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Amphenol Communications Solutions |
Part No. |
10111616-002LF
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Description |
HPCE VERT REC 52P22S
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
85674-1161LF
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Description |
5 Row Signal Header, Straight, Press-Fit, Wide body, 1 Mod
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
GSB3116175KAHR
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Description |
USB 3.2, Type A, Receptacle, Upright Reverse, 9 Pins, Shell Dip with Nickel Plating, Gold Flash, Dip 1.9mm, Blue High Temperature Housing, Tray Packaging
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
88951-161LF
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Description |
Metral® Board Connectors, Backplane Connectors, 4 Row Signal Header, Straight, Solder-to-Board, Wide body.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10111616-001LF
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Description |
HPCE VERT REC 52P22S
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Tech specs |
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Official Product Page
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Fujitsu Limited
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Part No. |
MB8116160A-70
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Description |
CMOS 1 M ×16 BIT
Fast Page Mode DRAM(CMOS 1 M ×16 位快速页面存取模式动态RAM) CMOS 1 M ?16 BIT Fast Page Mode DRAM(CMOS 1 M ?16 浣?揩??〉?㈠???ā寮????AM)
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File Size |
329.44K /
25 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54112-116162500LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54111-116102500LF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54122-116142200LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
131-4116-11D
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Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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Tech specs |
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Official Product Page
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http:// Molex Electronics Ltd.
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Part No. |
90571-1161 0905711161
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Description |
2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 16 Circuits, 0.1 μm Gold (Au) 2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 16 Circuits, 0.1 μm Gold (Au)
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File Size |
282.87K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
131-3116-11H
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Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
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Tech specs |
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Official Product Page
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Price and Availability
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