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FUJITSU[Fujitsu Media Devices Limited]
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| Part No. |
CS91
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| OCR Text |
...11 m silicon-gate CMOS, 5- to 8-layer wiring (Copper is used as wire material.) , Low-K (2.7) Inter-layer material (Inter-layer material that has low permittivity) Support for high speed, high integration, low leak internal cell set. Capabl... |
| Description |
Standard cell array
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| File Size |
41.62K /
9 Page |
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it Online |
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DIODES INC
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| Part No. |
AP2161MPG-13
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| OCR Text |
...ommended pad o n top layer and thermal vias to bottom layer ground plane. 6. test condition for sot25: device mounted on fr-4, 2...2-layer board, 2oz copper, with minimum recommended pad on top layer an d 3 vias to bottom layer ... |
| Description |
1.2 A BUF OR INV BASED PRPHL DRVR, PDSO8
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| File Size |
370.03K /
17 Page |
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it Online |
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MPS[Monolithic Power Systems]
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| Part No. |
MP1517DR EV1517DR-00A
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| OCR Text |
...RD LAYOUT
Figure 1--Top Silk Layer
Figure 2--Top Layer
Figure 3--Bottom Layer
EV1517DR-00A Rev. 1.0 6/8/2005
www.MonolithicPower.com MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited. (c) 2005 MPS... |
| Description |
3A, 25V, 1.1MHz Step-Up Converter
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| File Size |
180.97K /
5 Page |
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it Online |
Download Datasheet |
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MPS[Monolithic Power Systems]
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| Part No. |
MP1517DR EV1517DR-00B
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| OCR Text |
...RD LAYOUT
Figure 1--Top Silk Layer
Figure 2--Top Layer
Figure 3--Bottom Layer
EV1517DR-00B Rev. 1.0 12/21/2005
www.MonolithicPower.com MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited. (c) 2005 M... |
| Description |
3.3V, 1A Sepic Evaluation Board
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| File Size |
172.43K /
4 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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