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  epoxy-encapsulated Datasheet PDF File

For epoxy-encapsulated Found Datasheets File :: 948    Search Time::0.969ms    
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    PRECI-DIP SA
PREDIP[Precid-Dip Durtal SA]
Part No. 110-93-628-41-801 110-93-624-41-801 110-93-640-41-801 110-93-308-41-801 110-93-314-41-801 110-93-316-41-801 110-93-318-41-801 110-93-320-41-801 110-93-322-41-801 110-93-324-41-801 110-93-422-41-801 110-93-632-41-801
OCR Text ...g capacitor 100 nF 20% / 50 V, epoxy encapsulated Temperature range: - 25 C to + 85 C Insertion characteristics: 4-finger standard Platings 93 Sleeve 5 m Sn Pb Clip 0.75 m Au Pin Ordering information For standard versions se...
Description Dual-in-line sockets with capacitor Open frame Solder tail 在线插座采用电容双开焊尾

File Size 44.72K  /  1 Page

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    Precid-Dip Durtal
Part No. 110-93-632-41-801 110-93-314-41-801
OCR Text ...g capacitor 100 nF 20% / 50 V, epoxy encapsulated Temperature range: - 25 C to + 85 C Insertion characteristics: 4-finger standard Platings 93 Sleeve 5 m Sn Pb Clip 0.75 m Au Pin Ordering information For standard versions se...
Description Dual-in-line sockets with capacitor Open frame Solder tail

File Size 51.25K  /  2 Page

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    IRF[International Rectifier]
Part No. IRPT1059A
OCR Text ...in figure 1, is a chip and wire epoxy encapsulated module. It houses input rectifiers, output inverter, current sense shunts and NTC thermistor. The single-phase input bridge rectifiers are rated at 800V. The inverter section employs 600V, ...
Description Power Module for 1 hp Motor Drives

File Size 225.87K  /  12 Page

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    LMX321AXK

MAXIM - Dallas Semiconductor
Maxim Integrated Products
Part No. LMX321AXK
OCR Text ...pper Solder Plate Silver-filled Epoxy Gold (1 mil dia.) Epoxy with silica filler Buildsheet # 05-2501-0167 Class UL94-V0 5-Lead SC70 Alloy 42 Solder Plate Silver-filled Epoxy Gold (1 mil dia.) Epoxy with silica filler Buildsheet # 05-2501-0...
Description PLASTIC ENCAPSULATED DEVICES

File Size 88.54K  /  9 Page

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    Maxim Integrated Products, Inc.
MAXIM[Maxim Integrated Products]
Part No. MAX4649EKA
OCR Text ...pper Solder Plate Silver-filled Epoxy Gold (1.0 mil dia.) Epoxy with silica filler Buildsheet # 05-1201-0218 Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1 IV. Die Information A. Dimens...
Description PLASTIC ENCAPSULATED DEVICES

File Size 58.83K  /  8 Page

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    MAX8538 MAX8538EEI MAX8539 MAX8537

List of Unclassifed Manufacturers
ETC[ETC]
Part No. MAX8538 MAX8538EEI MAX8539 MAX8537
OCR Text ...pper Solder Plate Silver-Filled Epoxy Gold (1.3 mil dia.) Epoxy with silica filler # 05-9000-0559 Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard J-STD-020-A: Level 1 IV. Die Information A. Dimensions: B. Pa...
Description PLASTIC ENCAPSULATED DEVICES

File Size 95.30K  /  8 Page

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    SRF-1016Z SRF-2016Z STQ-1016Z SRQ-2116Z STQ-3016Z STQ-2016Z

List of Unclassifed Manufacturers
ETC[ETC]
N.A.
Part No. SRF-1016Z SRF-2016Z STQ-1016Z SRQ-2116Z STQ-3016Z STQ-2016Z
OCR Text ... electrically conductive silver epoxy. The die is mounted directly to the exposed paddle to provide a low thermal resistance path for heat conduction out of the package. Figure 1 : Image of TSSOP -16 Exposed Paddle Plastic Package STQ...
Description RELIABILITY QUALIFICATION REPORT

File Size 212.99K  /  9 Page

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    EXAR[Exar Corporation]
Part No. XRT5683A XR-T5683AIP XR-T5683AID
OCR Text ...ifications, are wound on small, epoxy-encapsulated, Schott-Part Number 24443 24444 Nominal Inductance 48Hy with CT 5Hy with CT torroid cores. They differ in physical size, operating temperature range and voltage isolation. These transfo...
Description PCM LINE INTERFACE CHIP

File Size 109.37K  /  12 Page

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    1504-240C 1504-40C 1504-270E 1504-200B 1504-200D 1504-20B 1504-20C 1504-220G 1504-225D 1504-100C 1504-100D 1504-180E 150

DATADELAY[Data Delay Devices Inc.]
DATADELAY[Data Delay Devices, Inc.]
Part No. 1504-240C 1504-40C 1504-270E 1504-200B 1504-200D 1504-20B 1504-20C 1504-220G 1504-225D 1504-100C 1504-100D 1504-180E 1504 1504-300C 1504-300D 1504-300G 1504-40B 1504-30B 1504-30A 1504-30E 1504-450E 1504-450G 1504-480F 1504-375D 1504-500D 1504-125D 1504-120B 1504-120C 1504-120E 1504-120F 1504-45A 1504-500G 1504-50B 1504-50D 1504-50G 1504-100G 1504-600G 1504-240E 1504-XXZ 1504-1000G 1504-100A 1504-100B 1504-10B 1504-140C 1504-150B 1504-150D 1504-150E 1504-150G 1504-160C 1504-160F 1504-180C 1504-200F 1504-200G 1504-20A 1504-240F 1504-250B 1504-250G 1504-25A 1504-25D 1504-320F 1504-360E 1504-360F 1504-380G 1504-400C 1504-400G 1504-40A 1504-40F 1504-600E 1504-600F 1504-60A 1504-60B 1504-60C 1504-60E 1504-750G 1504-75A 1504-800F 1504-80B 1504-80C 1504-80F 1504-90E
OCR Text ...nce Standard 16-pin DIP package Epoxy encapsulated Meets or exceeds MIL-D-23859C IN N/C N/C N/C OUT N/C N/C GND 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 N/C N/C N/C N/C N/C N/C N/C N/C data 3 (R) delay devices, inc. PACKAGE 1504-xxz xx ...
Description FIXED DIP DELAY LINE TD/TR = 5

File Size 29.86K  /  2 Page

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    MAXIM - Dallas Semiconductor
MAXIM[Maxim Integrated Products]
Part No. MAX5028 MAX5027 MAX5026EUT MAX5025 MAX5026
OCR Text ...per Solder Plate Non-Conductive Epoxy Gold (1 mil dia.) Epoxy with silica filler # 05-1301-0024 Class UL94-V0 Level 1 IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Widt...
Description 500kHz 36V Output SOT23 PWM Step-Up DC-DC Converters
RELIABILITY REPORT FOR MAX5026EUT PLASTIC ENCAPSULATED DEVICES

File Size 88.71K  /  8 Page

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For epoxy-encapsulated Found Datasheets File :: 948    Search Time::0.969ms    
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