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For organic Found Datasheets File :: 1494 Search Time::1.719ms
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				AVX Corporation
Part No.	CK05BX331
OCR Text	...mixing the ceramic powder in an organic binder (slurry) and casting it by one technique or another into thin layers typically ranging from about 3 mils in thickness down to 1 mil or thinner. Metal electrodes are deposited onto the green cer...
Description	Multilayer Ceramic Leaded Capacitors
File Size	1,098.06K / 72 Page	View it Online	Download Datasheet

				TriQuint Semiconductor, Inc.
Part No.	TGA1319A
OCR Text	... critical during auto placement organic attachment can be used in low-power applications curing should be done in a convection oven; proper exhaust is a safety concern microwave or radiant curing should not be used because of differential h...
Description	Ka Band Low Noise Amplifier Ka波段低噪声放大器
File Size	310.38K / 3 Page	View it Online	Download Datasheet

				TriQuint Semiconductor, Inc.
Part No.	TGA1307 TGA1307-EPU
OCR Text	... critical during auto placement organic attachment can be used in low-power applications curing should be done in a convection oven; proper exhaust is a safety concern microwave or radiant curing should not be used because of differential h...
Description	Ka Band Low Noise Amplifier 23000 MHz - 29000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
File Size	733.57K / 7 Page	View it Online	Download Datasheet

				MITSUBISHI[Mitsubishi Electric Semiconductor] Mitsubishi Electric Corporation
Part No.	FU-450SDF-FW1M2
OCR Text	...use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the generation of corrosive gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will no...
Description	1.31 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL 1.31 m DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL 1.31 レm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
File Size	59.12K / 3 Page	View it Online	Download Datasheet

				Mitsubishi Electric, Corp. Mitsubishi Electric Corporation MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No.	FU-450SDF-FW41M33B FU-450SDF-FW41MX3B
OCR Text	...use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the generation of corrosive gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will no...
Description	1.31 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL 1.31微米半导体激光器与单模光纤尾纤模
File Size	76.78K / 4 Page	View it Online	Download Datasheet

				MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No.	FU-650SDF-FW1M13 FU-650SDF-FW1MXX FU-650SDF-FW1M12 FU-650SDF-FW1M14 FU-650SDF-FW1M15 FU-650SDF-FW1M16 FU-650SDF-FW1M17 FU-650SDF-FW1M18 FU-650SDF-FW1M19 FU-650SDF-FW1M32 FU-650SDF-FW1M33 FU-650SDF-FW1M34 FU-650SDF-FW1M35 FU-650SDF-FW1M36 FU-650SDF-FW1M37 FU-650SDF-FW1M38 FU-650SDF-FW1M39
OCR Text	...use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the generation of corrosive gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will no...
Description	1.5 μm CWDM DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL 1.5 レm CWDM DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL 1.5 m CWDM DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
File Size	78.61K / 5 Page	View it Online	Download Datasheet

				MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No.	FU-650SDF-XW5M1 FU-650SDF-FW5M1 FU-650SDF-SW5M1
OCR Text	...use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the generation of corrosive gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will no...
Description	1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
File Size	78.75K / 4 Page	View it Online	Download Datasheet

				Nais(Matsushita Electric Works)
Part No.	AQY221N2VW AQY221N2V AQY221N2VY
OCR Text	...patibility Dip cleaning with an organic solvent is recommended for removal of solder flux, dust, etc. Select a cleaning solvent from the following table. If ultrasonic cleaning is used, the severity of factors such as frequency, output powe...
Description	RF (Radio Frequency) C x R 10 SSOP Type
File Size	115.41K / 6 Page	View it Online	Download Datasheet

				SKYWORKS
Part No.	AV131-315
OCR Text	...internal elements affixed to an organic BT substrate. Electrical Specifications at 25C Parameter AMPS Frequency Range (BW) GSM Frequency Range (BW) Control Voltage (CV) Range Insertion Loss in BW Attenuation Range VSWR in BW IP3 IM3 900...
Description	HIP3 Variable Attenuator for AMPS and GSM Base Stations
File Size	255.51K / 4 Page	View it Online	Download Datasheet

For organic Found Datasheets File :: 1494 Search Time::1.719ms
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