830-10113LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 13 Positions
Tech specs 　 　

Official Product Page

    T211011

E-SWITCH
Part No. T211011
Description ALL DIMENSIONS IN MM [INCH]
File Size 29.15K  /  1 Page

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Amphenol Communications Solutions
Part No. 10114831-10111LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 11 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

For 98786-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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