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Part No. |
UPD23C8000XGY-XXX-MJH UPD23C8000XGX-XXX UPD23C8000XG5-XXX-7JF UPD23C8000XCZ-XXX
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Description |
IGBT Modules up to 1200V SixPACK; Package: AG-EASY2B-1; IC (max): 75.0 A; VCE(sat) (typ): 1.85 V; Configuration: SixPACK; technology: IGBT4; Housing: EasyPACK 2B; IGBT Modules up to 1200V SixPACK; Package: AG-EConO2-1; IC (max): 75.0 A; VCE(sat) (typ): 1.7 V; Configuration: SixPACK; technology: IGBT3; Housing: EconoPACK 2 ; IGBT Modules up to 1200V SixPACK; Package: AG-EConO2-1; IC (max): 50.0 A; VCE(sat) (typ): 1.85 V; Configuration: SixPACK; technology: IGBT4; Housing: EconoPACK 2; IGBT Modules up to 1200V SixPACK; Package: AG-EASY2B-1; IC (max): 75.0 A; VCE(sat) (typ): 1.85 V; Configuration: SixPACK; technology: IGBT4; Housing: EasyPACK 2B; IGBT Modules up to 1200V SixPACK; Package: AG-EConO2-1; IC (max): 75.0 A; VCE(sat) (typ): 1.7 V; Configuration: SixPACK; technology: IGBT3; Housing: EconoPACK 2 ; x8 or x16 ROM (Mask Programmable) x8或x16光盘(掩模可编程
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File Size |
633.05K /
19 Page |
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it Online |
Download Datasheet
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Advanced Micro Devices, Inc. Xilinx, Inc.
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Part No. |
AMD-K6-III
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Description |
32-Bit Microprocessor Advanced RISC86 Superscalar Microarchitecture and 3D technology(32位微处理器带3D技术和高级的RISC86超标量微体系结构) AMD-K6-III - AMD-K6-III Processor Data Sheet 32-Bit Microprocessor Advanced RISC86 Superscalar Microarchitecture and 3D technology(32位微处理器带3D技术和高级的RISC86超标量微体系结构) 32位微处理器高级RISC86超标微体系结构和三维技术(32位微处理器带三维技术和高级的RISC86超标量微体系结构
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File Size |
2,819.60K /
326 Page |
View
it Online |
Download Datasheet
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Price and Availability
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