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  stress Datasheet PDF File

For stress Found Datasheets File :: 83428    Search Time::1.469ms    
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    RA08H1317 RA08H1317M RA08H1317M-01 RA08H1317M-E01

Mitsubishi Electric, Corp.
MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric Corporation
Mitsubishi Electric Sem...
Part No. RA08H1317 RA08H1317M RA08H1317M-01 RA08H1317M-E01
OCR Text ... thermal changes) b) Mechanical stress on the wire leads (for example, by first soldering then driving screws or by thermal expansion) c) Defluxing solvents reacting with the resin coating on the MOSFET chips (for example, Trichlorethylene)...
Description TV 2C 2#16 SKT RECP 135 - 175MHz瓦特12.5V便携移动通信
Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVP00; Number of Contacts:2; Connector Shell Size:11; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight
135-175MHz 8W 12.5V PORTABLE/MOBILE RADIO

File Size 49.96K  /  9 Page

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    NXP Semiconductors N.V.
ANALOGICTECH[Advanced Analogic Technologies]
PHILIPS[Philips Semiconductors]
Part No. BGF802-20 BGF802-20_4
OCR Text ...as much as possible. Mechanical stress can occur if the bottom surface of the module and the surface of the amplifier casing (external heatsink) are not mutually flat. This, therefore, should be a consideration when mounting the module in t...
Description CDMA800 power module
From old datasheet system

File Size 89.84K  /  12 Page

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    MOTOROLA[Motorola, Inc]
MOTOROLA[Motorola Inc]
ONSEMI[ON Semiconductor]
Part No. MSC3130T1_D MSC3130T1 MSC3130 ON2375
OCR Text ...n order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of t...
Description From old datasheet system
NPN RF Amplifier Transistors Surface Mount
NPN RF Amplifier Transistor Surface Mount
CASE 318D3, STYLE 1 SC9

File Size 105.36K  /  4 Page

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    MN12864HB

List of Unclassifed Manufacturers
ETC[ETC]
Part No. MN12864HB
OCR Text ...t pipe is not designed for high stress so be careful to avoid breakage. If disposing of this product, do not break for safety concerns. Assembly: Please handle carefully to avoid surface scratching and breakage of the exhaust pipe during th...
Description Specification of Vacuum Fluorescent Display

File Size 315.49K  /  10 Page

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    SMLD12HBC7W1

Rohm
Part No. SMLD12HBC7W1
OCR Text ...ss fillers. therefore, thermal stress by soldering greatly influences its reliability. the temperature conditions for reflow soldering should therefore be set up according to the characteristic of this product. (see fig-2) number o...
Description Surface Mount Chip LED

File Size 171.77K  /  7 Page

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    Motorola Mobility Holdings, Inc.
ON Semi
MOTOROLA[Motorola, Inc]
Part No. MMFT1N10E_D ON2216 MMFT1N10E MMFT1N10
OCR Text ...The Formed Leads Absorb Thermal stress During Soldering, Eliminating the Possibility of Damage to the Die * Available in 12 mm Tape and Reel Use MMFT1N10ET1 to order the 7 inch/1000 unit reel. Use MMFT1N10ET3 to order the 13 inch/4000 unit ...
Description MEDIUM POWER TMOS FET 1 AMP 100 VOLTS 1000 mA, 100 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-261AA
N-hannel Enhancement-ode Logic Level SOT23
From old datasheet system

File Size 236.13K  /  10 Page

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    MMBT589LT1 MMBT589LT1_D ON2127

ON Semiconductor
Motorola, Inc
Part No. MMBT589LT1 MMBT589LT1_D ON2127
OCR Text ...n order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of t...
Description From old datasheet system
30 Volts 2.0 Amps PNP Transistor
High Current Surface Mount PNP Silicon Switching Transistor

File Size 109.51K  /  6 Page

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    ON Semi
Part No. MMBT2907AWT1_D ON2115
OCR Text ...n order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of t...
Description Motorola Preferred Device
From old datasheet system

File Size 72.41K  /  4 Page

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For stress Found Datasheets File :: 83428    Search Time::1.469ms    
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